US5990418A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic CBGA/CCGA structure with thermal paste cooling
Assignee: International Business Machines Corp
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Filing: 1997-07-29
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Granted: 1999-11-23
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Expires: 2017-07-29
Abstract
Abstract A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).
Inventors
- 👤 Kevin G. Bivona
- 👤 Jeffrey T. Coffin
- 👤 Stephen S. Drofitz, Jr.
- 👤 Lewis S. Goldmann
- 👤 Mario J. Interrante
- 👤 Sushumna Iruvanti
- 👤 Raed A. Sherif
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:26
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W40/00; H10W40/70; H10W76/00; H10W76/40; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
150 words
An apparatus for hermetically sealing an integrated circuit, having a top surface and a bottom surface, the apparatus comprising: a carrier substrate having a first surface and a second surface; first attaching means for attaching the bottom surface of the integrated circuit to the first surface of the carrier substrate, an interface coolant disposed upon and in contact with the top surface of the integrated circuit, a lid disposed above the integrated circuit and in contact with the interface coolant, second attaching means for attaching the lid to the first surface of the carrier substrate with a hermetic seal, and a standoff disposed adjacent the integrated circuit and between the carrier substrate and the lid and fixedly attached to only the first surface is of the carrier substrate, the standoff supporting the lid above the carrier substrate, wherein the integrated circuit is hermetically sealed between the substrate and the lid.
Claim 2
Independent Claim
150 words
An apparatus for hermetically sealing an integrated circuit, having a top surface and a bottom surface, the apparatus comprising: a carrier substrate having a first surface and a second surface; first attaching means for attaching the bottom surface of the integrated circuit to the first surface of the carrier substrate, an interface coolant disposed upon and in contact with the top surface of the integrated circuit, a lid disposed above the integrated circuit and in contact with the interface coolant, second attaching means for attaching the lid to the first surface of the carrier substrate with a hermetic seal, and a standoff disposed adjacent the integrated circuit and between the carrier substrate and the lid and fixedly attached to only the first surface is of the carrier substrate, the standoff supporting the lid above the carrier substrate, wherein the integrated circuit is hermetically sealed between the substrate and the lid.
Claim 3
Dependent Claim
35 words
The apparatus of claim 1, for use with a circuit board, said apparatus further comprising one of a ball grid array and a column grid array for mounting the carrier substrate to the circuit board.
Claim 4
Dependent Claim
23 words
The apparatus of claim 1, wherein the integrated circuit is a flip chip and the first attaching means is a flip chip connection.
Claim 5
Dependent Claim
26 words
The apparatus of claim 3, where the lid has an outside surface, the apparatus further comprising a heatsink attached to the outside surface of the lid.
Claim 6
Dependent Claim
23 words
The apparatus of claim 1, wherein the lid has an inside surface and an outside surface, the inside surface contacting the interface coolant.
Claim 7
Dependent Claim
10 words
The apparatus of claim 1, wherein the lid is metal.
Claim 8
Dependent Claim
18 words
The apparatus of claim 1, wherein the lid is made of a material including iron, cobalt and nickel.
Claim 9
Dependent Claim
20 words
The apparatus of claim 7, wherein the lid has a thickness in the range of 0.127 mm to 0.508 mm.
Claim 10
Dependent Claim
13 words
The apparatus of claim 1, wherein the interface coolant is a thermal paste.
Claim 11
Dependent Claim
21 words
The apparatus of claim 9, wherein the thermal paste has a thickness in the range of 0.076 mm to 0.381 mm.
Claim 12
Dependent Claim
11 words
The apparatus of claim 1, wherein the carrier substrate is ceramic.
Claim 13
Dependent Claim
14 words
The apparatus of claim 1, wherein the second attaching means is a seam seal.
Claim 14
Dependent Claim
26 words
The apparatus of claim 12, wherein the lid has an edge and the lid is brazed to the carrier substrate along the edge of the lid.
Claim 15
Dependent Claim
14 words
The apparatus of claim 1, wherein the standoff is disposed around the integrated circuit.
Claim 16
Independent Claim
120 words
A method for hermetically sealing an integrated circuit comprising the steps of: (a) attaching a bottom surface of the integrated circuit to a first surface of a carrier substrate, (b) placing a interface coolant in contact with a top surface of the integrated circuit, (c) disposing a lid above the integrated circuit and in contact with the interface coolant, (d) attaching the lid to the first surface of the carrier substrate, (e) supporting the lid above the carrier substrate with a standoff adjacent the integrated circuit and between the carrier substrate and the lid and fixedly attached to only the first surface of the carrier substrate, and (f) hermetically sealing the integrated circuit between the carrier substrate and the lid.
Claim 17
Independent Claim
120 words
A method for hermetically sealing an integrated circuit comprising the steps of: (a) attaching a bottom surface of the integrated circuit to a first surface of a carrier substrate, (b) placing a interface coolant in contact with a top surface of the integrated circuit, (c) disposing a lid above the integrated circuit and in contact with the interface coolant, (d) attaching the lid to the first surface of the carrier substrate, (e) supporting the lid above the carrier substrate with a standoff adjacent the integrated circuit and between the carrier substrate and the lid and fixedly attached to only the first surface of the carrier substrate, and (f) hermetically sealing the integrated circuit between the carrier substrate and the lid.
Claim 18
Dependent Claim
19 words
The method according to claim 15, wherein the attaching step (d) is brazing the lid to the carrier substrate.
Claim 19
Dependent Claim
27 words
The method according to claim 15, for use with a circuit board and further comprising the step of: (f) coupling the carrier substrate to the circuit board.
Claim 20
Dependent Claim
27 words
The method according to claim 17, wherein the coupling step (f) is one of a ceramic ball grid array (CBGA) and a ceramic column grid array (CCGA).
Claim 21
Independent Claim
149 words
An apparatus for hermetically sealing a flip chip, having a top surface and a bottom surface, the apparatus comprising: a carrier substrate having a first surface and a second surface; a flip chip connection to attach the bottom surface of the flip chip to the first surface of the carrier substrate, an interface coolant disposed upon and in contact with the top surface of the flip chip, a lid disposed above the flip chip and in contact with the interface coolant, attaching means for attaching the lid to the first surface of the carrier substrate with a hermetic seal, and a standoff disposed adjacent the flip chip and between the carrier substrate and the lid and fixedly attached to only the first surface of the carrier substrate, the standoff supporting the lid above the carrier substrate, wherein the integrated circuit is hermetically sealed between the substrate and the lid.
Claim 22
Independent Claim
149 words
An apparatus for hermetically sealing a flip chip, having a top surface and a bottom surface, the apparatus comprising: a carrier substrate having a first surface and a second surface; a flip chip connection to attach the bottom surface of the flip chip to the first surface of the carrier substrate, an interface coolant disposed upon and in contact with the top surface of the flip chip, a lid disposed above the flip chip and in contact with the interface coolant, attaching means for attaching the lid to the first surface of the carrier substrate with a hermetic seal, and a standoff disposed adjacent the flip chip and between the carrier substrate and the lid and fixedly attached to only the first surface of the carrier substrate, the standoff supporting the lid above the carrier substrate, wherein the integrated circuit is hermetically sealed between the substrate and the lid.
References Cited (Backward Citations)
US4514752A
Cited
US5014115A
Cited
US4985753A
Cited
US5132875A
Cited
US5455457A
Cited
US5365402A
Cited
US5268533A
Cited
US5297006A
Cited
US5357673A
Cited
US5317107A
Cited
US5539151A
Cited
US5324888A
Cited
US5414214A
Cited
US5323294A
Cited
US5471366A
Cited
US5528456A
Cited
US5706579A
Cited
US5745344A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-22 | 2003-05-24 | 2003-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-22 | 2007-05-24 | 2007-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-22 | 2011-05-24 | 2011-11-23 | $7700.00 | Window Closed / Lapsed |