Methods for assembling solid state devices

Claim 1

The method of connecting at least two components of an electronic, solid state device by a bonding agent bonded on surfaces of the two components, comprising the steps: placing a solid state device in a position for the connection operation, the device having two components separated by a solid bonding agent which is to connect the same together; supplying an atmosphere around the device compatible with the bonding characteristics of the bonding agent; applying infra-red energy to the device with intensity magnitude to raise the temperature of the components of the device including the bonding agent and the components to be joined respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the components continuing said application of said infra-red energy so that the bonding agent changes from solid to liquid and simultaneously applying vibratory mechanical energy to the device over a time period to cause the liquid bonding agent to flow over the surfaces on which the same is to be bonded; decreasing the said intensity magnitude in the device to lower the temperature of said components and of said bonding agent to cause the agent to solidify on said surfaces and connect the two components together; and terminating said application of vibratory mechanical energy.

Claim 2

The method of connecting at least two components of an electronic, solid state device by a bonding agent bonded on surfaces of the two components, comprising the steps: placing a solid state device in a position for the connection operation, the device having two components separated by a solid bonding agent which is to connect the same together; supplying an atmosphere around the device compatible with the bonding characteristics of the bonding agent; applying infra-red energy to the device with intensity magnitude to raise the temperature of the components of the device including the bonding agent and the components to be joined respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the components continuing said application of said infra-red energy so that the bonding agent changes from solid to liquid and simultaneously applying vibratory mechanical energy to the device over a time period to cause the liquid bonding agent to flow over the surfaces on which the same is to be bonded; decreasing the said intensity magnitude in the device to lower the temperature of said components and of said bonding agent to cause the agent to solidify on said surfaces and connect the two components together; and terminating said application of vibratory mechanical energy.

Claim 3

The method of connecting terminal pins and substrate conductors of a stack by solder bonded on surfaces of the pins and conductors comprising the steps: placing a stack in position for the connection operation, the stack having a plurality of substrates supported on common terminal pins with some of the pins mounting a separator having a solder surface in engagement with a conductor on one of the substrates and in engagement with the terminal pin on which it is mounted, the solder on each said separator to be bonded to said engaged surfaces on the conductor and terminal pin to connect the conductor and pin together; supplying an inert gas atmosphere around the stack; applying infra-red energy to the stack with intensity magnitude to raise the temperature of the components of the stack including the solder surface on each separator and the pin and the conductor with which it is engaged respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on substrates continuing said application of said infra-red energy so that the solder changes from solId to liquid and simultaneously applying vibratory mechanical energy to the stack over a time period to cause the solder to flow over the surfaces on the conductor and on the pin with which it is to be bonded; decreasing the intensity magnitude in the stack to lower the temperature of the solder of each separator and the temperature of the conductor and pin with which it is engaged to cause the solder to solidify and thereby electrically connect the conductor and pin together; and terminating said application of vibratory mechanical energy.

Claim 4

The method of connecting terminal pins and substrate conductors of a stack by solder bonded on surfaces of the pins and conductors comprising the steps: placing a stack in position for the connection operation, the stack having a plurality of substrates supported on common terminal pins with some of the pins mounting a separator having a solder surface in engagement with a conductor on one of the substrates and in engagement with the terminal pin on which it is mounted, the solder on each said separator to be bonded to said engaged surfaces on the conductor and terminal pin to connect the conductor and pin together; supplying an inert gas atmosphere around the stack; applying infra-red energy to the stack with intensity magnitude to raise the temperature of the components of the stack including the solder surface on each separator and the pin and the conductor with which it is engaged respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on substrates continuing said application of said infra-red energy so that the solder changes from solId to liquid and simultaneously applying vibratory mechanical energy to the stack over a time period to cause the solder to flow over the surfaces on the conductor and on the pin with which it is to be bonded; decreasing the intensity magnitude in the stack to lower the temperature of the solder of each separator and the temperature of the conductor and pin with which it is engaged to cause the solder to solidify and thereby electrically connect the conductor and pin together; and terminating said application of vibratory mechanical energy.

Claim 5

The method of connecting the base and the lid of a flat pack by solder bonded on surfaces thereof, comprising the steps: placing a flat pack in position for the connection operation, the pack having a lid and a base separated by solder which is to be bonded on a surface on the lid and on a surface on the base to connect the lid and base together; supplying an inert gas atmosphere around the device; applying infra-red energy to the flat pack with intensity magnitude to raise the temperature of the components of the flat pack including the solder, the base and the lid respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the base and lid continuing said application of said infra-red energy so that the solder changes from solid to liquid and simultaneously applying vibratory mechanical energy to the flat pack over a time period to cause the solder to flow over the surfaces of the base and lid on which the solder is to be bonded; decreasing the intensity magnitude in the flat pack to lower the temperature of the base, the lid and the solder to cause the solder to solidify on said surfaces and connect the base and lid together, the connection making a hermetic seal; and terminating said application of vibratory mechanical energy.

Claim 6

The method of connecting the base and the lid of a flat pack by solder bonded on surfaces thereof, comprising the steps: placing a flat pack in position for the connection operation, the pack having a lid and a base separated by solder which is to be bonded on a surface on the lid and on a surface on the base to connect the lid and base together; supplying an inert gas atmosphere around the device; applying infra-red energy to the flat pack with intensity magnitude to raise the temperature of the components of the flat pack including the solder, the base and the lid respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the base and lid continuing said application of said infra-red energy so that the solder changes from solid to liquid and simultaneously applying vibratory mechanical energy to the flat pack over a time period to cause the solder to flow over the surfaces of the base and lid on which the solder is to be bonded; decreasing the intensity magnitude in the flat pack to lower the temperature of the base, the lid and the solder to cause the solder to solidify on said surfaces and connect the base and lid together, the connection making a hermetic seal; and terminating said application of vibratory mechanical energy.

Claim 7

The method of connecting the lid and base of a flat pack by glass frit bonded on surfaces thereof, comprising the steps: placing a flat pack in position for the connection operation, the pack having a lid and a base separated by glass frit which is to be bonded on a surface on the lid and on a surface on the base to connect the lid and base together; applying an atmosphere around the device; applying infra-red energy to the flat pack with intensity magnitude to raise the temperature of the components of the flat pack including the glass frit, the base and the lid respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the base and lid continuing said application of said infra-red energy so that the glass frit changes from solid to liquid and simultaneously applying vibratory mechanical energy to the flat pack over a time period to cause the glass frit to flow over the surfaces of the base and lid on which the glass frit is to be bonded; decreasing the intensity magnitude in the flat pack to lower the temperature of the base, the lid and the glass frit to cause the glass frit to solidify on said surfaces and connect the base and lid together, the connection making a hermetic seal; and terminating said application of vibratory mechanical energy. 5. The method of connecting at least two components of an electronic, solid state device by a bonding agent bonded on surfaces of the two components, comprising the steps: placing a solid state device in a position for the connection operation, the device having two components separated by a solid bonding agent which is to connect the same together; supplying an atmosphere around the device compatible with the bonding characteristics of the bonding agent; applying infra-red energy to the device with intensity magnitude to raise the temperature of the components of the device including the bonding agent and the components to be joined respectively at rates and to levels in a manner to pre-hEat the components and avoid damage by thermal shock; while maintaining holding pressure on the components continuing said application of said infra-red energy so that the bonding agent changes from solid to liquid and through a liquid medium simultaneously applying vibratory mechanical energy to the device over a time period to cause the liquid bonding agent to flow over the surfaces on which the same is to be bonded; decreasing the said intensity magnitude in the device to lower the temperature of said components and of said bonding agent to cause the agent to solidify on said surfaces and connect the two components together; and terminating said application of vibratory mechanical energy.

Claim 8

The method of connecting the lid and base of a flat pack by glass frit bonded on surfaces thereof, comprising the steps: placing a flat pack in position for the connection operation, the pack having a lid and a base separated by glass frit which is to be bonded on a surface on the lid and on a surface on the base to connect the lid and base together; applying an atmosphere around the device; applying infra-red energy to the flat pack with intensity magnitude to raise the temperature of the components of the flat pack including the glass frit, the base and the lid respectively at rates and to levels in a manner to pre-heat the components and avoid damage by thermal shock; while maintaining holding pressure on the base and lid continuing said application of said infra-red energy so that the glass frit changes from solid to liquid and simultaneously applying vibratory mechanical energy to the flat pack over a time period to cause the glass frit to flow over the surfaces of the base and lid on which the glass frit is to be bonded; decreasing the intensity magnitude in the flat pack to lower the temperature of the base, the lid and the glass frit to cause the glass frit to solidify on said surfaces and connect the base and lid together, the connection making a hermetic seal; and terminating said application of vibratory mechanical energy. 5. The method of connecting at least two components of an electronic, solid state device by a bonding agent bonded on surfaces of the two components, comprising the steps: placing a solid state device in a position for the connection operation, the device having two components separated by a solid bonding agent which is to connect the same together; supplying an atmosphere around the device compatible with the bonding characteristics of the bonding agent; applying infra-red energy to the device with intensity magnitude to raise the temperature of the components of the device including the bonding agent and the components to be joined respectively at rates and to levels in a manner to pre-hEat the components and avoid damage by thermal shock; while maintaining holding pressure on the components continuing said application of said infra-red energy so that the bonding agent changes from solid to liquid and through a liquid medium simultaneously applying vibratory mechanical energy to the device over a time period to cause the liquid bonding agent to flow over the surfaces on which the same is to be bonded; decreasing the said intensity magnitude in the device to lower the temperature of said components and of said bonding agent to cause the agent to solidify on said surfaces and connect the two components together; and terminating said application of vibratory mechanical energy.