Reinforced sealing technique for an integrated-circuit package

Claim 2

A package for an integrated-circuit die, comprising: a base having a top sealing surface thereon, said base having an integrated-circuit die fixed thereto; a lid having a lower sealing surface thereon, said lid disposed overlying said base such that said lower sealing surface of said lid is disposed proximate to said top sealing surface of said base and such that said integrated-circuit die is disposed between said lid and said base; a first sealing layer located between said top sealing surface of said base and said lower sealing surface of said lid; and mechanical means for reinforcing said sealing layer against shear forces occurring between said base and said lid and for mechanically and permanently holding said base and said lid together to provide reinforcement against shear forces and to provide additional sealing between said base and said lid, wherein said mechanical means includes a pin disposed extending from at least partially within said base, through said top sealing surface of said base, through said first sealing layer, through said lower sealing surface of said lid, and at least partially into said lid.

Claim 3

The package of claim 1 wherein said mechanical means includes a pin extending through said first sealing layer and at least partially through an undersized aperture disposed in said base and at least partially through an undersized aperture disposed in said lid.

Claim 4

The package of claim 1 wherein said mechanical means for mechanically holding said base and said lid tightly together includes a pin extending through said first sealing layer and through said lid to provide a first exposed end of said pin.

Claim 5

The package of claim 3 including means for fixing said first exposed end of said pin to said base.

Claim 6

The package of claim 4 wherein said means for fixing said first exposed end of said pin to said base includes solder.

Claim 7

The package of claim 4 wherein said means for fixing said first exposed end of said pin to said base includes glass.

Claim 8

The package of claim 4 wherein said means for fixing said first exposed end of said pin to said base includes epoxy.

Claim 9

The package of claim 1 wherein said mechanical means for mechanically holding said base and said lid tightly together includes a pin extending through said first sealing layer and through said base to provide an exposed end of said pin.

Claim 10

The package of claim 8 including means for fixing said second exposed end of said pin to said lid.

Claim 11

The package of claim 9 wherein said means for fixing said second exposed end of said pin to said lid includes solder material.

Claim 12

The package of claim 9 wherein said means for fixing said second exposed end of said pin to said lid includes glass material.

Claim 13

The package of claim 9 wherein said means for fixing said second exposed end of said pin to said lid includes epoxy material.

Claim 14

The package of claim 1 further including said mechanical means for mechanically holding said base and said lid together to provide additional sealing between said base and said lid includes a plurality of pins extending through said first sealing layer and at least partially into said base and at least partially into said lid.

Claim 15

The package of claim 1 wherein said base has a cavity formed therein for receiving said integrated-circuit die.

Claim 16

The package of claim 1 further comprising: a sealing ring, positioned adjacent to said base, said sealing ring having a top sealing surface and a bottom sealing surface, said sealing ring disposed between said top sealing surface of said base and said lower sealing surface lid; a second sealing layer located between said top sealing surface of said base and said bottom sealing surface of said sealing ring; said first sealing layer located between said lower sealing surface of said lid and said top sealing surface of said sealing ring; and mechanical means for mechanically holding said base, said sealing ring, and said lid tightly together including a pin extending through an aperture formed through said sealing ring, said pin extending from at least partially within said base, through said second sealing layer, through said sealing ring, through said first sealing layer, and at least partially into said lid.

Claim 17

A package for an integrated-circuit die, comprising: a base having a top sealing surface thereon said base having an integrated-circuit die fixed thereto; a lid having a lower sealing surface thereon, said lid disposed overlying said base such that said lower sealing surface of said lid is disposed proximate to said top sealing surface of said base and such that said integrated-circuit die is disposed between said lid and said base; a first sealing layer located between said top sealing surface of said base and said lower sealing surface of said lid; and a pin disposed extending from at least partially within said base, through said top sealing surface of said base, through said first sealing layer, through said lower sealing surface of said lid, and at least partially into said lid, wherein said pin provides reinforcement for said sealing layer against shear forces occurring between said base and said lid and for mechanically and permanently holding said base and said lid together.

Claim 18

A package for an integrated-circuit die, comprising: a base having a top sealing surface thereon said base having an integrated-circuit die fixed thereto; a lid having a lower sealing surface thereon, said lid disposed overlying said base such that said lower sealing surface of said lid is disposed proximate to said top sealing surface of said base and such that said integrated-circuit die is disposed between said lid and said base; a first sealing layer located between said top sealing surface of said base and said lower sealing surface of said lid; and a pin disposed extending from at least partially within said base, through said top sealing surface of said base, through said first sealing layer, through said lower sealing surface of said lid, and at least partially into said lid, wherein said pin provides reinforcement for said sealing layer against shear forces occurring between said base and said lid and for mechanically and permanently holding said base and said lid together.

Claim 19

The package of claim 16 wherein said pin extends through said first sealing layer and at least partially through an undersized aperture disposed in said base and at least partially through an undersized aperture disposed in said lid.

Claim 20

The package of claim 16 wherein said pin extends through said first sealing layer and through said lid such that a first end of said pin is exposed.

Claim 21

The package of claim 18 including means for fixing said first exposed end of said pin to said lid.

Claim 22

The package of claim 19 wherein said means for fixing said first exposed end of said pin to said lid includes solder.

Claim 23

The package of claim 19 wherein said means for fixing said first exposed end of said pin to said lid includes glass.

Claim 24

The package of claim 19 wherein said means for fixing said first exposed end of said pin to said lid includes epoxy.

Claim 25

The package of claim 16 wherein said pin extends through said first sealing layer and through said base to provide an exposed end of said pin.

Claim 26

The package of claim 23 including means for fixing said second exposed end of said pin to said base.

Claim 27

The package of claim 24 wherein said means for fixing said second exposed end of said pin to said lid includes solder material.

Claim 28

The package of claim 24 wherein said means for fixing said second exposed end of said pin to said lid includes glass material.

Claim 29

The package of claim 24 wherein said means for fixing said second exposed end of said pin to said lid includes epoxy material.

Claim 30

The package of claim 16 further including wherein a plurality of pins extend through said first sealing layer and at least partially into said base and at least partially into said lid.

Claim 31

The package of claim 16 wherein said base has a cavity formed therein for receiving said integrated-circuit die.

Claim 32

The package of claim 16 further comprising: a sealing ring said sealing ring having a top sealing surface and a bottom sealing surface, said sealing ring disposed between said top sealing surface of said base and said lower sealing surface of said lid; a second sealing layer formed between said top sealing surface of said base and said bottom sealing surface of said sealing ring; said first sealing layer located between said lower sealing surface of said lid and said top sealing surface of said sealing ring; and mechanical means for mechanically holding said base, said sealing ring, and said lid tightly together including said pin extending through an aperture formed through said sealing ring, said pin extending from at least partially within said base, through said second sealing layer, through said sealing ring, through said first sealing layer, and at least partially into said lid, wherein said pin provides mechanical reinforcement for said sealing layer against shear forces occurring between said base, said lid, and said sealing ring and for mechanically and permanently holding said base, said sealing ring, and said lid together and to provide additional sealing between said base, said sealing ring, and said lid.

Claim 33

A package for an integrated-circuit die, comprising: a base having a top sealing surface thereon, said base having an integrated-circuit die fixed thereto; a lid having a lower sealing surface thereon, said lid disposed overlying said base such that said lower sealing surface of said lid is disposed proximate to said top sealing surface of said base and such that said integrated-circuit die is disposed between said lid and said base; a sealing ring, positioned adjacent to said margins of said base, said sealing ring having a top sealing surface and a bottom sealing surface, said sealing ring disposed between said top sealing surface of said base and said lower sealing surface of said lid; a first sealing layer formed between said top sealing surface of said base and said bottom sealing surface of said sealing ring; a second sealing layer formed between said lower sealing surface of said lid and said top sealing surface of said sealing ring; and a pin disposed extending through an aperture formed through said sealing ring, said pin extending from at least partially within said base, through said first sealing layer, through said sealing ring, through said second sealing layer, and at least partially into said lid, wherein said pin provides mechanical reinforcement for said sealing layer against shear forces occurring between said base, said lid, and said sealing ring and for mechanically and permanently holding said base, said sealing ring, and said lid together and to provide additional sealing between said base, said sealing ring, and said lid.

Claim 34

A package for an integrated-circuit die, comprising: a base having a top sealing surface thereon, said base having an integrated-circuit die fixed thereto; a lid having a lower sealing surface thereon, said lid disposed overlying said base such that said lower sealing surface of said lid is disposed proximate to said top sealing surface of said base and such that said integrated-circuit die is disposed between said lid and said base; a sealing ring, positioned adjacent to said margins of said base, said sealing ring having a top sealing surface and a bottom sealing surface, said sealing ring disposed between said top sealing surface of said base and said lower sealing surface of said lid; a first sealing layer formed between said top sealing surface of said base and said bottom sealing surface of said sealing ring; a second sealing layer formed between said lower sealing surface of said lid and said top sealing surface of said sealing ring; and a pin disposed extending through an aperture formed through said sealing ring, said pin extending from at least partially within said base, through said first sealing layer, through said sealing ring, through said second sealing layer, and at least partially into said lid, wherein said pin provides mechanical reinforcement for said sealing layer against shear forces occurring between said base, said lid, and said sealing ring and for mechanically and permanently holding said base, said sealing ring, and said lid together and to provide additional sealing between said base, said sealing ring, and said lid.

Claim 35

The package of claim 31 wherein said pin extends through said first sealing layer and at least partially through an undersized aperture disposed in said base and at least partially through an undersized aperture disposed in said lid.

Claim 36

The package of claim 31 wherein said pin extends through said lid such that a first end of said pin is exposed.

Claim 37

The package of claim 33 including means for fixing said first exposed end of said pin to said lid.

Claim 38

The package of claim 34 wherein said means for fixing said first exposed end of said pin to said lid includes solder.

Claim 39

The package of claim 34 wherein said means for fixing said first exposed end of said pin to said lid includes glass.

Claim 40

The package of claim 34 wherein said means for fixing said first exposed end of said pin to said lid includes epoxy.

Claim 41

The package of claim 31 wherein said pin extends through said base to provide a second exposed end of said pin.

Claim 42

The package of claim 38 including means for fixing said second exposed end of said pin to said base.

Claim 43

The package of claim 39 wherein said means for fixing said second exposed end of said pin to said lid includes solder material.

Claim 44

The package of claim 39 wherein said means for fixing said second exposed end of said pin to said lid includes glass material.

Claim 45

The package of claim 39 wherein said means for fixing said second exposed end of said pin to said lid includes epoxy material.

Claim 46

The package of claim 31 further including a plurality of pins extend through said sealing ring, said first and second sealing layers, and at least partially into said base and at least partially into said lid.

Claim 47

The package of claim 31 wherein said base has a cavity formed therein for receiving said integrated-circuit die.