US5064782A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1990-04-06
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Granted: 1991-11-12
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Expires: 2010-04-06
Abstract
Abstract A semiconductor device package is disclosed which includes (1) a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, (2) a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and (3) an adhesive which is applied between the adhesion layer of the carrier body and the cap and which becomes hardened after at least one of the carrier body and the cap is pivoted about an axis coaxial with the annular adhesion layer to eliminate voids in the adhesive and to improve the sealing properties of the package.
Inventors
- 👤 Masanori Nishiguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:58
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W76/00; H10W76/60; H10W95/00; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
136 words
A sealing method for a semiconductor device package, comprising: (a) mounting a semiconductor device chip on a package body having an annular adhesion layer formed thereon, applying an adhesive to said adhesion layer, and thereafter mounting a lid having an annular adhesion layer formed thereon on said package body through a sealing solder film to cause said annular adhesion layer of said package body to overlap said annular adhesion layer of said lid; (b) urging at least one of said package body and said lid against the other of said package body and said lid to hermetically seal said package body; and (c) pivoting one of said package body and said lid about a substantially central axis of one of said annular adhesion layer of said lid and said annular adhesion layer of said package body.
Claim 2
Dependent Claim
136 words
A sealing method for a semiconductor device package, comprising: (a) mounting a semiconductor device chip on a package body having an annular adhesion layer formed thereon, applying an adhesive to said adhesion layer, and thereafter mounting a lid having an annular adhesion layer formed thereon on said package body through a sealing solder film to cause said annular adhesion layer of said package body to overlap said annular adhesion layer of said lid; (b) urging at least one of said package body and said lid against the other of said package body and said lid to hermetically seal said package body; and (c) pivoting one of said package body and said lid about a substantially central axis of one of said annular adhesion layer of said lid and said annular adhesion layer of said package body.
Claim 3
Dependent Claim
38 words
A sealing method for a semiconductor device package according to claim 1, wherein a center of said annular adhesion layer of said package body is substantially aligned with a center of said annular adhesion layer of said lid.
Claim 4
Dependent Claim
42 words
A sealing method for a semiconductor device package according to claim 1, wherein said annular adhesion layer of said lid and said annular adhesion layer of said package body are Au/Ni plating layers and said sealing solder film is an Au/Sn alloy.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-11 | 1995-05-13 | 1995-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-11 | 1999-05-13 | 1999-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-11 | 2003-05-13 | 2003-11-12 | $7700.00 | Window Closed / Lapsed |