US4940181A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pad grid array for receiving a solder bumped chip carrier
Assignee: Motorola Solutions Inc
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Filing: 1989-04-06
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Granted: 1990-07-10
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Expires: 2009-04-06
Abstract
Abstract A pad grid array comprises an array of cavities (12) formed in a circuit carrying substrate (10) that are metallized (18, 20, and 22) to provide electrical conductivity. The metallized cavities are preferably hemispherical in shape and approximately the size of the solder bumps (30) coupled to a solder bumped chip carrier (28) that will be mounted thereon. Flux (26) is applied to each of the metallized cavities before positioning the solder bumped chip (28) carrier over the pad grid array. Proper mounting can be detected by tactile sensing in either human or robotic assemblers when the solder bumps "drop" into the metallized cavities.
Inventors
- 👤 Frank J. Juskey, Jr.
- 👤 Barry M. Miles
- 👤 Anthony B. Suppelsa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:00
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; B23K1/203; H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09654; H05K2201/09745; H05K2201/09818; H05K2201/09827; H05K2201/09863; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/04; H05K2203/048; H05K3/46; H05K3/4644; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
85 words
A method for attaching a solder bumped member to a substrate, comprising the steps of: (A) forming cavities in the substrate, said cavities being approximately two-third the size of the solder bumps: (B) applying metal to said cavities: (C) providing an effective amount of solder flux on said metallized cavities: (D) positioning the solder bumped member so as to align the solder bumps within said metallized cavities; (E) heating said solder flux so as to electrically couple said metallized cavities to a respective solder bump.
Claim 2
Independent Claim
85 words
A method for attaching a solder bumped member to a substrate, comprising the steps of: (A) forming cavities in the substrate, said cavities being approximately two-third the size of the solder bumps: (B) applying metal to said cavities: (C) providing an effective amount of solder flux on said metallized cavities: (D) positioning the solder bumped member so as to align the solder bumps within said metallized cavities; (E) heating said solder flux so as to electrically couple said metallized cavities to a respective solder bump.
Claim 3
Dependent Claim
35 words
The method of claim 1, wherein step (A) comprises the steps of: (A1) forming cavities in a substrate, said cavities being approximately two-third the size of the solder bumps; (A2) applying metal to said cavities.
Claim 4
Dependent Claim
17 words
The method of claim 1, wherein step (A) comprises: forming said cavities in said substrate via drilling.
Claim 5
Dependent Claim
17 words
The method of claim 1, wherein step (A) comprises: forming said cavities in said substrate via molding.
Claim 6
Dependent Claim
39 words
The method of claim 1, wherein step (B) consists of the steps of: (B1) applying a copper layer to said cavities; (B2) applying a nickel layer over said copper layer; (B3) applying a gold layer over said nickel layer.
Claim 7
Dependent Claim
23 words
The method of claim 1, which includes the step of: (C) applying metal to said substrate to form electrical runners on said substrate.
Claim 8
Dependent Claim
29 words
The method of claim 1, wherein step (D) comprises: positioning the solder bumped member via an automated assembler so as to align the solder bumps within said metallized cavities.
Claim 9
Dependent Claim
29 words
The method of claim 1, wherein step (D) comprises: positioning the solder bumped member via a robotic assembler so as to align the solder bumps within said metallized cavities.
Claim 10
Independent Claim
40 words
A method for providing a substate to receive a solder bump member, comprising the steps of: (A) forming substantially hemispherical cavities ina substrate, said cavities being approximately two-thirds the size of the solder bumps; (B) applying metal to said cavities.
Claim 11
Independent Claim
40 words
A method for providing a substate to receive a solder bump member, comprising the steps of: (A) forming substantially hemispherical cavities ina substrate, said cavities being approximately two-thirds the size of the solder bumps; (B) applying metal to said cavities.
Claim 12
Dependent Claim
17 words
The method of claim 9, wherein step (A) comprises: forming said cavities in said substrate via drilling.
Claim 13
Dependent Claim
17 words
The method of claim 9, wherein step (A) comprises: forming said cavities in said substrate via molding.
Claim 14
Dependent Claim
38 words
The method of claim 9, wherein step (B) comprises the steps of: (B1) applying a copper layer to said cavities; (B2) applying a nickel layer over said copper layer; (B3) applying a gold layer over said nickel layer.
Claim 15
Dependent Claim
23 words
The method of claim 9, which includes the step of: (C) applying metal to said substrate to form electrical runners on said substrate.
Claim 16
Dependent Claim
40 words
A circuit carrying substate for receiving a solder bumped member, comprising: a substrate having a plurality of metallized cavities formed therein, each metallized cavity constructed and arranged in a substantially hemispherical shape so as to receive the solder bumped member.
Claim 17
Dependent Claim
40 words
A circuit carrying substate for receiving a solder bumped member, comprising: a substrate having a plurality of metallized cavities formed therein, each metallized cavity constructed and arranged in a substantially hemispherical shape so as to receive the solder bumped member.
Claim 18
Dependent Claim
15 words
The circuit carrying substrate of claim 14, wherein said plurality of metallized cavities are hemispherical.
Claim 19
Dependent Claim
26 words
The circuit carrying substrate of claim 14, wherein said plurality of metallized cavities are constructed and arranged to couple with electrical runners formed within the substrate.
Claim 20
Dependent Claim
22 words
The circuit carrying substrate of claim 14, wherein said plurality of metallized cavities are two-thirds the size of the solder bumped member.
Claim 21
Dependent Claim
20 words
The circuit carrying substrate of claim 14, wherein said plurality of metallized cavities are arranged to lie in a circle.
Claim 22
Dependent Claim
19 words
The circuit carrying substrate of claim 14, wherein said plurality of metallized cavities are arranged to form a octagon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-07-09 | 1994-01-08 | 1994-07-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-07-09 | 1998-01-08 | 1998-07-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-07-09 | 2002-01-08 | 2002-07-10 | $7700.00 | Window Closed / Lapsed |