Hermetic sealing cover for a container for semiconductor devices
Abstract
Abstract A cover unit for hermetically sealing a container for a semiconductor device comprises a metallic cover element, a preformed ring of substantially chemically unreacted thermosetting plastic and a preformed ring of an alloy consisting of about 63% tin and 37% lead having the characteristic that it solidifies from the fluid state as a homogeneous mixture and a relatively thin oxidation-resistant coating clad on the ring and consisting of about 96.5% tin and 3.5% silver. One of the rings is disposed substantially in registry with the periphery of the cover element and the other of the rings is nested closely inside the one ring. Each of the rings may be either rectangular or circular in cross-section. Upon heating the cover units, the two rings are fused to each other, to the cover element, and to the container being sealed.
Inventors
- 👤 Norman Hascoe
Bibliographic Details
Claims Analysis
Total Claims: 10References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-03-11 | 1983-09-10 | 1984-03-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-03-11 | 1987-09-10 | 1988-03-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-03-11 | 1991-09-10 | 1992-03-11 | $7700.00 | Window Closed / Lapsed |