US4851764A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High temperature environmental testing apparatus for a semiconductor device having an improved holding device and operation method of the same
Assignee: Fujitsu Ltd
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Filing: 1987-05-12
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Granted: 1989-07-25
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Expires: 2007-05-12
Abstract
Abstract An improved holding device for holding a semiconductor device, particularly a microwave semiconductor device, in a high temperature environmental testing apparatus. The holding device includes a heat block having a heat source therein, and a cooling block for cooling the microstrip matching circuits and coaxial connectors. Both blocks are spatially isolated from each other by an air space. The semiconductor device is set on the top surface of the heat block. As a result, the semiconductor device is effectively heated up to the predetermined testing temperature, while the microstrip matching circuits and the connectors are protected from the temperature rise caused by the heat flow from the heat block. Appropriate grounding arrangements for the semiconductor device are provided by a metal foil for projections on the side walls of the cooling block.
Inventors
- 👤 Toshio Usui
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 16:52
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/286; G01R31/2863; G01R31/26; G01R31/2607; G01R31/2621; G01R31/282; G01R31/2822; G01R31/2872; G01R31/2879
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
237 words
A high temperature environmental testing apparatus having a holding means for holding a semiconductor device to be tested, said semiconductor device includes a thermally and electrically conductive base member, said holding means comprising: a plurality of microstrip matching circuit plates, each of said plates including an electrically insulative substrate, a microstrip matching circuit formed on a top surface of said substrate, and a grounding pattern formed on a back side of said substrate, said microstrip matching circuit plates being electrically connectable to said semiconductor device; an output terminal means for providing said microstrip matching circuit plates with signals and a ground potential, said output terminal means being electrically connected to said microstrip matching circuit plates; a grounding means for electrically grounding said semiconductor device, said grounding means being a metallic foil; a cooling block for cooling said microstrip matching circuit plates, said microstrip matching circuit plates being mounted on said cooling block; a heat block for heating said semiconductor device, said heat block being attachable to said base member of said semiconductor device in surface-to-surface contact and said heating block being heated by a heating source; and supporting means being connected to said cooling block and said heat block, said supporting means for suspending said heat block in an air space, said heat block being positioned spatially and thermally isolated from said cooling block by said air space except where said supporting means contacts said heating block.
Claim 2
Dependent Claim
237 words
A high temperature environmental testing apparatus having a holding means for holding a semiconductor device to be tested, said semiconductor device includes a thermally and electrically conductive base member, said holding means comprising: a plurality of microstrip matching circuit plates, each of said plates including an electrically insulative substrate, a microstrip matching circuit formed on a top surface of said substrate, and a grounding pattern formed on a back side of said substrate, said microstrip matching circuit plates being electrically connectable to said semiconductor device; an output terminal means for providing said microstrip matching circuit plates with signals and a ground potential, said output terminal means being electrically connected to said microstrip matching circuit plates; a grounding means for electrically grounding said semiconductor device, said grounding means being a metallic foil; a cooling block for cooling said microstrip matching circuit plates, said microstrip matching circuit plates being mounted on said cooling block; a heat block for heating said semiconductor device, said heat block being attachable to said base member of said semiconductor device in surface-to-surface contact and said heating block being heated by a heating source; and supporting means being connected to said cooling block and said heat block, said supporting means for suspending said heat block in an air space, said heat block being positioned spatially and thermally isolated from said cooling block by said air space except where said supporting means contacts said heating block.
Claim 3
Dependent Claim
21 words
A high temperature environmental testing apparatus of claim 1, wherein said metallic foil is made of copper, and is gold plated.
Claim 4
Dependent Claim
26 words
A high temperature environmental testing apparatus of claim 1, wherein said metallic foil is electrically connected to said grounding pattern of said microstrip matching circuit plate.
Claim 5
Dependent Claim
20 words
A high temperature environmental testing apparatus of claim 1, wherein said metallic foil is electrically connected to said cooling block.
Claim 6
Dependent Claim
46 words
A high temperature environmental testing apparatus of claim 1, wherein said metallic foil is inserted between said heat block and said base member of said semiconductor device, and said metallic foil, said heat block and said base member are in a tight contact with each other.
Claim 7
Dependent Claim
22 words
A high temperature environmental testing apparatus of claim 1, wherein said supporting means comprises a pair of supporting plates made of metal.
Claim 8
Dependent Claim
43 words
A high temperature environmental testing apparatus of claim 6, wherein said supporting plates are attached to said heat block at portions in the vicinity of ends of said heating block, and said semiconductor device is placed in the center of said heat block.
Claim 9
Dependent Claim
42 words
A high temperature environmental testing apparatus of claim 6, wherein said supporting plates are fixed to said heat block maintaining an air space between facing surfaces of said heat block and said supporting plates, said support plates being spaced from said heat
Claim 10
Dependent Claim
31 words
A high temperature environmental testing apparatus according to claim 1, wherein said cooling block has a moat therein and said heat block is suspended in said moat by said supporting means.
Claim 11
Dependent Claim
24 words
A high temperature environmental testing apparatus according to claim 1, wherein said heat block is connected to said supporting means by a connecting means.
Claim 12
Dependent Claim
16 words
A high temperature environmental testing apparatus according to claim 10, wherein said connecting means are screws.
Claim 13
Dependent Claim
277 words
A high temperature environmental testing apparatus having a holding means for holding a semiconductor device to be tested, said semiconductor device includes a thermally and electrically conductive base member, said holding means comprising: a plurality of microstrip matching circuit plates, each of said plates including an electrically insulative substrate, a microstrip matching circuit formed on a top surface of said substrate, and a grounding pattern formed on a back side of said substrate, said microstrip matching circuit plates being electrically connectable to said semiconductor device; an output terminal means for providing said microstrip matching circuit plates with signals and a ground potential, said output terminal means being electrically connected to said microstrip matching circuit plates; a grounding means for electrically grounding said semiconductor device, said grounding means is a projection formed on a side wall of said cooling block facing a surface of said base member of said semiconductor device, and said projection is disposed such that the confronting surface of said projection is in electrical contact with said base member; a cooling block for cooling said microstrip matching circuit plates, said microstrip matching circuit plates being mounted on said cooling block; a heat block for heating said semiconductor device, said heat block being attachable to said base member of said semiconductor device in surface-to-surface contact and said heating block being heated by a heating source; and supporting means being connected to said cooling block and said heat block, said supporting means for suspending said heat block in an air space, said heat block being positioned spatially and thermally isolated from said cooling block by said air space except where said supporting means contacts said heating block.
Claim 14
Dependent Claim
277 words
A high temperature environmental testing apparatus having a holding means for holding a semiconductor device to be tested, said semiconductor device includes a thermally and electrically conductive base member, said holding means comprising: a plurality of microstrip matching circuit plates, each of said plates including an electrically insulative substrate, a microstrip matching circuit formed on a top surface of said substrate, and a grounding pattern formed on a back side of said substrate, said microstrip matching circuit plates being electrically connectable to said semiconductor device; an output terminal means for providing said microstrip matching circuit plates with signals and a ground potential, said output terminal means being electrically connected to said microstrip matching circuit plates; a grounding means for electrically grounding said semiconductor device, said grounding means is a projection formed on a side wall of said cooling block facing a surface of said base member of said semiconductor device, and said projection is disposed such that the confronting surface of said projection is in electrical contact with said base member; a cooling block for cooling said microstrip matching circuit plates, said microstrip matching circuit plates being mounted on said cooling block; a heat block for heating said semiconductor device, said heat block being attachable to said base member of said semiconductor device in surface-to-surface contact and said heating block being heated by a heating source; and supporting means being connected to said cooling block and said heat block, said supporting means for suspending said heat block in an air space, said heat block being positioned spatially and thermally isolated from said cooling block by said air space except where said supporting means contacts said heating block.
Claim 15
Dependent Claim
43 words
A high temperature environmental testing apparatus of claim 12, further comprising a metallic seat block on which said microstrip matching circuit is disposed and said projection is formed on a wall of said metallic seat facing said metallic base of said semiconductor device.
Claim 16
Dependent Claim
22 words
A high temperature environmental testing apparatus of claim 12, wherein said supporting means comprises a pair of supporting plates made of metal.
Claim 17
Dependent Claim
42 words
A high temperature environmental testing apparatus of claim 14, wherein supporting plates are attached to said heat block at portions in the vicinity of ends of said heating block, and said semiconductor device is placed in the center of said heat block.
Claim 18
Dependent Claim
45 words
A high temperature environmental testing apparatus of claim 14, wherein supporting plates are fixed to said heat block maintaining an air space between facing surfaces of said heat block and said supporting plates, said support plates being spaced from said heat block by ceramic spacers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-24 | 1993-01-23 | 1993-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-24 | 1997-01-23 | 1997-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-24 | 2001-01-23 | 2001-07-25 | $7700.00 | Window Closed / Lapsed |