US6091603A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Customizable lid for improved thermal performance of modules using flip chips
Assignee: International Business Machines Corp
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Filing: 1999-09-30
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Granted: 2000-07-18
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Expires: 2019-09-30
Abstract
Abstract Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.
Inventors
- 👤 Glenn G. Daves
- 👤 David L. Edwards
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:02
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/70; H10W40/77; H10W76/00; H10W76/10; H10W76/12; H10W72/351; H10W72/352; H10W72/381; H10W72/851; H10W72/874; H10W72/877; H10W76/60; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
81 words
A lid structure for a module containing at least one integrated circuit chip, said lid structure comprising (a) a lid member adapted to be sealed to said module, (b) a primary heat dissipation path from said chip(s) contained in said module to said lid member, said heat dissipation path comprising: (i) a solid customized understructure extending from said lid member toward said chip contained in said module, and (ii) a thermally conductive, compliant material between said customized understructure and said chip.
Claim 2
Dependent Claim
81 words
A lid structure for a module containing at least one integrated circuit chip, said lid structure comprising (a) a lid member adapted to be sealed to said module, (b) a primary heat dissipation path from said chip(s) contained in said module to said lid member, said heat dissipation path comprising: (i) a solid customized understructure extending from said lid member toward said chip contained in said module, and (ii) a thermally conductive, compliant material between said customized understructure and said chip.
Claim 3
Dependent Claim
27 words
The lid structure of claim 1 wherein said heat dissipation path further comprises a rigid thermally conductive spacer between said solid customized understructure and said compliant material.
Claim 4
Dependent Claim
29 words
The lid structure of claim 1 wherein said customized understructure comprises a material selected from the group consisting of solder, thermally conductive thermoplastic resin, and thermally conductive thermoset resin.
Claim 5
Dependent Claim
25 words
The lid structure of claim 1 wherein said lid member comprises a material selected from the group consisting of metals, metal alloys, ceramics, and composites.
Claim 6
Dependent Claim
13 words
The lid structure of claim 3 wherein said customized understructure comprises a solder.
Claim 7
Dependent Claim
106 words
An electronic module housing one or more integrated circuit chips, said module comprising: (a) a substrate, (b) at least one integrated circuit chip mounted on said substrate, (c) a lid comprising a lid member sealed to said substrate, said lid and said substrate defining a space for containing said integrated circuit chip(s), and (d) a primary heat dissipation path from said chip(s) contained in said space to said lid member, said heat dissipation path comprising: (i) a solid customized understructure extending from said lid member toward said chip contained in said module, and (ii) a thermally conductive, compliant material between said customized understructure and said chip.
Claim 8
Dependent Claim
106 words
An electronic module housing one or more integrated circuit chips, said module comprising: (a) a substrate, (b) at least one integrated circuit chip mounted on said substrate, (c) a lid comprising a lid member sealed to said substrate, said lid and said substrate defining a space for containing said integrated circuit chip(s), and (d) a primary heat dissipation path from said chip(s) contained in said space to said lid member, said heat dissipation path comprising: (i) a solid customized understructure extending from said lid member toward said chip contained in said module, and (ii) a thermally conductive, compliant material between said customized understructure and said chip.
Claim 9
Dependent Claim
26 words
The module of claim 6 wherein said heat dissipation path further comprises a rigid thermally conductive spacer between said solid customized understructure and said compliant material.
Claim 10
Dependent Claim
28 words
The module of claim 6 wherein said customized understructure comprises a material selected from the group consisting of solder, thermally conductive thermoplastic resin, and thermally conductive thermoset resin.
Claim 11
Dependent Claim
24 words
The module of claim 6 wherein said lid member comprises a material selected from the group consisting of metals, metal alloys, ceramics, and composites.
Claim 12
Dependent Claim
12 words
The module of claim 6 wherein said customized understructure comprises a solder.
Claim 13
Dependent Claim
29 words
The module of claim 6 comprising a plurality of said integrated chips located in said space, said primary heat dissipation path being from at least one of said chips.
Claim 14
Dependent Claim
30 words
The module of claim 11 comprising a plurality of primary heat dissipation paths such that said primary heat dissipation path exists for each of said plurality of integrated circuit chips.
Claim 15
Dependent Claim
35 words
The module of claim 6 wherein said module further comprises a plurality of electrical contact elements located between said chip and said substrate wherein said chip is mounted on said substrate through said contact elements.
Claim 16
Dependent Claim
11 words
The module of claim 13 wherein said contact elements comprise solder.
Claim 17
Dependent Claim
23 words
The module of claim 6 wherein said thermally conductive, compliant material has a thickness along said path of about 12 mils or less.
Claim 18
Dependent Claim
24 words
The module of claim 15 wherein said thermally conductive, compliant material has a thickness along said path of about 4 mils to 6 mils.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-18 | 2004-01-17 | 2004-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-18 | 2008-01-17 | 2008-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-18 | 2012-01-17 | 2012-07-18 | $7700.00 | Window Closed / Lapsed |