US4916522A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package using plastic encapsulant
Assignee: AMERICAN TELEPHONE AND TELEGRAPH Co AT and T BELL LABORATORIES
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Filing: 1988-04-21
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Granted: 1990-04-10
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Expires: 2008-04-21
Abstract
Abstract An integrated circuit package uses an encapsulant frame which prevents the encapsulant used to seal the integrated circuit chip from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth.
Inventors
- 👤 Charles Cohn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:33
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
90 words
An integrated circuit package comprising a mounting plate having a plurality of plate-surface recesses, and a metallic pattern on said mounting plate between said recesses; an integrated circuit chip mounted on said plate between said recesses; a plurality of electrical leads from said chip to said metallic pattern; an encapsulant frame encircling said chip and said metallic pattern, and having a plurality of retention pins in said recesses; and an encapsulant disposed within said encapsulant frame sealing said chip, said electrical leads, and said metallic pattern from the ambient atmosphere.
Claim 2
Dependent Claim
90 words
An integrated circuit package comprising a mounting plate having a plurality of plate-surface recesses, and a metallic pattern on said mounting plate between said recesses; an integrated circuit chip mounted on said plate between said recesses; a plurality of electrical leads from said chip to said metallic pattern; an encapsulant frame encircling said chip and said metallic pattern, and having a plurality of retention pins in said recesses; and an encapsulant disposed within said encapsulant frame sealing said chip, said electrical leads, and said metallic pattern from the ambient atmosphere.
Claim 3
Dependent Claim
17 words
A package as recited in claim 1 in which a circuit board serves as said mounting plate.
Claim 4
Dependent Claim
16 words
A package as recited in claim 1 in which said mounting plate comprises a ceramic substrate.
Claim 5
Dependent Claim
22 words
A package as recited in claim 1 in which said encapsulant has a surface approximately level with the surface of said frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-09 | 1993-10-09 | 1994-04-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-09 | 1997-10-09 | 1998-04-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-09 | 2001-10-09 | 2002-04-10 | $7700.00 | Window Closed / Lapsed |