US5043534A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal electronic package having improved resistance to electromagnetic interference
Assignee: Advanced Technology Interconnect Inc
•
Filing: 1990-07-02
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Granted: 1991-08-27
•
Expires: 2010-07-02
Abstract
Abstract A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.
Inventors
- 👤 Deepak Mahulikar
- 👤 Jeffrey S. Braden
- 👤 Stephen P. Noe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:25
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W42/00; H10W42/20; H10W42/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
62 words
A package adapted to receive an electronic device, comprising: a base component formed from a metal or metal alloy; a cover component formed from a metal or metal alloy; a leadframe disposed between said base component and cover component; dielectric sealant means bonding said base component to said cover component; and means for electrically interconnecting said base component and said cover component.
Claim 2
Dependent Claim
62 words
A package adapted to receive an electronic device, comprising: a base component formed from a metal or metal alloy; a cover component formed from a metal or metal alloy; a leadframe disposed between said base component and cover component; dielectric sealant means bonding said base component to said cover component; and means for electrically interconnecting said base component and said cover component.
Claim 3
Dependent Claim
30 words
The package of claim 1 wherein said base component and said cover component both have an adhesion enhancing layer on at least those portions which contact said dielectric sealant means.
Claim 4
Dependent Claim
19 words
The package of claim 2 wherein said leadframe further includes a centrally positioned chip attach pad and pad supports.
Claim 5
Dependent Claim
56 words
The package of claim 2 wherein said means for electrical interconnection comprises matched pairs of contact pins extending inwardly from said portions of said base component and said cover component through said dielectric sealant means, each of said contact pins terminating at a tip which is electrically interconnected to the tip of said matched contact pin.
Claim 6
Dependent Claim
16 words
The package of claim 4 wherein each said tip is coated with an electrically conductive adhesive.
Claim 7
Dependent Claim
63 words
The package of claim 5 wherein each said contact pin extends into an aperture formed in said base component or said cover component, said aperture extending from said dielectric sealant means at least part way through said base component or said cover component thereby either forming a through hole or terminating at an exterior end within said base component or said cover component.
Claim 8
Dependent Claim
24 words
The package of claim 6 wherein each said contact pin has a serrated head with a diameter larger than the diameter of said aperture.
Claim 9
Dependent Claim
24 words
The package of claim 7 wherein said contact pin is formed from the same base metal as said base component and said cover component.
Claim 10
Dependent Claim
28 words
The package of claim 7 wherein said aperture extends through said base component or said cover component, the exterior end of said aperture being sealed with a plug.
Claim 11
Dependent Claim
24 words
The package of claim 9 wherein said plug is selected from the group consisting of low melting temperature solders, polymer adhesives and sealing glasses.
Claim 12
Dependent Claim
23 words
The package of claim 5 wherein said contact pins comprise matched pairs of protrusions extending from said base component and said cover component.
Claim 13
Dependent Claim
21 words
The package of claim 3 wherein said means for electrical interconnection comprises contact pins making electrical contact with said pad supports.
Claim 14
Dependent Claim
20 words
The package of claim 12 wherein the tip of each said contact pin is coated with an electrically conductive adhesive.
Claim 15
Dependent Claim
53 words
The package of claim 13 wherein each said contact pin extends into an aperture formed in said base component or said cover component, said aperture extending at least part way through said component thereby forming either a through hole or terminating at an exterior end within said base component or said cover component.
Claim 16
Dependent Claim
24 words
The package of claim 14 wherein each said contact pin has a serrated head with a diameter larger than the diameter of said aperture.
Claim 17
Dependent Claim
28 words
The package of claim 15 wherein said aperture extends through said base component or said cover component, the exterior end of said aperture being sealed with a plug.
Claim 18
Dependent Claim
24 words
The package of claim 16 wherein said plug is selected from the group consisting of low melting temperature solders, polymer adhesives and sealing glasses.
Claim 19
Dependent Claim
23 words
The package of claim 13 wherein said contact pins comprise matched pairs of protrusions extending from said base component and said cover component.
Claim 20
Dependent Claim
49 words
The package of claim 2 wherein said means for electrical interconnection comprises an aperture extending through said base component, said cover component and said dielectric sealant means filled with a conductive material selected from the group consisting of silver filled epoxy, silver filled solder glass and low melting solders.
Claim 21
Dependent Claim
14 words
The package of claim 19 wherein said conductive material is a silver filled epoxy.
Claim 22
Dependent Claim
53 words
The package of claim 3 wherein said means for electrical interconnection comprises an aperture extending through said metal or metal alloy base, metal or metal alloy cover and dielectric sealant means filled with a conductive material selected from the group consisting of silver filled epoxy, silver filled solder glass and low melting solder.
Claim 23
Dependent Claim
14 words
The package of claim 21 wherein said conductive material is a silver filled epoxy.
Claim 24
Dependent Claim
18 words
The package of claim 21 wherein said aperture further extends through at least one of said pad supports.
Claim 25
Dependent Claim
41 words
The package of claim 2 wherein said means for electrical interconnection comprises an aperture extending through said dielectric sealant means filled with a conductive material selected from the group consisting of silver filled epoxy, silver filled solder glass and low melting.
Claim 26
Dependent Claim
14 words
The package of claim 24 wherein said conductive material is a silver filled epoxy.
Claim 27
Dependent Claim
42 words
The package of claim 3 wherein said means for electrical interconnection comprises an aperture extending through said dielectric sealant means filled with a conductive material selected from the group consisting of silver filled epoxy, silver filled solder glass and low melting solder.
Claim 28
Dependent Claim
13 words
The package of claim 26 wherein said conductive material is silver filled epoxy.
Claim 29
Dependent Claim
27 words
The package of claim 2 wherein said means for electrical interconnection comprises a conductive strap in electrical contact with both said base component and said cover component.
Claim 30
Dependent Claim
25 words
The package of claim 28 wherein said conductive strap is bonded to said base component and to said cover component with an electrically conductive adhesive.
Claim 31
Dependent Claim
27 words
The package of claim 3 wherein said means for electrical interconnection comprises a conductive strap in electrical contact with said base component, cover component and pad supports.
Claim 32
Dependent Claim
24 words
The package of claim 30 wherein said conductive strap is bonded to said base component, cover component and pad support with a conductive adhesive.
Claim 33
Dependent Claim
134 words
A package adapted to receive an electronic device, comprising: a base component formed from aluminum or an aluminum alloy; a cover component formed from aluminum or an aluminum alloy; a leadframe disposed between said base component and said cover component, said leadframe having a plurality of leads about a centrally positioned chip attach pad and pad supports; a dielectric adhesive film for bonding said base component to said cover component; an anodization layer over at least those portions of said base component and of said cover component which contact said dielectric adhesive film or which form an exterior surface of said package; and at least two contact pins extending from said base component and from said cover component, each said contact pin terminating at a tip which is electrically contacted to said pad supports.
Claim 34
Dependent Claim
134 words
A package adapted to receive an electronic device, comprising: a base component formed from aluminum or an aluminum alloy; a cover component formed from aluminum or an aluminum alloy; a leadframe disposed between said base component and said cover component, said leadframe having a plurality of leads about a centrally positioned chip attach pad and pad supports; a dielectric adhesive film for bonding said base component to said cover component; an anodization layer over at least those portions of said base component and of said cover component which contact said dielectric adhesive film or which form an exterior surface of said package; and at least two contact pins extending from said base component and from said cover component, each said contact pin terminating at a tip which is electrically contacted to said pad supports.
Claim 35
Dependent Claim
20 words
The package of claim 32 wherein a conductive adhesives bonds the tips of said contact pins to said pad supports.
Claim 36
Dependent Claim
30 words
The package of claim 33 wherein said contact pins comprise protrusions having a diameter effective to align said dielectric adhesive film and a length effective to define said package thickness.
Claim 37
Dependent Claim
32 words
The package of claim 34 wherein said dielectric adhesive film contains apertures adapted to receive said contact pins, said apertures having a diameter slightly larger than the diameter of said contact pins.
Claim 38
Dependent Claim
20 words
The package of claim 35 wherein said protrusions have a length of from about 0.005 inches to about 0.020 inches.
Claim 39
Dependent Claim
20 words
The package of claim 34 wherein said base component and said cover component have a protrusion located at each corner.
Claim 40
Dependent Claim
24 words
The package of claim 32 including said electronic device bonded to said centrally positioned chip attach pad and electrically interconnected to said plurality leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-08-26 | 1995-02-25 | 1995-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-08-26 | 1999-02-25 | 1999-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-08-26 | 2003-02-25 | 2003-08-27 | $7700.00 | Window Closed / Lapsed |