US4702785A
Expired / Lapsed
US
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Process for manufacturing multilayer PC boards
Assignee: Von Roll Isola GmbH
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Filing: 1985-06-24
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Granted: 1987-10-27
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Expires: 2005-06-24
Abstract
Abstract A process for manufacturing multilayer printed circuit boards having conductive patterns located in three planes by assembling a stack of laminate layers with at least one prepreg between adjacent laminate layers, the laminate layers having holes around a periphery thereof for aligning the laminate layers with respect to each other. Then, the stack of laminate layers and prepregs are secured together with fastening elements, such as rivets, which deform the outermost laminate layers towards each other such that the outermost ends of the fastening elements are spaced a distance apart less than the maximum thickness of the stack. Finally, the stack of fastened laminate layers and prepregs is subjected to heat and pressure during a curing step which may follow or precede the securing step.
Inventors
- 👤 Rainer Burger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 16:12
CPC Classifications
B; B32; B32B; B32B38/00; B32B38/18; B32B38/1825; B32B38/1833; B32B38/1841; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4638; B32B2305/00; B32B2305/07; B32B2305/076; B32B2307/00; B32B2307/20; B32B2307/202; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10598; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49826; Y10T29/49947; Y10T29/49954; Y10T29/49956; Y10T29/49957; Y10T29/49972
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
145 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembling at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg to form a stack having a maximum thickness in a direction perpendicular to said planes, said laminate layers each having means disposed in an area thereof for aligning said laminate layers with respect to each other; securing said stack of laminate layers and said at least one prepreg together with fastening means located in said area of each adjacent laminate layer, said fastening means extending a distance in said direction which is less than said thickness of said stack; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 2
Dependent Claim
145 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembling at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg to form a stack having a maximum thickness in a direction perpendicular to said planes, said laminate layers each having means disposed in an area thereof for aligning said laminate layers with respect to each other; securing said stack of laminate layers and said at least one prepreg together with fastening means located in said area of each adjacent laminate layer, said fastening means extending a distance in said direction which is less than said thickness of said stack; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 3
Dependent Claim
130 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembling at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg, said laminate layers each having means disposed in an area thereof for aligning said laminate layers with respect to each other; securing said stack of lainate layers and said at least one prepreg together with fastening means located in said area of each adjacent laminate layer to deform outer-most layers of said stack towards each other in a portion thereof adjacent said fastening means; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 4
Dependent Claim
130 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembling at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg, said laminate layers each having means disposed in an area thereof for aligning said laminate layers with respect to each other; securing said stack of lainate layers and said at least one prepreg together with fastening means located in said area of each adjacent laminate layer to deform outer-most layers of said stack towards each other in a portion thereof adjacent said fastening means; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 5
Dependent Claim
152 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembly at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg, said laminate layers each having means disposed in an area adjacent a periphery thereof for aligning said laminate layers with respect to each other, and each of said laminate layers being separated from each adjacent laminate layer by a gap located between said area of each adjacent laminate layer; securing said stack of laminate layers and said least one prepreg together with fastening means located in said area of each adjacent laminate layer to hold confronting surfaces of adjacent laminate layers in contact with each other; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 6
Dependent Claim
152 words
A process for the manufacture of multilayer printed circuit boards having conductive patterns located in at least three planes, comprising: assembly at least one stack of at least two laminate layers each of which is separated from each adjacent laminate layer by at least one prepreg, said laminate layers each having means disposed in an area adjacent a periphery thereof for aligning said laminate layers with respect to each other, and each of said laminate layers being separated from each adjacent laminate layer by a gap located between said area of each adjacent laminate layer; securing said stack of laminate layers and said least one prepreg together with fastening means located in said area of each adjacent laminate layer to hold confronting surfaces of adjacent laminate layers in contact with each other; and curing said stack of laminate layers and said at least one prepreg by application of heat and pressure thereto.
Claim 7
Dependent Claim
72 words
The process of either claim 1, 2 or 3, wherein said at least one prepreg includes at least one cutout in a portion thereof which is aligned with said area of each adjacent laminate layer at which said fastening means is located, whereby said confronting surfaces of said adjacent laminate layers are brought into contact with each other during said securing step at least in said area of each adjacent laminate layer.
Claim 8
Dependent Claim
78 words
The process of either claim 1, 2 or 3, wherein said aligning means comprises a plurality of register holes in each of said laminate layers, said register holes defining an area which is larger than the area defined by the peripheral edges of said at least one prepreg, whereby said confronting surfaces of said adjacent laminate layers are brought into contact with each other during said securing step at least in said area of each adjacent laminate layer.
Claim 9
Dependent Claim
31 words
The process of either claim 1, 2 or 3, wherein said curing step includes applying pressure by means of a press to said stack without applying pressure to said fastening means.
Claim 10
Dependent Claim
46 words
The process of either claim 1, 2 or 3, wherein said fastening means comprises at least one mechanical fastening element fitted through aligned holes in said laminate layers by which said laminate layers are positioned relative to each other and are fixed relative to each other.
Claim 11
Dependent Claim
46 words
The process of either claim 1, 2 or 3, wherein said fastening means comprises a plurality of mechanical fastening elements fitted through aligned holes in said laminate layers by which said laminate layers are positioned relative to each other and are fixed relative to each other.
Claim 12
Dependent Claim
12 words
The process of claim 7, wherein said fastening element is a rivet.
Claim 13
Dependent Claim
11 words
The process of claim 8, wherein said fastening elements are rivets.
Claim 14
Dependent Claim
55 words
The process of either claim 1, 2 or 3, wherein said stack is assembled on an auxiliary device having dowel pins for positioning said laminate layers with respect to each other and said step of securing said fastening means is performed while said stack is held in position by said dowels of said auxiliary device.
Claim 15
Dependent Claim
38 words
The process of either claim 1, 2 or 3, wherein a plurality of stacks are assembled during said assembling step and said plurality of stacks are arranged one above the other and pressed together during said curing step.
Claim 16
Dependent Claim
44 words
The process of either claim 1, 2 or 3, wherein a plurality of stacks are assembled during said assembling step and said plurality of stacks are arranged in side-by-side relationship with the peripheral edges of said stacks facing one another during said curing step.
Claim 17
Dependent Claim
45 words
The process of either claim 1, 2 or 3, wherein a plurality of stacks are assembled during said assembling step and a twin-band press is used to apply pressure to said stacks as they are fed continuously to said twin-band press during said curing operation.
Claim 18
Dependent Claim
25 words
The process of either claim 1, 2 or 3, wherein said curing step is performed after said assembling step but prior to said securing step.
Claim 19
Dependent Claim
22 words
The process of either claim 1, 2 or 3, wherein said curing step is performed subsequent to said assembling and securing steps.
References Cited (Backward Citations)
US4414741A
Cited
US4506442A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-26 | 1991-04-27 | 1991-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-26 | 1995-04-27 | 1995-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-26 | 1999-04-27 | 1999-10-27 | $7700.00 | Window Closed / Lapsed |