US5230759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for sealing a semiconductor device
Assignee: Fujitsu Ltd
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Filing: 1992-08-17
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Granted: 1993-07-27
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Expires: 2012-08-17
Abstract
Abstract A process for hermetically sealing a cap (7) to a package base (1), on which a semiconductor chip (2) is mounted, by an adhesive resin. First, the base (1) is coated with a thermosetting silicone resin (10) along a frame-shaped abutting portion, then the silicone resin is completely hardened and becomes a silicone rubber, and thereafter, the silicone rubber is coated with a thermosetting sealing resin (11) having a good adhesion with the slicone rubber. The cap is then abutted against the base, and the base and cap are heated while a pressure is exerted thereon to press the base and the cap toward each other.
Inventors
- 👤 Katsuro Hiraiwa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:34
CPC Classifications
H; H10; H10W; H10W95/00; H10W76/00; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
145 words
A process for hermetically sealing a semiconductor device comprising a package base, on which a semiconductor chip is mounted, and a package cap, said base and cap having corresponding frame-shaped abutting portions for sealing said cap to said base by a resin adhesive provided between said abutting portions, said process comprising the steps of: coating said frame-shaped abutting portion of one of said base and said cap with a thermosetting silicone resin; hardening said silicone resin by heating said one of said base and said cap until said silicone resin is completely hardened and becomes a silicone rubber; coating only said silicone rubber with a thermosetting sealing resin having a good adhesion with said silicon rubber; abutting said cap against said base; and heating said base and said cap while a pressure is exerted thereon to press said base and said cap toward each other.
Claim 2
Dependent Claim
145 words
A process for hermetically sealing a semiconductor device comprising a package base, on which a semiconductor chip is mounted, and a package cap, said base and cap having corresponding frame-shaped abutting portions for sealing said cap to said base by a resin adhesive provided between said abutting portions, said process comprising the steps of: coating said frame-shaped abutting portion of one of said base and said cap with a thermosetting silicone resin; hardening said silicone resin by heating said one of said base and said cap until said silicone resin is completely hardened and becomes a silicone rubber; coating only said silicone rubber with a thermosetting sealing resin having a good adhesion with said silicon rubber; abutting said cap against said base; and heating said base and said cap while a pressure is exerted thereon to press said base and said cap toward each other.
Claim 3
Dependent Claim
20 words
A process as claimed in claim 1, wherein said silicone resin is hardened at a temperature of approximately 150° C.
Claim 4
Dependent Claim
16 words
A process as claimed in claim 1, wherein said thermosetting sealing resin is an epoxy resin.
Claim 5
Dependent Claim
16 words
A process as claimed in claim 1, wherein said thermosetting sealing resin is a silicone resin.
Claim 6
Dependent Claim
28 words
A process as claimed in claim 1, wherein said pressure is exerted on said base and said cap by a screw means and screw torque is 1-5 kg.cm.
Claim 7
Dependent Claim
16 words
A process as claimed in claim 1, wherein said semiconductor chip is a wafer scale LSI.
References Cited (Backward Citations)
US4109818A
Cited
US4355463A
Cited
US4534815A
Cited
JPS5926694A
Cited
US4974057A
Cited
US4861387A
Cited
US5167744A
Cited
US5122862A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-26 | 1997-01-25 | 1997-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-26 | 2001-01-25 | 2001-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-26 | 2005-01-25 | 2005-07-27 | $7700.00 | Window Closed / Lapsed |