US4291815A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic lid assembly for hermetic sealing of a semiconductor chip
Assignee: Semx Corp
•
Filing: 1980-02-19
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Granted: 1981-09-29
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Expires: 2000-02-19
Abstract
Abstract A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a flowed solderable layer in registration with each other in the hermetic sealing area.
Inventors
- 👤 Richard Gordon
- 👤 John G. Ciallella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:23
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
39 words
A lid assembly for hermetic sealing of a package containing a semiconductor chip comprising: a lid of dielectric material including an integral heat fusible metallic layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 2
Dependent Claim
39 words
A lid assembly for hermetic sealing of a package containing a semiconductor chip comprising: a lid of dielectric material including an integral heat fusible metallic layer deposited on said lid in a peripheral region defining a hermetic sealing area.
Claim 3
Dependent Claim
30 words
The lid assembly as set forth in claim 1 wherein said integral heat fusible layer includes a metallized heat fusible layer and a solderable heat fusible layer in registration therewith.
Claim 4
Dependent Claim
26 words
The lid assembly as set forth in claim 2 wherein said metallized layer and said solderable layer are provided as a fired printed heat fusible layer.
Claim 5
Dependent Claim
33 words
The lid assembly as set forth in claim 2 wherein said metallized layer includes a fired printed heat fusible layer and said solderable layer includes a preform of a solderable alloy flowed thereto.
Claim 6
Dependent Claim
24 words
The lid assembly as set forth in claim 2 further including an oxidation inhibiting layer disposed between said metallized layer and said solderable layer.
Claim 7
Dependent Claim
52 words
A dielectric lid assembly for hermetic sealing of a package containing a semiconnector chip comprising a ceramic lid, a printed metallized heat fusible layer deposited on said ceramic lid in a peripheral region defining a hermetic sealing area, and a solderable heat fusible layer disposed on said metallized layer in registration therewith.
Claim 8
Dependent Claim
52 words
A dielectric lid assembly for hermetic sealing of a package containing a semiconnector chip comprising a ceramic lid, a printed metallized heat fusible layer deposited on said ceramic lid in a peripheral region defining a hermetic sealing area, and a solderable heat fusible layer disposed on said metallized layer in registration therewith.
Claim 9
Dependent Claim
24 words
The lid assembly as set forth in claim 6 further including an oxidation inhibiting layer disposed between said metallized layer and said solderable layer.
Claim 10
Dependent Claim
29 words
The lid assembly as set forth in claim 6 wherein said solderable layer includes a fired printed heat fusible layer or a heat fusible preform of solder alloy composition.
Claim 11
Dependent Claim
21 words
The lid assembly as set forth in claim 6 wherein said solderable layer is a composition of lead, tin and silver.
Claim 12
Dependent Claim
20 words
The lid assembly as set forth in claim 6 wherein said metallized layer includes a composition of molybdenum and manganese.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-09-28 | 1985-03-30 | 1985-09-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-09-28 | 1989-03-30 | 1989-09-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-09-28 | 1993-03-30 | 1993-09-29 | $7700.00 | Window Closed / Lapsed |