US5956576A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enhanced protection of semiconductors with dual surface seal
Assignee: International Business Machines Corp
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Filing: 1996-09-13
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Granted: 1999-09-21
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Expires: 2016-09-13
Abstract
Abstract The present invention relates generally to a new apparatus and method for encapsulating ceramic chip carriers. More particularly, the invention encompasses an apparatus and a method for providing a fluid-tight, non-hermetic seal to a ceramic chip carrier utilizing dual surfaces. This is done by using the corner edges of the chip carrier, i.e., by using not only a minimal amount of the top-surface real estate of the chip carrier, but also the side-walls of the chip carrier to create the dual surface seal. This dual surface seal can be both hermetic and non-hermetic.
Inventors
- 👤 Hilton T. Toy
- 👤 Frank L. Pompeo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:57
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W76/10; H10W76/17; H10W76/63; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736
Claims Analysis
Total Claims: 45
Claim 1
Independent Claim
113 words
A method of mating a cover to a substrate, comprising the steps of: (a) applying at least one layer of material at at least one edge of said substrate such that said at least one layer of material covers at least a portion of horizontal and at least a portion of vertical surface of said edge, (b) placing peripheral edge of said cover over at least a portion of said at least one layer of said material, such that said at least a portion of vertical and at least a portion of horizontal surface of said peripheral edge are in direct contact with and secured to said at least one layer of material.
Claim 2
Independent Claim
113 words
A method of mating a cover to a substrate, comprising the steps of: (a) applying at least one layer of material at at least one edge of said substrate such that said at least one layer of material covers at least a portion of horizontal and at least a portion of vertical surface of said edge, (b) placing peripheral edge of said cover over at least a portion of said at least one layer of said material, such that said at least a portion of vertical and at least a portion of horizontal surface of said peripheral edge are in direct contact with and secured to said at least one layer of material.
Claim 3
Dependent Claim
21 words
The method of claim 1, wherein at least a portion of at least one surface of said substrate has electrical circuitry.
Claim 4
Dependent Claim
21 words
The method of claim 2, wherein at least a portion of said electrical circuitry is encapsulated with at least one encapsulant.
Claim 5
Dependent Claim
23 words
The method of claim 1, wherein at least one electronic device is secured to said substrate via at least one first electrical connection.
Claim 6
Dependent Claim
28 words
The method of claim 4, wherein said first electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder and high-melting point solder.
Claim 7
Dependent Claim
24 words
The method of claim 4, wherein said at least one electronic device is selected from a group consisting of electronic chip and decoupling capacitor.
Claim 8
Dependent Claim
21 words
The method of claim 1, wherein said substrate is itself secured to a card using at least one second electrical connection.
Claim 9
Dependent Claim
30 words
The method of claim 7, wherein said second electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder, high-melting point solder, pad and clip.
Claim 10
Dependent Claim
31 words
The method of claim 1, wherein said cover has an extension at the peripheral edge and wherein said extension has a lip that extends beyond said peripheral edge of said substrate.
Claim 11
Dependent Claim
26 words
The method of claim 9, wherein said peripheral edge of said cover and said peripheral edge of said substrate are joined with at least one adhesive.
Claim 12
Dependent Claim
24 words
The method of claim 10, wherein material for said at least one adhesive is selected from a group consisting of epoxy or polymeric material.
Claim 13
Dependent Claim
17 words
The method of claim 1, wherein said at least one sealband contains at least one metallization layer.
Claim 14
Dependent Claim
20 words
The method of claim 12, wherein said at least one metallization layer is surrounded by at least one heat-fusible alloy.
Claim 15
Dependent Claim
59 words
The method of claim 1, wherein said seal band comprises of at least three layers, wherein said at least one first layer is preferably molybdenum or tungsten thick film layer, said at least one second layer is at least one electrolytically deposited layer of nickel, and said at least one third layer is at least one gold plated layer.
Claim 16
Dependent Claim
75 words
An electronic device comprising a substrate, a cover, wherein said substrate and said cover are secured to each other via at least one seal band, such that said at least one seal band is at the outer peripheral edge of said substrate, and wherein at least a portion of said seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said substrate.
Claim 17
Dependent Claim
75 words
An electronic device comprising a substrate, a cover, wherein said substrate and said cover are secured to each other via at least one seal band, such that said at least one seal band is at the outer peripheral edge of said substrate, and wherein at least a portion of said seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said substrate.
Claim 18
Dependent Claim
22 words
The electronic device of claim 15, wherein at least a portion of at least one surface of said substrate has electrical circuitry.
Claim 19
Dependent Claim
22 words
The electronic device of claim 16, wherein at least a portion of said electrical circuitry is encapsulated with at least one encapsulant.
Claim 20
Dependent Claim
24 words
The electronic device of claim 15, wherein at least one electronic device is secured to said substrate via at least one first electrical connection.
Claim 21
Dependent Claim
32 words
The electronic device of claim 18, wherein said at least one first electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder and high-melting point solder.
Claim 22
Dependent Claim
25 words
The electronic device of claim 18, wherein said at least one electronic device is selected from a group consisting of electronic chip and decoupling capacitor.
Claim 23
Dependent Claim
22 words
The electronic device of claim 15, wherein said substrate is itself secured to a card using at least one second electrical connection.
Claim 24
Dependent Claim
31 words
The electronic device of claim 21, wherein said second electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder, high-melting point solder, pad and clip.
Claim 25
Dependent Claim
32 words
The electronic device of claim 15, wherein said cover has an extension at the peripheral edge and wherein said extension has a lip that extends beyond said peripheral edge of said substrate.
Claim 26
Dependent Claim
27 words
The electronic device of claim 23, wherein said peripheral edge of said cover and said peripheral edge of said substrate are joined with at least one adhesive.
Claim 27
Dependent Claim
25 words
The electronic device of claim 24, wherein material for said at least one adhesive is selected from a group consisting of epoxy or polymeric material.
Claim 28
Dependent Claim
18 words
The electronic device of claim 15, wherein said at least one sealband contains at least one metallization layer.
Claim 29
Dependent Claim
21 words
The electronic device of claim 26, wherein said at least one metallization layer is surrounded by at least one heat-fusible alloy.
Claim 30
Dependent Claim
60 words
The electronic device of claim 15, wherein said seal band comprises of at least three layers, wherein said at least one first layer is preferably molybdenum or tungsten thick film layer, said at least one second layer is at least one electrolytically deposited layer of nickel, and said at least one third layer is at least one gold plated layer.
Claim 31
Dependent Claim
151 words
An electronic device comprising a substrate, a cover, a lid, wherein said substrate and said cover are secured to each other via at least one first seal band, such that said at least one first seal band is at the outer peripheral edge of said substrate, and wherein at least a portion of said first seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said substrate, and wherein said lid and said cover are secured to each other via at least one second seal band, such that said at least one second seal band is at the inner peripheral edge of said cover, and wherein at least a portion of said second seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said cover.
Claim 32
Dependent Claim
151 words
An electronic device comprising a substrate, a cover, a lid, wherein said substrate and said cover are secured to each other via at least one first seal band, such that said at least one first seal band is at the outer peripheral edge of said substrate, and wherein at least a portion of said first seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said substrate, and wherein said lid and said cover are secured to each other via at least one second seal band, such that said at least one second seal band is at the inner peripheral edge of said cover, and wherein at least a portion of said second seal band covers at least a portion of a vertical peripheral edge and at least a portion of a horizontal peripheral edge of said cover.
Claim 33
Dependent Claim
22 words
The electronic device of claim 29, wherein at least a portion of at least one surface of said substrate has electrical circuitry.
Claim 34
Dependent Claim
22 words
The electronic device of claim 30, wherein at least a portion of said electrical circuitry is encapsulated with at least one encapsulant.
Claim 35
Dependent Claim
24 words
The electronic device of claim 29, wherein at least one electronic device is secured to said substrate via at least one first electrical connection.
Claim 36
Dependent Claim
32 words
The electronic device of claim 32, wherein said at least one first electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder and high-melting point solder.
Claim 37
Dependent Claim
25 words
The electronic device of claim 32, wherein said at least one electronic device is selected from a group consisting of electronic chip and decoupling capacitor.
Claim 38
Dependent Claim
22 words
The electronic device of claim 29, wherein said substrate is itself secured to a card using at least one second electrical connection.
Claim 39
Dependent Claim
31 words
The electronic device of claim 35, wherein said second electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder, high-melting point solder, pad and clip.
Claim 40
Dependent Claim
32 words
The electronic device of claim 29, wherein said cover has an extension at the peripheral edge and wherein said extension has a lip that extends beyond said peripheral edge of said substrate.
Claim 41
Dependent Claim
27 words
The electronic device of claim 37, wherein said peripheral edge of said cover and said peripheral edge of said substrate are joined with at least one adhesive.
Claim 42
Dependent Claim
25 words
The electronic device of claim 38, wherein material for said at least one adhesive is selected from a group consisting of epoxy or polymeric material.
Claim 43
Dependent Claim
18 words
The electronic device of claim 29, wherein said at least one sealband contains at least one metallization layer.
Claim 44
Dependent Claim
21 words
The electronic device of claim 40, wherein said at least one metallization layer is surrounded by at least one heat-fusible alloy.
Claim 45
Dependent Claim
60 words
The electronic device of claim 29, wherein said seal band comprises of at least three layers, wherein said at least one first layer is preferably molybdenum or tungsten thick film layer, said at least one second layer is at least one electrolytically deposited layer of nickel, and said at least one third layer is at least one gold plated layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-20 | 2003-03-22 | 2003-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-20 | 2007-03-22 | 2007-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-20 | 2011-03-22 | 2011-09-21 | $7700.00 | Window Closed / Lapsed |