Coplanar waveguide semiconductor package

Claim 2

A coplanar waveguide package for a semiconductor device which package is suitable for abutting against an adjacent coplanar waveguide structure having an edge with a predetermined shape so that electrical connection can be made therewith and so that the resulting structure takes up a minimal amount of space, the coplanar waveguide package including in combination: base means having a first surface, a second surface and at least one edge having a shape adapted for abutting against the edge of the adjacent coplanar waveguide structure; first conductive means provided on said first surface of said base means, said first conductive means adapted to extend to but not overlap said at least one edge, said first conductive means thereby being adapted to facilitate electrical contact with the adjacent coplanar waveguide structure; first ground plane means also provided on said first surface of said base means, said first ground plane means being coplanar with and adjacent said first conductive means, said ground plane means and said first conductive means providing a coplanar waveguide means; semiconductor die means coupled to said first conductive means; semiconductor die pad means provided on said first surface of said base means, said semiconductor die pad means being adapted to receive said semiconductor die means; frame means affixed to said base means and surrounding said semiconductor die means and said semiconductor die pad means; cover means covering said frame means and said semiconductor die means and said semiconductor die pad means, said cover means being adapted to be affixed to said frame means; and said base means and said frame means and said cover means being adapted to enclose and protect said semiconductor die means.

Claim 3

The package of claim 1 wherein said base means has a flat rectangular first surface having a straight edge for abutting against a similar edge of the adjacent coplanar waveguide structure to facilitate electrical connection therewith; and said first conductive means and said first ground plane means being formed by patterning a conductive layer provided on said flat first surface of said base means.

Claim 4

The package of claim 1 wherein said semiconductor die mounting pad means is centrally located on said first surface of said base means.

Claim 5

The package of claim 1 wherein: said frame means has a rectangular shape and is mounted on said first surface of said base means so as to surround said semiconductor die pad means; and said first conductive means extends radially from said semiconductor die pad means toward said edge of said base means and underneath said frame means.

Claim 6

The package of claim 4 wherein said cover means has a rectangular shape which is similar to the shape of said frame means.

Claim 7

A coplanar waveguide electronic assembly for high frequency operation including in combination: carrier means having a flat conductive surface; first base means having a flat first surface with a conductive layer thereon and a flat second surface and a shaped edge for abutting against a similar edge of an adjacent structure, said conductive layer on said first surface of said first base means being affixed to said surface of said carrier means; ground plane means located on said flat second surface of said first base means; conductive means also provided on said flat second surface of said first base means, said conductive means having a conductive line which extends nearly to but does not overlap said edge of said flat second surface of said first base means, said conductive means being coplanar with and adjacent said ground plane means to provide a waveguide structure; semiconductor die pad means mounted on said flat second surface of said first base means; semiconductor die means affixed to said semiconductor die pad means; frame means affixed to said first base means and surrounding said semiconductor die pad means and said semiconductor die means; and cover means for covering portions of said first base means and said frame means and said semiconductor die and said semiconductor die pad means to provide a first package.

Claim 8

A coplanar waveguide electronic assembly for high frequency operation including in combination: carrier means having a flat conductive surface; first base means having a flat first surface with a conductive layer thereon and a flat second surface and a shaped edge for abutting against a similar edge of an adjacent structure, said conductive layer on said first surface of said first base means being affixed to said surface of said carrier means; ground plane means located on said flat second surface of said first base means; conductive means also provided on said flat second surface of said first base means, said conductive means having a conductive line which extends nearly to but does not overlap said edge of said flat second surface of said first base means, said conductive means being coplanar with and adjacent said ground plane means to provide a waveguide structure; semiconductor die pad means mounted on said flat second surface of said first base means; semiconductor die means affixed to said semiconductor die pad means; frame means affixed to said first base means and surrounding said semiconductor die pad means and said semiconductor die means; and cover means for covering portions of said first base means and said frame means and said semiconductor die and said semiconductor die pad means to provide a first package.

Claim 9

The electronic assembly of claim 6 further including an additional package for another semiconductor device, the additional package abutting against said first package so that the resulting structure takes up a minimum amount of space, said electronic assembly further including in combination: second base means having a flat first surface with a conductive layer thereon and a flat second surface and a further shaped edge for abutting against said shaped edge of said first base means; further ground plane means located on said flat second surface of said second base means; further conductive means provided on said flat second surface of said second base means, said further conductive means having a further conductive line which is adapted to extend nearly to but to not overlap said shaped edge of said second base means, said further conductive line being aligned with said conductive line on said first base means, said further conductive means being coplanar with and adjacent said further ground plane means to provide another waveguide structure; first conductor means electrically interconnecting said aligned conductive lines of said first and second base means; second conductor means electrically interconnecting said ground plane means and said further ground plane means; further semiconductor die pad means provided on said flat second surface of said second base means; further semiconductor die means affixed to said further semiconductor die means; further frame means affixed to said second base means and surrounding said further semiconductor die means and said further semiconductor die pad means; further cover means for covering said further frame means and said further semiconductor die and said further semiconductor die pad means, said further cover means being affixed to said further frame means; and said first and second base means thereby being electrically and mechanically connected together on said carrier means in a manner to minimize the space taken up on said surface of said carrier means to thereby facilitate the assembly taking up a minimum amount of space.

Claim 10

The package of claim 1 where the adjacent coplanar waveguide structure is a further package for another semiconductor device, the further package including in combination: further base means having a first surface with a shaped edge adapted for abutting against said at least one edge of said base means; third conductive means provided on said first surface of said further base means, said third conductive means adapted to extend to said shaped edge, said third conductive means being aligned with said first conductive means; and means making electrical contact between said first conductive means and said third conductive means.

Claim 11

The package of claim 1 further including second ground plane means on said second surface of said base means.

Claim 12

The package of claim 9 including: further conductive means placed on an edge of said base means, said further conductive means interconnecting said first and second ground plane means.

Claim 13

A coplanar waveguide package for a semiconductor device, comprising: an insulating base having opposed first and second surfaces and an edge extending therebetween; a first metallization on the first surface; and a second metallization on the second surface, wherein the second metallization has a central region for receiving a semiconductor die, at least two signal conductor regions separated from the central region and extending therefrom toward but not overlapping said edge, and at least two ground plane regions spaced apart from said two signal conductor regions and coplanar therewith and extending therefrom toward and overlapping said edge so that said ground plane regions make conductive contact with said first metallization.

Claim 14

A coplanar waveguide package for a semiconductor device, comprising: an insulating base having opposed first and second surfaces and an edge extending therebetween; a first metallization on the first surface; and a second metallization on the second surface, wherein the second metallization has a central region for receiving a semiconductor die, at least two signal conductor regions separated from the central region and extending therefrom toward but not overlapping said edge, and at least two ground plane regions spaced apart from said two signal conductor regions and coplanar therewith and extending therefrom toward and overlapping said edge so that said ground plane regions make conductive contact with said first metallization.

Claim 15

The package of claim 11 further including: a semiconductor die located on said central region; and further means electrically coupling said die to each of said signal conductor regions.

Claim 16

The package of claim 11 wherein said second surface is substantially planar.

Claim 17

The package of claim 11 wherein said ground plane regions are substantially uniformly spaced from said signal conductor regions.

Claim 18

The package of claim 14 wherein said ground plane regions substantially cover said second surface except for said signal conductor regions and said substantially uniform space separating said ground conductor regions from said signal conductor regions.

Claim 19

The package of clam 14 wherein said portions of said ground plane regions extending over said edge substantially cover said edge except for portions of said edge adjacent ends of said signal conductor regions.

Claim 20

The package of clam 14 wherein said portions of said ground plane regions extending over said edge substantially cover said edge except for portions of said edge adjacent ends of said signal conductor regions.

Claim 21

The package of claim 14 wherein said signal conductor regions and said ground plane regions form a coplanar waveguide having a characteristic impedance of above fifty ohms.

Claim 22

The package of claim 11 wherein said central region is included in the same plane as said signal conductor regions and said ground plane regions.

Claim 23

The package of claim 11 further including: frame means affixed to said base and surrounding said central region; and cover means covering said frame means.

Claim 24

The package of claim 11 wherein said edge has a shape adapted for abutting against the edge of an adjacent coplanar waveguide structure.

Claim 25

The package of claim 11 wherein said ground plane means are partially adjacent to said signal conductor means.