US4126883A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pressure-mounted semiconductive structure
Assignee: Siemens AG
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Filing: 1977-03-09
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Granted: 1978-11-21
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Expires: 1997-03-09
Abstract
Abstract A semiconductive structure comprised of a semiconductive element, feed electrodes and other related components thereof, each provided with an aperture aligned with the aperture of the other elements and a single clamping bolt means positioned through the aperture of each component to align the components relative to one another and to exert pressure on the semiconductive component.
Inventors
- 👤 Heinz Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:00
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/60; H10W40/611; H10W78/00; H10W90/00; H10W40/625
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
162 words
In a semiconductor structure having a semiconductor component which can be subjected to pressure, the combination comprising: a heat-exchange body having a mounting aperture therein and having passages spaced from said mounting aperture for circulating a heat-exchange fluid therethrough; a pair of semiconductor elements positioned on opposing surfaces of said heat-exchange body, each of said semiconductor elements having a concentrically located mounting aperture therein aligned with said mounting aperture of said heat-exchange body; a pair of electrode means, each having a mounting aperture therein aligned with said mounting aperture of said heat-exchange body, each electrode means being positioned on a surface of a respective semiconductor element face away from said heat-exchange body and having a portion extending away from said semiconductor structure for electrical coupling to an electrical current source; and a clamping bolt means positioned within said apertures to align said semiconductor elements relative to said heat-exchange body and said electrode means and to exert a pressure on said semiconductor element.
Claim 2
Dependent Claim
162 words
In a semiconductor structure having a semiconductor component which can be subjected to pressure, the combination comprising: a heat-exchange body having a mounting aperture therein and having passages spaced from said mounting aperture for circulating a heat-exchange fluid therethrough; a pair of semiconductor elements positioned on opposing surfaces of said heat-exchange body, each of said semiconductor elements having a concentrically located mounting aperture therein aligned with said mounting aperture of said heat-exchange body; a pair of electrode means, each having a mounting aperture therein aligned with said mounting aperture of said heat-exchange body, each electrode means being positioned on a surface of a respective semiconductor element face away from said heat-exchange body and having a portion extending away from said semiconductor structure for electrical coupling to an electrical current source; and a clamping bolt means positioned within said apertures to align said semiconductor elements relative to said heat-exchange body and said electrode means and to exert a pressure on said semiconductor element.
Claim 3
Dependent Claim
17 words
A pressure-mounted semiconductive structure as defined in claim 1 wherein said semiconductor elements are connected in series.
Claim 4
Dependent Claim
19 words
A pressure-mounted semiconductive structure as defined in claim 1 wherein said semiconductor elements are connected opposite to one another.
Claim 5
Dependent Claim
89 words
In a semiconductor structure as defined in claim 1 wherein said electrode means comprises a pair of feed electrodes and a pair of contact leads, said feed electrodes and said contact leads each having a mounting aperture therein aligned with said mounting aperture of said heat-exchange body, each respective feed electrode being positioned on a surface of a respective semiconductor element facing away from said heat-exchange body and each respective contact lead being positioned on a surface of a respective feed electrode facing away from each respective semiconductor element.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-11-20 | 1982-05-22 | 1982-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-11-20 | 1986-05-22 | 1986-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-11-20 | 1990-05-22 | 1990-11-21 | $7700.00 | Window Closed / Lapsed |