Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom

Claim 3

The method of claim 1 wherein the substrate is a ball grid array substrate.

Claim 4

The method of claim 1 wherein said positioning is with adhesive.

Claim 5

The method of claim 1 wherein said electrically connecting uses wire bonds.

Claim 6

The method of claim 4 wherein said applying includes the encapsulant completely covering the wire bonds and the die.

Claim 7

The method of claim 1 wherein the encapsulant is Hysol encapsulant.

Claim 8

The method of claim 1 further comprising after said applying, screwing a heat sink into an operative cooling position in the threaded opening.

Claim 9

The method of claim 1 wherein the substrate is a ball grid array substrate, and further comprising after said applying, reflowing the solder balls of the ball grid array onto a motherboard.

Claim 10

The method of claim 8 further comprising after said applying, screwing a heat sink into an operative cooling position in the threaded opening.

Claim 11

The method of claim 9 further comprising after said screwing and reflowing steps, unscrewing and removing the heat sink from the lock ring.

Claim 12

The method of claim 10 further comprising after said removing, heating the solder balls and removing the substrate and die from the motherboard.

Claim 13

The method of claim 11 wherein said heating includes positioning a repair station over the substrate.

Claim 14

The method of claim 12 wherein said heating includes directing hot nitrogen gas via the repair station to the solder balls.

Claim 15

The method of claim 1 wherein said electrically connecting includes wire bonding the die onto the substrate.

Claim 16

A process for removing a ball grid array package off of an underlying board, said process comprising the steps of: providing a die with top and bottom surfaces; providing an integrated circuit package having a BGA substrate, the die on the substrate, and a lock ring mounted on the substrate, the lock ring having a threaded opening around the die such that the area of the opening, as measured in a plane parallel to the top surface of the die, is greater than the area of the top surface of the die; providing a board on which the BGA substrate is mounted; providing a heat sink removably threaded in an operative cooling position into the threaded opening; unscrewing the heat sink out of the threaded opening and then separating the unscrewed heat sink from the package; after said separating, positioning a repair station over the package; directing gas via the positioned repair station to solder balls of the BGA substrate, the gas being sufficiently hot to at least partially melt the solder balls, and thereby heating same; and after said heating, removing the package from the board.

Claim 17

A process for removing a ball grid array package off of an underlying board, said process comprising the steps of: providing a die with top and bottom surfaces; providing an integrated circuit package having a BGA substrate, the die on the substrate, and a lock ring mounted on the substrate, the lock ring having a threaded opening around the die such that the area of the opening, as measured in a plane parallel to the top surface of the die, is greater than the area of the top surface of the die; providing a board on which the BGA substrate is mounted; providing a heat sink removably threaded in an operative cooling position into the threaded opening; unscrewing the heat sink out of the threaded opening and then separating the unscrewed heat sink from the package; after said separating, positioning a repair station over the package; directing gas via the positioned repair station to solder balls of the BGA substrate, the gas being sufficiently hot to at least partially melt the solder balls, and thereby heating same; and after said heating, removing the package from the board.

Claim 18

The process of claim 15 wherein the heated fluid is hot nitrogen gas.

Claim 19

The process of claim 15 wherein said removing is with the repair station removed from the package.

Claim 20

The process of claim 15 wherein the package includes encapsulant covering the die and securing the lock ring to the substrate.

Claim 21

The process of claim 15 wherein the lock ring is an electric box lock nut.

Claim 22

The process of claim 15 wherein before said unscrewing, the package is in need of repair, and further comprising after said removing, repairing the package.