US4291815B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic lid assembly for hermetic sealing of a semiconductor chip
Assignee: SEMICONDUCTOR PACKAGING MATERIALS CO., INC.; A CORP OF NY.
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Filing: 1980-02-19
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Granted: 1998-09-29
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Expires: 2000-02-19
Abstract
No abstract record available.
Inventors
- 👤 Richard Gordon
- 👤 John G Ciallella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 20:13
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-28 | 2002-03-30 | 2002-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-28 | 2006-03-30 | 2006-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-28 | 2010-03-30 | 2010-09-29 | $7700.00 | Window Closed / Lapsed |