US5307012A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Test substation for testing semi-conductor packages
Assignee: Intel Corp
•
Filing: 1993-03-25
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Granted: 1994-04-26
•
Expires: 2013-03-25
Abstract
Abstract A test apparatus that electrically couples a semiconductor package with a test board. The apparatus has a plurality of first contacts that engage the leads of the package. The first contacts are attached to a housing which has four grounding rods spaced a predetermined distance from the first contacts. The rods are electrically grounded and absorb the inductive fields generated by the first contacts in contact with the power and ground leads of the package. The rods extend around the package to control the inductance of the first contacts of the apparatus. The test apparatus may also have a circuit board connected to the first contacts by a plurality of second contacts. A number of spring biased pins are incorporated to couple the circuit board to the test board. The circuit board has both power and ground planes that are coupled to the power and ground leads of the package. The circuit board decouples the power and ground leads and controls the capacitance of the first contacts of the apparatus.
Inventors
- 👤 Bidyut K. Bhattacharyya
- 👤 Jim Cattedra
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:12
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433
Claims Analysis
Total Claims: 37
Claim 1
Independent Claim
100 words
An apparatus that electrically couples a test board to a semiconductor package that has at least one lead, comprising; a housing; at least one first contact attached to said housing and adapted to engage the lead of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board, said first contact forming a loop which defines a first contact opening; and, a rod that is attached to said housing and extending through and separated from said first contact opening, said rod being electrically grounded to control the inductance of said first contact.
Claim 2
Independent Claim
100 words
An apparatus that electrically couples a test board to a semiconductor package that has at least one lead, comprising; a housing; at least one first contact attached to said housing and adapted to engage the lead of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board, said first contact forming a loop which defines a first contact opening; and, a rod that is attached to said housing and extending through and separated from said first contact opening, said rod being electrically grounded to control the inductance of said first contact.
Claim 3
Dependent Claim
17 words
The apparatus as recited in claim 1, wherein said housing has four walls that each contain one.
Claim 4
Dependent Claim
24 words
The apparatus as recited in claim 2, wherein said housing has four end caps, said each end cap restrains and electrically grounds said rod.
Claim 5
Dependent Claim
31 words
The apparatus as recited in claim 3, wherein said end caps are mounted to the test board with four screws, each said screw electrically grounds said end caps and said rod.
Claim 6
Dependent Claim
19 words
The apparatus as recited in claim 1, wherein said first contact is a conductor that extends around said rod.
Claim 7
Dependent Claim
29 words
The apparatus as recited in claim 1, further comprising capacitance means operatively connected to said first contact and the test board for controlling the capacitance of said first contact.
Claim 8
Dependent Claim
31 words
The apparatus as recited in claim 6, wherein said capacitance means is a circuit board with at least one internal conductive layer coupled to said first contact and the test board.
Claim 9
Dependent Claim
47 words
The apparatus as recited in claim 7, wherein said circuit board has at least one internal ground plane coupled to at least one ground lead of the semiconductor package, and at least one internal power plane coupled to at least one power lead of the semiconductor package.
Claim 10
Dependent Claim
31 words
The apparatus as recited in claim 8, further comprising a ground stud attached to said circuit board and the test board, to electrically ground said circuit board to the test board.
Claim 11
Dependent Claim
23 words
The apparatus as recited in claim 7, further comprising at least one second contact that couples said circuit board to said first contact.
Claim 12
Dependent Claim
32 words
The apparatus as recited in claim 10, wherein said circuit board has at least one metalized groove connected to said conductive layer, said metalized groove being adapted to engage said second contact.
Claim 13
Dependent Claim
22 words
The apparatus as recited in claim 10, further comprising a spring that biases said circuit board into contact with said second contact.
Claim 14
Dependent Claim
48 words
The apparatus as recited in claim 10, further comprising at least one tab connected to said first contact such that when said tab is moved from a first position to a second position, said second contact can allow said circuit board to be disengaged from said second contact.
Claim 15
Dependent Claim
36 words
The apparatus as recited in claim 7, further comprising at least one spring biased pogo pin in contact with said circuit board and the test board, to electrically couple said circuit board to the test board.
Claim 16
Dependent Claim
28 words
The apparatus as recited in claim 1, further comprising an alignment plate that aligns said first contact with the lead of the semiconductor package and the test board.
Claim 17
Independent Claim
121 words
An apparatus that electrically couples a test board to a semiconductor package that has at least one lead, comprising; a housing; at least one first contact attached to said housing and adapted to engage the lead of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board; a capacitance control board operatively connected to said first contact, said capacitance control board being constructed to control the capacitance of said first contact; at least one second contact operatively connected to said first contact and said capacitance control board to electrically couple said first contact and said capacitance means; and, a spring that biases said capacitance control board into contact with said second contact.
Claim 18
Independent Claim
121 words
An apparatus that electrically couples a test board to a semiconductor package that has at least one lead, comprising; a housing; at least one first contact attached to said housing and adapted to engage the lead of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board; a capacitance control board operatively connected to said first contact, said capacitance control board being constructed to control the capacitance of said first contact; at least one second contact operatively connected to said first contact and said capacitance control board to electrically couple said first contact and said capacitance means; and, a spring that biases said capacitance control board into contact with said second contact.
Claim 19
Dependent Claim
32 words
The apparatus as recited in claim 16, wherein said capacitance control board is a circuit board with at least one internal conductive layer coupled to said second contact and the test board.
Claim 20
Dependent Claim
45 words
The apparatus as recited in claim 17, wherein said circuit board has at least one ground plane coupled to at least one ground lead of the semiconductor package, and at least one power plane coupled to at least one power lead of the semiconductor package.
Claim 21
Dependent Claim
32 words
The apparatus as recited in claim 18, wherein said circuit board has at least one metalized groove connected to said conductive layer, said metalized groove being adapted to engage said second contact.
Claim 22
Dependent Claim
37 words
The apparatus as recited in claim 19, further comprising an alignment plate that aligns said first contact with the lead of the semiconductor package and said second contact with said metalized groove of said capacitance control board.
Claim 23
Dependent Claim
37 words
The apparatus as recited in claim 17, further comprising at least one spring biased pogo pin in contact with said circuit board and the test board, to electrically couple said capacitance control board to the test board.
Claim 24
Dependent Claim
33 words
The apparatus as recited in claim 17, further comprising a ground stud attached to said capacitance control board and the test board, to electrically ground said capacitance control board to the test board.
Claim 25
Dependent Claim
49 words
The apparatus as recited in claim 16, further comprising at least one tab connected to said first contact such that when said tab is moved from a first position to a second position, said second contact can allow said capacitance control board to be disengaged from the second contact.
Claim 26
Independent Claim
122 words
An apparatus that electrically couples a test board to a semiconductor package that has a plurality of leads, comprising; a housing having four walls; a plurality of first contacts attached to said housing and adapted to engage the leads of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board, each first contact being shaped as a loop which defines a first contact opening; four rods each attached to a corresponding wall, said rods extending through and separated from said first contact openings and being electrically grounded to control the inductance of said first contacts; and, a circuit board in contact with said first contacts to control the capacitance of said first contacts.
Claim 27
Independent Claim
122 words
An apparatus that electrically couples a test board to a semiconductor package that has a plurality of leads, comprising; a housing having four walls; a plurality of first contacts attached to said housing and adapted to engage the leads of the semiconductor package and the test board, such that the semiconductor package is electrically coupled to the test board, each first contact being shaped as a loop which defines a first contact opening; four rods each attached to a corresponding wall, said rods extending through and separated from said first contact openings and being electrically grounded to control the inductance of said first contacts; and, a circuit board in contact with said first contacts to control the capacitance of said first contacts.
Claim 28
Dependent Claim
30 words
The apparatus as recited in claim 24, further comprising a plurality of second contacts adapted to engage said circuit board and electrically couple said first contacts with said circuit board.
Claim 29
Dependent Claim
47 words
The apparatus as recited in claim 25, wherein said circuit board has at least one internal ground plane coupled to at least one ground lead of the semiconductor package, and at least one internal power plane coupled to at least one power lead of the semiconductor package.
Claim 30
Dependent Claim
34 words
The apparatus as recited in claim 26, wherein said circuit board has at least one metalized groove connected to said conductive layer, said metalized groove being adapted to engage each of said second contacts.
Claim 31
Dependent Claim
22 words
The apparatus as recited in claim 25, further comprising a spring that biases said circuit board into contact with said second contacts.
Claim 32
Dependent Claim
48 words
The apparatus as recited in claim 25, further comprising at least one tab connected to said first contacts such that when said tab is moved from a first position to a second position, said second contacts can allow said circuit board to be disengaged from the second contacts.
Claim 33
Dependent Claim
45 words
The apparatus as recited in claim 27, further comprising an alignment plate that aligns said first contacts with the leads of the semiconductor package and the test board, and each of said second contacts with said at least one metalized groove of said circuit board.
Claim 34
Dependent Claim
36 words
The apparatus as recited in claim 24, further comprising at least one spring biased pogo pin in contact with said circuit board and the test board, to electrically couple said circuit board to the test board.
Claim 35
Dependent Claim
31 words
The apparatus as recited in claim 24, further comprising a ground stud attached to said circuit board and the test board, to electrically ground said circuit board to the test board.
Claim 36
Dependent Claim
21 words
The apparatus as recited in claim 24, wherein said housing has four end caps that restrain and electrically ground said rods.
Claim 37
Dependent Claim
19 words
The apparatus as recited in claim 24, wherein said first contact is a conductor that extends around said rod.
References Cited (Backward Citations)
US4574235A
Cited
US4473798A
Cited
WO1983004315A1
Cited
US4539621A
Cited
US4668041A
Cited
US4739257A
Cited
US4851764A
Cited
US4866507A
Cited
US4835464A
Cited
US4931726A
Cited
JPS6469958A
Cited
US4970460A
Cited
US4879434A
Cited
US4972297A
Cited
US4912401A
Cited
US4945633A
Cited
US4928061A
Cited
US5006667A
Cited
US5043534A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-04-25 | 1997-10-25 | 1998-04-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-04-25 | 2001-10-25 | 2002-04-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-04-25 | 2005-10-25 | 2006-04-26 | $7700.00 | Window Closed / Lapsed |