USRE29325E
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic power package
Assignee: 3M Co
•
Filing: 1973-07-16
•
Granted: 1977-07-26
•
Expires: 1993-07-16
Abstract
Abstract Hermetic power packages are devices in which power-consuming chip devices or integrated circuits which generate considerable amounts of heat can be mounted and which provide thermally integral heat sinks. .Iadd.Terminal and lead-bearing alumina rings or collars, unified by firing, provide hermetically sealed insulated buried leads. .Iaddend. .Iadd.
Inventors
- 👤 Billy M. Hargis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 04:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/259; H10W40/70; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
94 words
A package adapted for a power-consuming chip device comprising: A. a metallic heat conductive base B. a low expansion metallic shim brazed to said base and, C. a .Iadd.terminal-bearing and .Iaddend.lead-bearing alumina ceramic .Iadd.ring or .Iaddend.collar .Iadd.having a central opening and .Iaddend.having metallic surfaces at least partially covering the top and bottom surfaces.[.,.]. .Iadd.and external terminals connected to internal terminals within the central opening by buried leads, .Iaddend.said .Iadd.ring or .Iaddend.collar being sealed to said base by brazing to said shim and surrounding an area of said base adapted to receive said chip device.
Claim 2
Dependent Claim
94 words
A package adapted for a power-consuming chip device comprising: A. a metallic heat conductive base B. a low expansion metallic shim brazed to said base and, C. a .Iadd.terminal-bearing and .Iaddend.lead-bearing alumina ceramic .Iadd.ring or .Iaddend.collar .Iadd.having a central opening and .Iaddend.having metallic surfaces at least partially covering the top and bottom surfaces.[.,.]. .Iadd.and external terminals connected to internal terminals within the central opening by buried leads, .Iaddend.said .Iadd.ring or .Iaddend.collar being sealed to said base by brazing to said shim and surrounding an area of said base adapted to receive said chip device.
Claim 3
Dependent Claim
39 words
A package adapted for a power-consuming chip device according to claim 1 having a substantially central opening in the low expansion metallic shim approximately corresponding to the area surrounded in the .Iadd.terminal-bearing and .Iaddend.lead-bearing .Iadd.alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar.
Claim 4
Dependent Claim
53 words
A package adapted for a power-consuming chip device according to claim 1, having a bilaterally metal-coated beryllia chip attached to the base within the area surrounded by the .Iadd.terminal-bearing and lead-bearing alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar and adapted for attachment of a chip device to the base with electrical insulation and thermal conduction.
Claim 5
Dependent Claim
44 words
A package adapted for a power-consuming chip device according to claim 1 wherein a low expansion metallic ring is attached to the upper surface of the .Iadd.terminal-bearing and lead-bearing alumina .Iaddend.ceramic .Iadd.ring or .Iaddend.collar to provide a base for attachment of a covering lid.
References Cited (Backward Citations)
US3515952A
Cited
US3479570A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-07-25 | 1981-01-24 | 1981-07-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-07-25 | 1985-01-24 | 1985-07-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-07-25 | 1989-01-24 | 1989-07-26 | $7700.00 | Window Closed / Lapsed |