US4521469A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Casing for electronic components
Assignee: Olin Corp
•
Filing: 1984-05-31
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Granted: 1985-06-04
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Expires: 2004-05-31
Abstract
Abstract A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
Inventors
- 👤 Sheldon H. Butt
- 👤 Edward F. Smith, III
- 👤 F. Dennis Gyurina
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:38
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; H10; H10W; H10W74/00; H10W74/40; H10W74/47; Y; Y10; Y10T; Y10T428/00; Y10T428/13; Y10T428/1352; Y10T428/1355; Y10T428/1359; Y10T428/23; Y10T428/239; Y10T428/31504; Y10T428/31511; Y10T428/31529
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
73 words
A casing adapted to contain an electrical or electronic component, comprising: a copper or copper alloy leadframe; an adhesion primer on the surface of said leadframe, said adhesion primer comprising a substantially uniform glassy and substantially pore-free phosphate coating; and a plastic material comprising an epoxide resin bonded to said leadframe to form said casing, said resin forming a strong adhesive bond to said leadframe, said epoxide resin containing a mold release agent.
Claim 2
Dependent Claim
73 words
A casing adapted to contain an electrical or electronic component, comprising: a copper or copper alloy leadframe; an adhesion primer on the surface of said leadframe, said adhesion primer comprising a substantially uniform glassy and substantially pore-free phosphate coating; and a plastic material comprising an epoxide resin bonded to said leadframe to form said casing, said resin forming a strong adhesive bond to said leadframe, said epoxide resin containing a mold release agent.
Claim 3
Dependent Claim
20 words
The casing as in claim 1 wherein said plastic material comprises an epoxide resin formulated as a thermosetting encapsulating epoxy.
Claim 4
Dependent Claim
25 words
The casing as in claim 2 wherein said plastic material comprising an epoxide resin further contains inert fillers to provide dimensional stability to said casing.
Claim 5
Dependent Claim
16 words
The casing as in claim 3 wherein said mold release agent comprises low melting temperature organics.
Claim 6
Dependent Claim
23 words
The casing as in claim 4 wherein said mold release agent is selected from the group consisting of silicones, stearates and fatty acids.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-06-03 | 1988-12-03 | 1989-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-06-03 | 1992-12-03 | 1993-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-06-03 | 1996-12-03 | 1997-06-04 | $7700.00 | Window Closed / Lapsed |