US5281771A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer wiring board, interlevel connector, and method for making same
Assignee: Xerox Corp
•
Filing: 1993-05-28
•
Granted: 1994-01-25
•
Expires: 2013-05-28
Abstract
Abstract An interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.
Inventors
- 👤 Joseph A. Swift
- 👤 Stanley J. Wallace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 01:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/368; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05K2201/00; H05K2201/02; H05K2201/0275; H05K2201/0281; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K3/30; H05K3/32; H05K3/325
Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
213 words
A multilayer wiring assembly, comprising: first and second wiring boards having respective conductive portions to be interconnected; a dielectric substrate having top and bottom surfaces adjacent to which said first and second wiring boards are locatable, and having through holes at locations corresponding to locations of said conductive portions of said first and second wiring boards to be interconnected; and a plurality of interlevel connectors, each said interlevel connector being located in a respective through hole, for connecting said conductive portions of said first and second wiring boards, each said interlevel connector comprising: a composite pultruded member having a first and second end, said first end extending above the top surface of said dielectric substrate and said second end extending below the bottom surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with said first and second conductive portions of said first and second wiring boards to be interconnected when said first and second wiring boards are located adjacent to said dielectric substrate.
Claim 2
Dependent Claim
213 words
A multilayer wiring assembly, comprising: first and second wiring boards having respective conductive portions to be interconnected; a dielectric substrate having top and bottom surfaces adjacent to which said first and second wiring boards are locatable, and having through holes at locations corresponding to locations of said conductive portions of said first and second wiring boards to be interconnected; and a plurality of interlevel connectors, each said interlevel connector being located in a respective through hole, for connecting said conductive portions of said first and second wiring boards, each said interlevel connector comprising: a composite pultruded member having a first and second end, said first end extending above the top surface of said dielectric substrate and said second end extending below the bottom surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with said first and second conductive portions of said first and second wiring boards to be interconnected when said first and second wiring boards are located adjacent to said dielectric substrate.
Claim 3
Dependent Claim
15 words
The multilayer wiring assembly of claim 1 wherein said host material comprises a conductive material.
Claim 4
Dependent Claim
15 words
The multilayer wiring assembly of claim 1 wherein said host material comprises an insulating material.
Claim 5
Dependent Claim
15 words
The multilayer wiring assembly of claim 3 wherein said insulating material comprises an organic compound.
Claim 6
Dependent Claim
15 words
The multilayer wiring assembly of claim 4 wherein said organic compound is a polyimide composition.
Claim 7
Dependent Claim
30 words
The multilayer wiring assembly of claim 1 wherein said host material comprises a material which will volatilize rapidly and cleanly upon direct exposure to a laser beam of predetermined energy.
Claim 8
Dependent Claim
29 words
The multilayer wiring assembly of claim 6 wherein said host polymer comprises a polymer selected from the group consisting of low molecular weight polyethylene, polypropylene, polystyrene, polyvinylchloride, and polyurethane.
Claim 9
Dependent Claim
15 words
The multilayer wiring assembly of claim 1 wherein said electrically conductive fibers are carbon fibers.
Claim 10
Dependent Claim
16 words
The multilayer wiring assembly of claim 1 wherein said pultrusions are of circular cross sectional shape.
Claim 11
Dependent Claim
20 words
The multilayer wiring assembly of claim 1 wherein at least one of said wiring boards is a printed circuit board.
Claim 12
Dependent Claim
20 words
The multilayer wiring assembly of claim 1 wherein at least one of said wiring boards is a printed wiring board.
Claim 13
Dependent Claim
22 words
The multilayer wiring board of claim 1 wherein at least one of said wiring boards is removably locatable adjacent said dielectric substrate.
Claim 14
Dependent Claim
48 words
The multilayer wiring assembly of claim 1 wherein at least one of said wiring boards comprises a substrate of an electrically insulating polymer matrix doped with an electrically insulating fibrous filler being heat converted to an electrically conductive fibrous filler to form the conductive portion to be interconnected.
Claim 15
Dependent Claim
182 words
A connector for interconnecting conductors of a conductor carrying substrate to conductors of a device, comprising: a dielectric substrate having a first surface for placement adjacent said conductor carrying substrate and a second surface for placement adjacent said device, and having a plurality of through holes; and a plurality of connectors, each said connector being located in a respective through hole, for connecting said conductors of said conductor carrying substrate to said conductors of said device, each said connector comprising: a composite pultruded member having a first and second end, said first end extending beyond the first surface of said dielectric substrate, said second end extending beyond the second surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with the conductors of said conductor carrying substrate and the conductors of said device.
Claim 16
Dependent Claim
182 words
A connector for interconnecting conductors of a conductor carrying substrate to conductors of a device, comprising: a dielectric substrate having a first surface for placement adjacent said conductor carrying substrate and a second surface for placement adjacent said device, and having a plurality of through holes; and a plurality of connectors, each said connector being located in a respective through hole, for connecting said conductors of said conductor carrying substrate to said conductors of said device, each said connector comprising: a composite pultruded member having a first and second end, said first end extending beyond the first surface of said dielectric substrate, said second end extending beyond the second surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with the conductors of said conductor carrying substrate and the conductors of said device.
Claim 17
Dependent Claim
14 words
The connector of claim 14 wherein said host material comprises an electrically conductive material.
Claim 18
Dependent Claim
13 words
The connector of claim 14 wherein said host material comprises an insulating material.
Claim 19
Dependent Claim
28 words
The connector of claim 14 wherein said host material comprises a polymer which will volatilize rapidly and cleanly upon direct exposure to a laser beam of predetermined energy.
Claim 20
Dependent Claim
14 words
The connector of claim 14 wherein said insulating host material comprises an organic compound.
Claim 21
Dependent Claim
12 words
The connector of claim 18 wherein said organic compound is a polymer.
Claim 22
Dependent Claim
12 words
The connector of claim 19 wherein said polymer is a polyimide composition.
Claim 23
Dependent Claim
26 words
The connector of claim 19 wherein said polymer is a polymer selected from the group consisting of low molecular weight polyethylene, polypropylene, polystyrene, polyvinylchloride, and polyurethane.
Claim 24
Dependent Claim
15 words
The connector of claim 14 wherein said conductor carrying substrate is a printed circuit board.
Claim 25
Dependent Claim
15 words
The connector of claim 14 wherein said conductor carrying substrate is a printed wiring board.
Claim 26
Dependent Claim
17 words
The connector of claim 14 wherein said conductor carrying substrate is removably locatable adjacent said dielectric substrate.
Claim 27
Dependent Claim
42 words
The connector of claim 14 wherein said conductor carrying substrate is a substrate having an electrically insulating polymer matrix doped with an electrically insulating fibrous filler being heat converted to an electrically conductive fibrous filler to form the conductors to be interconnected.
Claim 28
Dependent Claim
11 words
The connector of claim 14 wherein said fibers are carbon fibers.
Claim 29
Dependent Claim
14 words
The connector of claim 14 wherein said pultrusions are of circular cross sectional shape.
Claim 30
Dependent Claim
189 words
A multilayer wiring board, comprising: first and second wiring boards having respective conductive portions; a dielectric substrate having top and bottom surfaces to which said first and second wiring boards are affixed, and having through holes at locations corresponding to locations of said conductive portions of said first and second wiring boards to be interconnected; and a plurality of interconnectors, each said interconnector being located in a respective through hole, for connecting the conductive portions of said first and second wiring boards, each said interconnector comprising: a composite pultruded member having a first and second end, said first end extending above the top surface of said dielectric substrate and said second end extending below the bottom surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with said conductive portions of said first and second wiring boards to be connected.
Claim 31
Dependent Claim
189 words
A multilayer wiring board, comprising: first and second wiring boards having respective conductive portions; a dielectric substrate having top and bottom surfaces to which said first and second wiring boards are affixed, and having through holes at locations corresponding to locations of said conductive portions of said first and second wiring boards to be interconnected; and a plurality of interconnectors, each said interconnector being located in a respective through hole, for connecting the conductive portions of said first and second wiring boards, each said interconnector comprising: a composite pultruded member having a first and second end, said first end extending above the top surface of said dielectric substrate and said second end extending below the bottom surface of said dielectric substrate; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from said first end to said second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament contact with said conductive portions of said first and second wiring boards to be connected.
Claim 32
Dependent Claim
16 words
The multilayer wiring board of claim 28 wherein said host material comprises an electrically conducting material.
Claim 33
Dependent Claim
16 words
The multilayer wiring board of claim 28 wherein said host material comprises an electrically insulating material.
Claim 34
Dependent Claim
15 words
The multilayer wiring board of claim 28 wherein said insulating component comprises an organic compound.
Claim 35
Dependent Claim
15 words
The multilayer wiring board of claim 31 wherein said organic compound is a polyimide composition.
Claim 36
Dependent Claim
25 words
The multilayer wiring board of claim 28 wherein said host material volatilizes rapidly and cleanly upon direct exposure to a laser beam of predetermined energy.
Claim 37
Dependent Claim
29 words
The multilayer wiring board of claim 28 wherein said host polymer comprises a polymer selected from the group consisting of low molecular weight polyethylene, polypropylene, polystyrene, polyvinylchloride, and polyurethane.
Claim 38
Dependent Claim
16 words
The multilayer wiring board structure of claim 28 wherein said electrically conductive fibers are carbon fibers.
Claim 39
Dependent Claim
16 words
The multilayer wiring board of claim 28 wherein said pultrusions are of circular cross sectional shape.
Claim 40
Dependent Claim
98 words
An interlevel connector, comprising: a dielectric substrate having a plurality through holes; and a plurality of interlevel connectors, each said interlevel connector being located in a respective through hole, each said interlevel connector comprising: a composite pultruded member having a first and second end; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from the first end to the second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament connection.
Claim 41
Dependent Claim
98 words
An interlevel connector, comprising: a dielectric substrate having a plurality through holes; and a plurality of interlevel connectors, each said interlevel connector being located in a respective through hole, each said interlevel connector comprising: a composite pultruded member having a first and second end; said composite pultruded member including a plurality of electrically conductive fibers embedded in a host material, said fibers being continuous from the first end to the second end of said composite pultruded member; and said first and second ends being fibrillated to form a densely distributed brush-like structure for providing conductive dense filament connection.
Claim 42
Dependent Claim
15 words
The interlevel connector of claim 37 wherein said host material comprises an electrical conducting material.
Claim 43
Dependent Claim
15 words
The interlevel connector of claim 37 wherein said host material comprises an electrically insulating material.
Claim 44
Dependent Claim
15 words
The interlevel connector structure of claim 39 wherein said insulating component comprises an organic compound.
Claim 45
Dependent Claim
15 words
The interlevel connector structure of claim 40 wherein said organic compound is a polyimide composition.
Claim 46
Dependent Claim
25 words
The interlevel connector structure of claim 37 wherein said host material volatilizes rapidly and cleanly upon direct exposure to a laser beam of predetermined energy.
Claim 47
Dependent Claim
29 words
The interlevel connector structure of claim 37 wherein said host polymer comprises a polymer selected from the group consisting of low molecular weight polyethylene, polypropylene, polystyrene, polyvinylchloride, and polyurethane.
Claim 48
Dependent Claim
15 words
The interlevel connector structure of claim 37 wherein said electrically conductive fibers are carbon fibers.
Claim 49
Dependent Claim
15 words
The interlevel connector of claim 37 wherein said pultrusions are of circular cross sectional shape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-01-24 | 1997-07-26 | 1998-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-01-24 | 2001-07-26 | 2002-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-01-24 | 2005-07-26 | 2006-01-25 | $7700.00 | Window Closed / Lapsed |