US4081601A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding contact members to circuit boards
Assignee: AT&T Inc
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Filing: 1976-04-02
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Granted: 1978-03-28
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Expires: 1996-04-02
Abstract
Abstract A circuit pattern on a circuit board has at least one contact finger termination to be coupled to a connector contact. A conductive overlay is solder-bonded to the base metal of the contact finger. The overlay is a composite structure of a number of layers. A base layer of copper faces, and is solder-bonded, to the base. A surface layer of gold provides a contact area for the connector contact. A layer of nickel between the base layer and the surface layer acts as a barrier layer to prevent copper from migrating through the surface layer to deposit as a contaminant on the surface of the contact area.
Inventors
- 👤 Donald Dinella
- 👤 Richard M. Kovaric
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 06:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H05K3/4015; B; B23; B23K; B23K35/00; B23K35/001; B23K35/007; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2203/00; H05K2203/01; H05K2203/0195; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
132 words
A circuit board including a dielectric substrate and a circuit pattern of a conductive base formed in adhesive contact on the substrate, the pattern including at least one contact finger having a top surface area for making contact with a connector contact, wherein an improvement comprises: a conductive overlay solder-bonded over substantially the entire contact finger top surface area, the overlay including a layer of copper, the copper layer facing and being solder-bonded to the base, a surface layer of gold having a top surface essentially free of solder, the gold providing a contact area for the connector contact, and a layer of nickel located adjacent and between the surface layer and the copper layer for preventing the copper from migrating through the surface layer to the surface of the contact area.
Claim 2
Dependent Claim
132 words
A circuit board including a dielectric substrate and a circuit pattern of a conductive base formed in adhesive contact on the substrate, the pattern including at least one contact finger having a top surface area for making contact with a connector contact, wherein an improvement comprises: a conductive overlay solder-bonded over substantially the entire contact finger top surface area, the overlay including a layer of copper, the copper layer facing and being solder-bonded to the base, a surface layer of gold having a top surface essentially free of solder, the gold providing a contact area for the connector contact, and a layer of nickel located adjacent and between the surface layer and the copper layer for preventing the copper from migrating through the surface layer to the surface of the contact area.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-03-27 | 1981-09-26 | 1982-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-03-27 | 1985-09-26 | 1986-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-03-27 | 1989-09-26 | 1990-03-28 | $7700.00 | Window Closed / Lapsed |