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US5819401A Expired / Lapsed US ⏱️ 0.0 years remaining

Metal constrained circuit board side to side interconnection technique

Assignee: Texas Instruments Inc
•
Filing: 1997-04-24
•
Granted: 1998-10-13
•
Expires: 2017-04-24
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Abstract

Abstract A method of constructing a printed circuit board module and the module which comprises providing a substrate core having a first aperture extending therethrough and a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to the substrate core and having a second aperture therethrough aligned with the first aperture. An electrically conductive member having an electrically insulating member is disposed around the electrically conductive member. The electrically conductive member having an electrically insulating member disposed therearound is positioned so that the electrically insulating member is disposed in the first aperture and the electrically conductive member extends into the second aperture of each of the printed circuit boards. The printed circuit boards are secured to the substrate core to lock the electrically insulating member in the first aperture. Solder is disposed within each of the second apertures electrically connecting the electrically conductive member to at least one electrically conductive layer of each of the pair of printed circuit boards or solder is disposed over at least one electrically conductive layer of each printed circuit board electrically connecting the electrically conductive member to at least one electrically conductive member. The electrically conductive member is preferably Invar/copper or copper.

Inventors

  • 👤 William R. Johannes
  • 👤 Patrick H. O'Neill
  • 👤 David M. Mendez

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 09:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/368; H05K3/46; H05K3/4611; H05K3/4641; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/096; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/4623; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 137 words
A method of constructing a printed circuit board module (a) providing a substrate core having a first aperture extending therethrough; (b) providing a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to said substrate core and having a second aperture therethrough aligned with said first aperture; (c) providing an electrically conductive member having an electrically insulating member disposed around said electrically conductive member; (d) positioning said electrically conductive member having an electrically insulating member disposed around said electrically conductive member so that said electrically insulating member is disposed in said first aperture and said electrically conductive member extends into said second aperture of each of said printed circuit boards; and (e) securing said printed circuit boards to said substrate core to lock said electrically insulating member in said first aperture.
Claim 2
Independent Claim 137 words
A method of constructing a printed circuit board module (a) providing a substrate core having a first aperture extending therethrough; (b) providing a pair of printed circuit boards, each board having at least one electrically conductive layer, secured to said substrate core and having a second aperture therethrough aligned with said first aperture; (c) providing an electrically conductive member having an electrically insulating member disposed around said electrically conductive member; (d) positioning said electrically conductive member having an electrically insulating member disposed around said electrically conductive member so that said electrically insulating member is disposed in said first aperture and said electrically conductive member extends into said second aperture of each of said printed circuit boards; and (e) securing said printed circuit boards to said substrate core to lock said electrically insulating member in said first aperture.
Claim 3
Dependent Claim 41 words
The method of claim 1 further including the step of disposing solder within each of said second apertures electrically connecting said electrically conductive member to said at least one electrically conductive layer of each of said pair of printed circuit boards.
Claim 4
Dependent Claim 45 words
The method of claim 1 further including the step of disposing solder over one of said at least one electrically conductive layer of each said printed circuit board electrically connecting said electrically conductive member to said one of said at least one electrically conductive member.
Claim 5
Dependent Claim 16 words
The method of claim 1 wherein said electrically conductive member is one of Invar/copper or copper.
Claim 6
Dependent Claim 16 words
The method of claim 2 wherein said electrically conductive member is one of Invar/copper or copper.
Claim 7
Dependent Claim 16 words
The method of claim 3 wherein said electrically conductive member is one of Invar/copper or copper.
Claim 8
Dependent Claim 16 words
The method of claim 1 wherein said electrically insulating member is a compatible electrically insulating material.
Claim 9
Dependent Claim 16 words
The method of claim 2 wherein said electrically insulating member is a compatible electrically insulating material.
Claim 10
Dependent Claim 16 words
The method of claim 3 wherein said electrically insulating member is a compatible electrically insulating material.
Claim 11
Dependent Claim 16 words
The method of claim 4 wherein said electrically insulating member is a compatible electrically insulating material.
Claim 12
Dependent Claim 16 words
The method of claim 5 wherein said electrically insulating member is a compatible electrically insulating material.
Claim 13
Dependent Claim 16 words
The method of claim 6 wherein said electrically insulating member is a compatible electrically insulating material.

References Cited (Backward Citations)

US4591220A Cited
US5227588A Cited
US5281771A Cited
US5601678A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-10-12 2002-04-13 2002-10-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-10-12 2006-04-13 2006-10-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-10-12 2010-04-13 2010-10-13 $7700.00 Window Closed / Lapsed

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