Patent US4521469A successfully refreshed from Google Patents.
US4521469A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Casing for electronic components
Assignee: Olin Corp
•
Filing: 1984-05-31
•
Granted: 1985-06-04
•
Expires: 2004-05-31
Abstract
Abstract A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
Inventors
- 👤 Sheldon H. Butt
- 👤 Edward F. Smith, III
- 👤 F. Dennis Gyurina
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 17:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; H05K3/385; H10; H10W; H10W74/00; H10W74/40; H10W74/47; Y; Y10; Y10T; Y10T428/00; Y10T428/13; Y10T428/1352; Y10T428/1355; Y10T428/1359; Y10T428/23; Y10T428/239; Y10T428/31504; Y10T428/31511; Y10T428/31529
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
73 words
A casing adapted to contain an electrical or electronic component, comprising: a copper or copper alloy leadframe; an adhesion primer on the surface of said leadframe, said adhesion primer comprising a substantially uniform glassy and substantially pore-free phosphate coating; and a plastic material comprising an epoxide resin bonded to said leadframe to form said casing, said resin forming a strong adhesive bond to said leadframe, said epoxide resin containing a mold release agent.
Claim 2
Dependent Claim
73 words
A casing adapted to contain an electrical or electronic component, comprising: a copper or copper alloy leadframe; an adhesion primer on the surface of said leadframe, said adhesion primer comprising a substantially uniform glassy and substantially pore-free phosphate coating; and a plastic material comprising an epoxide resin bonded to said leadframe to form said casing, said resin forming a strong adhesive bond to said leadframe, said epoxide resin containing a mold release agent.
Claim 3
Dependent Claim
20 words
The casing as in claim 1 wherein said plastic material comprises an epoxide resin formulated as a thermosetting encapsulating epoxy.
Claim 4
Dependent Claim
25 words
The casing as in claim 2 wherein said plastic material comprising an epoxide resin further contains inert fillers to provide dimensional stability to said casing.
Claim 5
Dependent Claim
16 words
The casing as in claim 3 wherein said mold release agent comprises low melting temperature organics.
Claim 6
Dependent Claim
23 words
The casing as in claim 4 wherein said mold release agent is selected from the group consisting of silicones, stearates and fatty acids.
References Cited (Backward Citations)
GB771127A
Cited
US3541041A
Cited
GB1309299A
Cited
US3941627A
Cited
US3677828A
Cited
US3728178A
Cited
US3728177A
Cited
US3764399A
Cited
US3944449A
Cited
US3941628A
Cited
US3837929A
Cited
US3716427A
Cited
US3853691A
Cited
US3940303A
Cited
US3833433A
Cited
US3988284A
Cited
GB1510558A
Cited
US4143024A
Cited
US4136149A
Cited
GB2016807A
Cited
US4264379A
Cited
GB2093754A
Cited
US4356233A
Cited
US4358552A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-06-03 | 1988-12-03 | 1989-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-06-03 | 1992-12-03 | 1993-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-06-03 | 1996-12-03 | 1997-06-04 | $7700.00 | Window Closed / Lapsed |