US4839716A — Semiconductor packaging

Claim 1

Independent Claim 195 words

A semiconductor package for housing a semiconductor device, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surface being formed at an angle of from about 20° to about 80° with the respect to said external surface; a lid component stacked on said base component to form a cavity adapted to house a semiconductor device, said lid component having spaced parallel internal and external surfaces and a lid sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said lid sealing surface being formed at an angle of from about 20° to about 80° with respect to said external surface, said angle selected to be substantially parallel to said base sealing surface when said lid component is stacked on said base component; a leadframe disposed between the base sealing surface and the lid sealing surface; and sealing means disposed between and bonded to the base sealing surface and the lid sealing surface for sealing said semiconductor package.

Claim 2

Dependent Claim 195 words

A semiconductor package for housing a semiconductor device, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surface being formed at an angle of from about 20° to about 80° with the respect to said external surface; a lid component stacked on said base component to form a cavity adapted to house a semiconductor device, said lid component having spaced parallel internal and external surfaces and a lid sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said lid sealing surface being formed at an angle of from about 20° to about 80° with respect to said external surface, said angle selected to be substantially parallel to said base sealing surface when said lid component is stacked on said base component; a leadframe disposed between the base sealing surface and the lid sealing surface; and sealing means disposed between and bonded to the base sealing surface and the lid sealing surface for sealing said semiconductor package.

Claim 3

Dependent Claim 18 words

The semiconductor package of claim 1 wherein said first and second angles are about 40° to about 70°.

Claim 4

Dependent Claim 15 words

The semiconductor package of claim 2 wherein said first and second angles are about 60°.

Claim 5

Dependent Claim 37 words

The semiconductor package of claim 2 wherein portions of the leadframe disposed between said base and lid glass sealing surfaces have a pattern formed thereon to enhance the bond strength between the sealing means and the leadframe.

Claim 6

Dependent Claim 13 words

The semiconductor package of claim 4 wherein said pattern is a knurl pattern.

Claim 7

Dependent Claim 18 words

The semiconductor package of claim 2 wherein said base and lid are formed of a metal or alloy.

Claim 8

Dependent Claim 23 words

The semiconductor package of claim 6 wherein said sealing means is selected from the group consisting of sealing glasses and polymer resin adhesives.

Claim 9

Dependent Claim 14 words

The semiconductor package of claim 7 wherein said sealing means is a sealing glass.

Claim 10

Dependent Claim 23 words

The semiconductor package of claim 6 wherein said sealing means is selected from the group consisting of sealing glasses and polymer resin adhesives.

Claim 11

Dependent Claim 40 words

The semiconductor package of claim 9 wherein an internal wall of said base component includes a lip, said lip projecting above said sealing glass to eliminate a direct line of sight path from said sealing glass to said semiconductor device.

Claim 12

Dependent Claim 188 words

A semiconductor package, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surface being formed at an angle of from about 20° to about 80° with respect to said external surface; a seal ring stacked on said base component, said seal ring having a first surface for sealing to a lid component and a glass sealing seal ring surface which extends from said corner of said package to a cavity with said package, said glass sealing seal ring surface having a third angle whereby said glass sealing seal ring surface is substantially parallel to said glass sealing base surface when said seal ring is stacked on said base component; a leadframe disposed between the glass sealing base and seal ring surfaces; a sealing glass disposed between and bonded to the glass sealing base and glass sealing seal ring surfaces; a lid component stacked onto and bonded to the first surface of the seal ring for hermetically sealing said semiconductor package.

Claim 13

Dependent Claim 188 words

A semiconductor package, comprising: a base component having spaced parallel internal and external surfaces and a base sealing surface connected to said internal and external surfaces at the outer periphery thereof and at least a portion of said base sealing surface being formed at an angle of from about 20° to about 80° with respect to said external surface; a seal ring stacked on said base component, said seal ring having a first surface for sealing to a lid component and a glass sealing seal ring surface which extends from said corner of said package to a cavity with said package, said glass sealing seal ring surface having a third angle whereby said glass sealing seal ring surface is substantially parallel to said glass sealing base surface when said seal ring is stacked on said base component; a leadframe disposed between the glass sealing base and seal ring surfaces; a sealing glass disposed between and bonded to the glass sealing base and glass sealing seal ring surfaces; a lid component stacked onto and bonded to the first surface of the seal ring for hermetically sealing said semiconductor package.

Claim 14

Dependent Claim 18 words

The semiconductor package of claim 10 wherein said base sealing surface angle is about 40° to about 70°.

Claim 15

Dependent Claim 15 words

The semiconductor package of claim 12 wherein said base sealing surface angle is about 60°.

Claim 16

Dependent Claim 39 words

The semiconductor package of claim 13 wherein the portions of the leadframe disposed between said base and seal ring glass sealing surfaces have a pattern formed thereon to enhance the bond strength between the sealing glass and the leadframe.

Claim 17

Dependent Claim 13 words

The semiconductor package of claim 14 wherein said pattern is a knurl pattern.

Claim 18

Dependent Claim 20 words

The semiconductor package of claim 11 wherein said base, seal ring and lid are formed of a metal or alloy.

Claim 19

Dependent Claim 29 words

The semiconductor package of claim 16 wherein said lid component is bonded to said seal ring with a material selected from the group consisting of adhesives, solders and glasses.

Claim 20

Dependent Claim 58 words

The semiconductor package of claim 17 wherein said seal ring comprises a first seal ring component, said first seal ring component having a first surface comprising said glass sealing seal ring surface and a second glass sealing surface extending at an angle between about 20° to about 80° with respect to the bottom surface of the base component.

Claim 21

Dependent Claim 50 words

The semiconductor package of claim 18 wherein said seal ring further comprises a second seal ring component, said second seal ring component having a third surface comprising said first surface for sealing to a lid component and a fourth surface which is substantially parallel to said second glass sealing surface.

Claim 22

Dependent Claim 49 words

The semiconductor package of claim 19 further including a second leadframe disposed between said first seal ring component and said second seal ring component; and sealing glass disposed between said first and second seal ring components for bonding said first seal ring component to said second seal ring component.

Claim 23

Dependent Claim 116 words

A hermetically sealed semiconductor casing, comprising: a base component; a lid component stacked on said base component forming an enclosure adapted to house a semiconductor device; a leadframe disposed between said base and lid components; a sealing glass disposed between said base component and said lid component to hermetically seal said semiconductor casing; a flanged cup affixed to said base component projecting above the height of said sealing glass located in said enclosure to deflect the path of alpha radiation emitted from said sealing glass whereby the soft error effect from alpha radiation impinging on a semiconductor device is reduced; and a sealing glass on said flanged cup for supporting the inner end of the leadframe.

Claim 24

Dependent Claim 116 words

A hermetically sealed semiconductor casing, comprising: a base component; a lid component stacked on said base component forming an enclosure adapted to house a semiconductor device; a leadframe disposed between said base and lid components; a sealing glass disposed between said base component and said lid component to hermetically seal said semiconductor casing; a flanged cup affixed to said base component projecting above the height of said sealing glass located in said enclosure to deflect the path of alpha radiation emitted from said sealing glass whereby the soft error effect from alpha radiation impinging on a semiconductor device is reduced; and a sealing glass on said flanged cup for supporting the inner end of the leadframe.

Claim 25

Dependent Claim 18 words

The semiconductor casing of claim 21 wherein said base and lid components are constructed of metal or alloy.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1992-06-12	1992-12-12	1993-06-13	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1996-06-12	1996-12-12	1997-06-13	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2000-06-12	2000-12-12	2001-06-13	$7700.00	Window Closed / Lapsed

Semiconductor packaging

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