Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
133 words
An electronic packaging assembly, comprising: a circuit board having a plurality of first conductive pads; an electronic package having a plurality of second conductive pads, said electronic package further having a plurality of holes adjacent to said second conductive pads; an interposer between said electronic package and said circuit board, said interposer having a plurality of openings; a plurality of conductive members located within said openings of said interposer, said conductive members being in operative contact with said first and second conductive pads such that said electronic package is electrically coupled to said circuit board, said conductive members being adapted to rotate relative to said interposer; and, pressure means for applying pressure to said electronic package so that said conductive members are pressed into operative contact with said first and second conductive pads.
Claim 2
Dependent Claim
133 words
An electronic packaging assembly, comprising: a circuit board having a plurality of first conductive pads; an electronic package having a plurality of second conductive pads, said electronic package further having a plurality of holes adjacent to said second conductive pads; an interposer between said electronic package and said circuit board, said interposer having a plurality of openings; a plurality of conductive members located within said openings of said interposer, said conductive members being in operative contact with said first and second conductive pads such that said electronic package is electrically coupled to said circuit board, said conductive members being adapted to rotate relative to said interposer; and, pressure means for applying pressure to said electronic package so that said conductive members are pressed into operative contact with said first and second conductive pads.
Claim 3
Dependent Claim
51 words
The assembly as recited in claim 1, wherein said circuit board has a plurality of first conductive pads arranged in a pattern, said electronic package has a plurality of second conductive pads arranged in the pattern and said interposer has a plurality of openings and conductive members arranged in the pattern.
Claim 4
Dependent Claim
22 words
The assembly as recited in claim 1, wherein said pressure means is a clamp coupled to said circuit board by a spring.
Claim 5
Dependent Claim
18 words
The assembly as recited in claim 1, wherein said second conductive pad is constructed from a conductive elastomer.
Claim 6
Dependent Claim
16 words
The assembly as recited in claim 1, wherein said conductive member is shaped as a sphere.
Claim 7
Dependent Claim
17 words
The assembly as recited in claim 1, wherein said interposer is adapted to capture said conductive member.
Claim 8
Dependent Claim
201 words
An electronic packaging assembly, comprising: a circuit board having a plurality of first conductive pads arranged in a pattern; an electronic package having a plurality of second conductive pads arranged in the same pattern as said first conductive pads, said second conductive pads being constructed from a conductive elastomer; an interposer between said electronic package and said circuit board, said interposer having a plurality of openings arranged in the same pattern as said first and second conductive pads; a plurality of conductive members located within said openings of said interposer, said conductive members being in operative contact with said first and second conductive pads such that said electronic package is electrically coupled to said circuit board, said conductive members being adapted to rotate relative to said interposer; a clamp coupled to said circuit board and said electronic package, said clamp being adapted to apply a pressure to said electronic package, said clamp having three walls that define an inner cavity and an opening that allows said interposer to roll into said inner cavity; and, spring means for applying a pressure to said electronic package so that said conductive members are pressed into operative contact with said first and second conductive pads.
Claim 9
Dependent Claim
201 words
An electronic packaging assembly, comprising: a circuit board having a plurality of first conductive pads arranged in a pattern; an electronic package having a plurality of second conductive pads arranged in the same pattern as said first conductive pads, said second conductive pads being constructed from a conductive elastomer; an interposer between said electronic package and said circuit board, said interposer having a plurality of openings arranged in the same pattern as said first and second conductive pads; a plurality of conductive members located within said openings of said interposer, said conductive members being in operative contact with said first and second conductive pads such that said electronic package is electrically coupled to said circuit board, said conductive members being adapted to rotate relative to said interposer; a clamp coupled to said circuit board and said electronic package, said clamp being adapted to apply a pressure to said electronic package, said clamp having three walls that define an inner cavity and an opening that allows said interposer to roll into said inner cavity; and, spring means for applying a pressure to said electronic package so that said conductive members are pressed into operative contact with said first and second conductive pads.
Claim 10
Dependent Claim
28 words
The assembly as recited in claim 7, wherein said electronic package has a plurality of holes adjacent to said first conductive pads adapted to receive said conductive members.
Claim 11
Dependent Claim
17 words
The assembly as recited in claim 8, wherein said interposer is adapted to capture said conductive members.
Claim 12
Dependent Claim
17 words
The assembly as recited in claim 9, wherein said conductive members are each shaped as a sphere.
Claim 13
Independent Claim
131 words
A method of connecting an electronic package to a circuit board, comprising the steps of: a) providing a clamp that is separated from a circuit board by a first predetermined space, said circuit board having a first conductive pad; and, b) inserting between said clamp and said circuit board an electronic package with a second conductive pad and an interposer that contains a conductive member until said conductive member is aligned with said first and second conductive pads, said electronic package and said conductive member having a combined uncompressed thickness that is greater than said first space such that said clamp presses said conductive member into operative contact with said first and second conductive pads when said electronic package and said interposer are inserted between said clamp and said circuit board.
Claim 14
Independent Claim
131 words
A method of connecting an electronic package to a circuit board, comprising the steps of: a) providing a clamp that is separated from a circuit board by a first predetermined space, said circuit board having a first conductive pad; and, b) inserting between said clamp and said circuit board an electronic package with a second conductive pad and an interposer that contains a conductive member until said conductive member is aligned with said first and second conductive pads, said electronic package and said conductive member having a combined uncompressed thickness that is greater than said first space such that said clamp presses said conductive member into operative contact with said first and second conductive pads when said electronic package and said interposer are inserted between said clamp and said circuit board.
Claim 15
Dependent Claim
32 words
The method as recited in claim 11, wherein said conductive member rolls along said circuit board when said electronic package and said interposer are inserted between said clamp and said circuit board.
Claim 16
Dependent Claim
32 words
The method as recited in claim 11, wherein said interposer is inserted between said clamp and said circuit board before said electronic package is inserted between said clamp and said circuit board.