US4999699A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder interconnection structure and process for making
Assignee: International Business Machines Corp
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Filing: 1990-03-14
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Granted: 1991-03-12
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Expires: 2010-03-14
Abstract
Abstract Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
Inventors
- 👤 Frederick R. Christie
- 👤 Kostas I. Papathomas
- 👤 David W. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 07:21
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/285; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31547
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
154 words
A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 31 microns and being substantially free of alpha particle emissions; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 2
Dependent Claim
154 words
A solder interconnection for forming connections between an integrated semiconductor device and a carrier substrate comprising a plurality of solder connections that extend from the carrier substrate to electrodes on said semiconductor device to form a gap between said carrier substrate and the semiconductor device, wherein said gap is filled with a composition obtained from curing a composition containing: A. a binder selected from the group of cycloaliphatic polyepoxide, cyanate ester, prepolymer of cyanate ester and mixtures thereof, said binder having a viscosity at room temperature of no greater than about 1,000 centipoise; B. filler having a maximum particle size of 31 microns and being substantially free of alpha particle emissions; wherein the amount of A is about 60 to about 25% by weight of the total of A and B and correspondingly, the amount of B is about 40 to about 75 percent by weight based upon the amount of A and B.
Claim 3
Dependent Claim
17 words
The solder interconnection of claim 1 wherein said gap is about 50 to about 160 microns wide.
Claim 4
Dependent Claim
23 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide selected from the group of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate and vinyl cyclohexane diepoxide.
Claim 5
Dependent Claim
16 words
The solder interconnection of claim 1 wherein said binder is a polyepoxide that includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate.
Claim 6
Dependent Claim
22 words
The solder interconnection of claim 1 wherein the viscosity of said binder at 25° C. is about 35 to about 500 centipoise.
Claim 7
Dependent Claim
28 words
The solder interconnection of claim 1 wherein said filler is an inorganic filler selected from the group of silica, quartz and fused silica, optionally treated with coupling agents.
Claim 8
Dependent Claim
20 words
The solder interconnection of claim 1 wherein said filler has emission rate of less than 0.01 alpha particles/cm 2 -hr.
Claim 9
Dependent Claim
19 words
The solder interconnection of claim 1 wherein said filler has particle sizes of about 0.5 to about 20 micrometers.
Claim 10
Dependent Claim
29 words
The solder interconnection of claim 1 wherein said amount of said binder is about 43% by weight and said amount of said filler is correspondingly about 57% by weight.
Claim 11
Dependent Claim
19 words
The solder interconnection of claim 1 wherein said composition also includes an anhydride of an organic carboxylic acid hardener.
Claim 12
Dependent Claim
19 words
The solder interconnection of claim 10 wherein said hardener includes hexahydrophthalic anhydride or methyl hexahydrophthalic anhydride or mixtures thereof.
Claim 13
Dependent Claim
19 words
The solder interconnection of claim 10 wherein the amount of the hardener is about 89 to about 110 phr.
Claim 14
Dependent Claim
22 words
The solder interconnection of claim 1 wherein the viscosity at 25° C. of said composition is about 3,000 to about 17,000 centipoise.
Claim 15
Dependent Claim
13 words
The solder interconnection of claim 1 wherein said composition also includes a catalyst.
Claim 16
Dependent Claim
23 words
The solder interconnection of claim 1 wherein said composition also includes ethylene glycol in an amount of about 0.5 to about 2 phr.
Claim 17
Dependent Claim
15 words
The solder interconnection of claim 1 wherein said composition is free of unreactive organic solvents.
Claim 18
Dependent Claim
14 words
The solder interconnection of claim 1 wherein said composition also includes an adhesion promoter.
Claim 19
Dependent Claim
17 words
The solder interconnection of claim 1 wherein said substrate is an organic, inorganic or a composite material.
Claim 20
Dependent Claim
13 words
The solder interconnection of claim 1 wherein said binder is a cyanate ester.
Claim 21
Dependent Claim
14 words
The solder interconnection of claim 19 wherein said cyanate ester is 4,4'-ethylidene bisphenol dicyanate.
Claim 22
Dependent Claim
15 words
The solder interconnection of claim 1 wherein said gap is completely filled with said composition.
References Cited (Backward Citations)
US3401126A
Cited
US3429040A
Cited
US4195132A
Cited
US4293479A
Cited
US4118595A
Cited
US4271061A
Cited
US4258411A
Cited
US4294746A
Cited
US4370292A
Cited
US4772644A
Cited
US4517624A
Cited
US4681615A
Cited
US4644445A
Cited
US4480288A
Cited
US4514588A
Cited
US4477629A
Cited
US4529790A
Cited
US4615741A
Cited
US4720424A
Cited
US4546131A
Cited
US4604644A
Cited
US4753863A
Cited
US4683253A
Cited
US4622056A
Cited
US4701479A
Cited
US4701482A
Cited
US4701481A
Cited
US4825284A
Cited
JPS62246921A
Cited
US4740584A
Cited
US4873615A
Cited
US4744008A
Cited
US4812490A
Cited
US4766670A
Cited
US4843520A
Cited
US4810590A
Cited
US4745215A
Cited
US4855872A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-03-11 | 1994-09-10 | 1995-03-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-03-11 | 1998-09-10 | 1999-03-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-03-11 | 2002-09-10 | 2003-03-12 | $7700.00 | Window Closed / Lapsed |