US4833102A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of making a ceramic lid for use in a hermetic seal package
Assignee: National Semiconductor Corp
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Filing: 1988-06-09
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Granted: 1989-05-23
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Expires: 2008-06-09
Abstract
Abstract A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be inspected by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.
Inventors
- 👤 Robert C. Byrne
- 👤 Jon T. Ewanich
- 👤 Chee-Men Yu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 05:18
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/14; H; H10; H10W; H10W76/00; H10W76/60; H10W95/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W76/10; H10W76/17; H10W76/18; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
122 words
A process for fabricating a ceramic lid to be used in forming the closure seal in a hermetic ceramic package, said process including the steps: starting with a ceramic slab having flat opposing faces; forming a series of recesses in a first face of said slab that extend only part way through said slab, said recesses having a substantial predetermined width, said recesses being formed to outline a plurality of said ceramic lid structures; applying a layer of metallization to said first face after said recesses are formed therein so that said recesses are metallized; and cutting said wafer apart inside the confines of said recesses to form a plurality of individual lids having metallization in the thus produced peripheral edge recesses.
Claim 2
Dependent Claim
122 words
A process for fabricating a ceramic lid to be used in forming the closure seal in a hermetic ceramic package, said process including the steps: starting with a ceramic slab having flat opposing faces; forming a series of recesses in a first face of said slab that extend only part way through said slab, said recesses having a substantial predetermined width, said recesses being formed to outline a plurality of said ceramic lid structures; applying a layer of metallization to said first face after said recesses are formed therein so that said recesses are metallized; and cutting said wafer apart inside the confines of said recesses to form a plurality of individual lids having metallization in the thus produced peripheral edge recesses.
Claim 3
Dependent Claim
59 words
The process of claim 1 wherein said step of applying a layer of metallization comprises: forming a paste of metal particles, glass powder, binder and solvent; silk screening said paste onto said wafer; and firing said wafer to drive off said solvent and binder to leave a matrix of metal particles in a glass structure adhering to said ceramic.
Claim 4
Dependent Claim
24 words
The process of claim 2 wherein said silk screening applies said paste is applied to fully cover said first face of said ceramic slab.
Claim 5
Dependent Claim
20 words
The process of claim 2 wherein said silk screening applies to said recesses and to the immediately adjacent face portions.
Claim 6
Dependent Claim
15 words
The process of claim 1 wherein said forming step is accomplished by means of sawing.
Claim 7
Dependent Claim
30 words
The process of claim 5 wherein said cutting step is accomplished by sawing using a saw blade that is thin relative to the saw blade employed in said forming step.
Claim 8
Dependent Claim
143 words
The process for forming a closure seal in a hermetic ceramic package composed of high alumina ceramic body having a recess in a face thereof for containing an electronic device, said recess being surrounded by a metallization ring formed on said face, said process comprising the steps: forming a high alumina ceramic cap having a peripheral recess in one face thereof; forming a layer of metallization on said face of said cap wherein said recess is covered with said metallization; applying a solder preform to said ceramic body in registry with said metallization ring; placing said lid on said solder preform so that said metallization on said lid face contacts said solder preform; and firing said body with said solder preform and said lid in place so that said solder melts and secures said lid to said body to complete a hermetic seal.
Claim 9
Dependent Claim
143 words
The process for forming a closure seal in a hermetic ceramic package composed of high alumina ceramic body having a recess in a face thereof for containing an electronic device, said recess being surrounded by a metallization ring formed on said face, said process comprising the steps: forming a high alumina ceramic cap having a peripheral recess in one face thereof; forming a layer of metallization on said face of said cap wherein said recess is covered with said metallization; applying a solder preform to said ceramic body in registry with said metallization ring; placing said lid on said solder preform so that said metallization on said lid face contacts said solder preform; and firing said body with said solder preform and said lid in place so that said solder melts and secures said lid to said body to complete a hermetic seal.
Claim 10
Dependent Claim
36 words
The process of claim 7 wherein said metallization is composed of metal particles in a glass matrix and said solder is composed of a metal alloy that melts at a temperature compatible with said electronic device.
Claim 11
Dependent Claim
32 words
The process of claim 8 wherein said electronic device is a silicon integrated circuit, said metallization is composed of palladium-silver alloy particles and said solder alloy is composed of gold and tin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-22 | 1992-11-21 | 1993-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-22 | 1996-11-21 | 1997-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-22 | 2000-11-21 | 2001-05-23 | $7700.00 | Window Closed / Lapsed |