Semiconductor package

Claim 2

A semiconductor package comprising a package body including a cavity, a metal package base including a substantially planar surface disposed within the cavity, at least one semiconductor chip mounted on the surface, a substrate cracking prevention plate mounted on the surface within the cavity, and a dielectric substrate disposed on the substrate cracking prevention plate wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrate and includes at least one central opening, the at least one semiconductor chip being disposed within the opening surrounded by the substrate cracking prevention plate.

Claim 3

A semiconductor package comprising: a metal package base having a substantially planar surface on which at least one semiconductor chip and a substrate cracking prevention plate can be mounted; a substrate cracking prevention plate mounted on the package base and including at least one central opening in which the at least one semiconductor chip can be disposed for mounting on the package base surrounded by the substrate cracking prevention plate; at least one dielectric substrate mounted on the substrate cracking prevention plate; an annular package frame attached to said package base surrounding an at least one semiconductor chip, the substrate cracking prevention plate mounted on the surface of said package base and the dielectric substrate, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrate; and a cap for disposition on said package frame opposite said package base for enclosing a volume defined by the surface of said package base, said package frame, and said cap.

Claim 4

A semiconductor package comprising: a metal package base having a substantially planar surface on which at least one semiconductor chip and a substrate cracking prevention plate can be mounted; a substrate cracking prevention plate mounted on the package base and including at least one central opening in which the at least one semiconductor chip can be disposed for mounting on the package base surrounded by the substrate cracking prevention plate; at least one dielectric substrate mounted on the substrate cracking prevention plate; an annular package frame attached to said package base surrounding an at least one semiconductor chip, the substrate cracking prevention plate mounted on the surface of said package base and the dielectric substrate, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrate; and a cap for disposition on said package frame opposite said package base for enclosing a volume defined by the surface of said package base, said package frame, and said cap.

Claim 5

A semiconductor package as claimed in claim 2 wherein said package base includes a protrusion which protrudes into said volume, said surface being formed on said protrusion.

Claim 6

A semiconductor package as claimed in claim 2 wherein said package frame is attached to the surface of said package base.

Claim 7

A semiconductor package as claimed in claim 2 comprising a chip carrier disposed in said opening of said substrate cracking prevention plate, attached to the surface of said package base and on which said semiconductor chip is mounted.

Claim 8

A semiconductor package as claimed in claim 2 wherein said semiconductor chip is mounted on said substrate cracking prevention plate.

Claim 9

A semiconductor package as claimed in claim 2 comprising a plurality of leads extending out of said volume and a peripheral circuit disposed on said dielectric substrate, said leads being electrically connected to said semiconductor chip through the peripheral circuit.

Claim 10

A semiconductor package as claimed in claim 7 comprising lead supporting members made of an insulator through which said leads extend outwardly.

Claim 11

A semiconductor package as claimed in claim 2 wherein said metal package base is Cu.

Claim 12

A semiconductor package as claimed in claim 2 wherein said dielectric substrate is alumina.

Claim 13

A semiconductor package as claimed in claim 2 wherein said substrate cracking prevention plate is kovar.

Claim 14

A semiconductor package as claimed in claim 2 wherein said substrate cracking prevention plate is molybdenum.

Claim 15

A semiconductor package as claimed in claim 5 wherein said chip carrier is a metal.

Claim 16

A semiconductor package as claimed in claim 13 wherein said chip carrier is Cu.

Claim 17

A semiconductor package as claimed in claim 8 wherein said insulator is a ceramic.

Claim 18

A semiconductor package comprising: a metal package base having a substantially planar surface; a substantially planar substrate cracking prevention plate mounted on the surface and on which a semiconductor chip can be mounted; at least two dielectric substrates mounted on the substrate cracking prevention plate proximate the semiconductor chip; an annular package frame attached to said package base for surrounding a semiconductor chip mounted on the substrate cracking prevention plate, the substrate cracking prevention plate, and at least two dielectric substrates, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrates; and a cap for disposition on said package frame opposite said package base for enclosing a volume defined by the surface of said package base, said package frame, and said cap.

Claim 19

A semiconductor package comprising: a metal package base having a substantially planar surface; a substantially planar substrate cracking prevention plate mounted on the surface and on which a semiconductor chip can be mounted; at least two dielectric substrates mounted on the substrate cracking prevention plate proximate the semiconductor chip; an annular package frame attached to said package base for surrounding a semiconductor chip mounted on the substrate cracking prevention plate, the substrate cracking prevention plate, and at least two dielectric substrates, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrates; and a cap for disposition on said package frame opposite said package base for enclosing a volume defined by the surface of said package base, said package frame, and said cap.

Claim 20

A semiconductor package as claimed in claim 16 wherein said package frame is attached to the surface of said package base.

Claim 21

A semiconductor package as claimed in claim 16 wherein said substrate cracking prevention plate is attached to the surface of said package base within said volume and said dielectric substrates are mounted on said substrate cracking prevention plate on opposite sides of said semiconductor chip.

Claim 22

A semiconductor package as claimed in claim 16 wherein said package base is copper.

Claim 23

A semiconductor package as claimed in claim 16 wherein said dielectric substrates are alumina.

Claim 24

A semiconductor package as claimed in claim 16 wherein said substrate cracking prevention plates are one of kovar and molybdenum.

Claim 25

A semiconductor package comprising a package body including a cavity, a metal package base having a substantially planar surface disposed within the cavity, a substrate cracking prevention plate mounted on the surface within the cavity, at least one semiconductor chip mounted on the substrate cracking prevention plate, and at least two dielectric substrates disposed on the substrate cracking prevention plate on opposite sides of the semiconductor chip, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrates.

Claim 26

A semiconductor package comprising a package body including a cavity, a metal package base having a substantially planar surface disposed within the cavity, a substrate cracking prevention plate mounted on the surface within the cavity, at least one semiconductor chip mounted on the substrate cracking prevention plate, and at least two dielectric substrates disposed on the substrate cracking prevention plate on opposite sides of the semiconductor chip, wherein the substrate cracking prevention plate has a coefficient of thermal expansion intermediate the coefficients of thermal expansion of the metal package base and the dielectric substrates.