Patent US2469791A successfully refreshed from Google Patents.
US5555488A
Expired / Lapsed
US
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Integrated circuit device having improved post for surface-mount package
Assignee: Texas Instruments Inc
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Filing: 1993-01-21
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Granted: 1996-09-10
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Expires: 2013-01-21
Abstract
Abstract An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (4 14) can be connected to PCB (18) by surfacing-mounting techniques or the like.
Inventors
- 👤 Robert N. McLellan
- 👤 Anthony M. Chiu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H10; H10W; H10W76/00; H10W76/10; H05K3/303; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10454; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10696; H05K2203/00; H05K2203/16; H05K2203/167; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49139
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
107 words
An integrated circuit device having an improved post for surface-mount packaging, said device comprising: an integrally molded package encapsulating a semiconductor die, said package presenting a lengthwise molding plane; a plurality of lead fingers extending from at least one edge of said package, said lead fingers electrically connected to said die; and a plurality of posts integral with said package and extending from said at least one edge of said package, said posts asymmetrically shaped about said lengthwise molding plane to fit into holes in a printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to the printed circuit board.
Claim 2
Dependent Claim
107 words
An integrated circuit device having an improved post for surface-mount packaging, said device comprising: an integrally molded package encapsulating a semiconductor die, said package presenting a lengthwise molding plane; a plurality of lead fingers extending from at least one edge of said package, said lead fingers electrically connected to said die; and a plurality of posts integral with said package and extending from said at least one edge of said package, said posts asymmetrically shaped about said lengthwise molding plane to fit into holes in a printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to the printed circuit board.
Claim 3
Dependent Claim
22 words
The device of claim 1 wherein at least one of said posts is formed on one side of said lengthwise molding plane.
Claim 4
Dependent Claim
21 words
The device of claim 1 wherein said package substantially includes synthetic resin material molded around said die and bonded lead fingers.
Claim 5
Dependent Claim
21 words
The device of claim 1 wherein said lead fingers are bent to present a face perpendicular to said lengthwise molding plane.
Claim 6
Dependent Claim
140 words
An electronic circuit board system comprising: a printed circuit board having a plurality of holes; and a plurality of integrated circuit devices mounted on said board, at least one of said devices edge-mounted on said board; said at least one device including: a package molded around a semiconductor die, said package presenting a lengthwise molding plane; a plurality of lead fingers extending from at least one edge of said package, said lead fingers electrically connected to said die; and a plurality of posts integral with said package extending from said at least one edge of said package, at least one of said posts asymmetrically shaped about said lengthwise molding plane to fit into one of said holes in said printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to said printed circuit board.
Claim 7
Dependent Claim
140 words
An electronic circuit board system comprising: a printed circuit board having a plurality of holes; and a plurality of integrated circuit devices mounted on said board, at least one of said devices edge-mounted on said board; said at least one device including: a package molded around a semiconductor die, said package presenting a lengthwise molding plane; a plurality of lead fingers extending from at least one edge of said package, said lead fingers electrically connected to said die; and a plurality of posts integral with said package extending from said at least one edge of said package, at least one of said posts asymmetrically shaped about said lengthwise molding plane to fit into one of said holes in said printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to said printed circuit board.
Claim 8
Dependent Claim
21 words
The system of claim 5 wherein said at least one post is formed on one side of said lengthwise molding plane.
Claim 9
Dependent Claim
48 words
The system of claim 5 wherein said devices are edge-mounted devices parallel to one another, and each device has a package encapsulating a semiconductor die, said package presenting a lengthwise molding plane, and each device further includes at least one post asymmetrically shaped about said lengthwise molding plane.
Claim 10
Dependent Claim
127 words
A semiconductor packaged device, comprising: a semiconductor die encapsulated in a molded package formed of two integral portions mated at a lengthwise mold juncture; a plurality of lead fingers, at least some of which extend from an edge of said package and are electrically connected to said die; and at least one post extending from said edge beyond said at least some lead fingers and from only one of the integral portions, integral therewith; said at least one post being dimensioned and configured relative to said lead fingers so that said at least one post can be fitted into a hole in a printed circuit board for mechanically positioning and supporting said package while said lead fingers are electrically connected to a facing surface of said board.
Claim 11
Dependent Claim
127 words
A semiconductor packaged device, comprising: a semiconductor die encapsulated in a molded package formed of two integral portions mated at a lengthwise mold juncture; a plurality of lead fingers, at least some of which extend from an edge of said package and are electrically connected to said die; and at least one post extending from said edge beyond said at least some lead fingers and from only one of the integral portions, integral therewith; said at least one post being dimensioned and configured relative to said lead fingers so that said at least one post can be fitted into a hole in a printed circuit board for mechanically positioning and supporting said package while said lead fingers are electrically connected to a facing surface of said board.
Claim 12
Dependent Claim
29 words
The device of claim 8 wherein said mold juncture is a lengthwise molding plane and said at least one post has a surface coincident with said lengthwise molding plane.
Claim 13
Dependent Claim
42 words
The device of claim 9 wherein said post has a tip with generally trapezoidal cross-section and three tapered tip surfaces, with said coincident surface forming a base and said tapered tip surfaces respectively forming a top and sides of said trapezoidal cross-section.
Claim 14
Dependent Claim
92 words
The device of claim 10, in combination with said printed circuit board and hole, said hole having a diameter, and said tapered surfaces being dimensioned and configured so that when said at least one post is fitted within said hole, said trapezoidal cross-section has an effective diameter describing a circle whose perimeter is less than the perimeter of said hole diameter at a beginning of insertion, substantially the same as said hole perimeter at an intermediate stage of insertion, and in interference with said hole perimeter at a final stage of insertion.
Claim 15
Dependent Claim
21 words
The device of claim 10 wherein said device has two posts having the recited characteristics of said at least one post.
Claim 16
Dependent Claim
42 words
The device of claim 8 wherein said post has a tip with generally trapezoidal cross-section and three tapered tip surfaces, with said coincident surface forming a base and said tapered tip surfaces respectively forming a top and sides of said trapezoidal cross-section.
Claim 17
Dependent Claim
92 words
The device of claim 13, in combination with said printed circuit board and hole, said hole having a diameter, and said tapered surfaces being dimensioned and configured so that when said at least one post is fitted within said hole, said trapezoidal cross-section has an effective diameter describing a circle whose perimeter is less than the perimeter of said hole diameter at a beginning of insertion, substantially the same as said hole perimeter at an intermediate stage of insertion, and in interference with said hole perimeter at a final stage of insertion.
Claim 18
Dependent Claim
105 words
An integrated circuit device, comprising: a package encapsulating a semiconductor die, said package including a plurality of posts integral therewith and extending from at least one edge of said package, said package presenting a lengthwise molding plane; and a plurality of lead fingers electrically connected to said die, said lead fingers extending from at least one edge of said package; at least one of said posts being only on one side of said lengthwise molding plane so as to fit into holes in a printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to a printed circuit board.
Claim 19
Dependent Claim
105 words
An integrated circuit device, comprising: a package encapsulating a semiconductor die, said package including a plurality of posts integral therewith and extending from at least one edge of said package, said package presenting a lengthwise molding plane; and a plurality of lead fingers electrically connected to said die, said lead fingers extending from at least one edge of said package; at least one of said posts being only on one side of said lengthwise molding plane so as to fit into holes in a printed circuit board for mechanically positioning and supporting said package when said lead fingers are affixed to a printed circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-10 | 2000-03-11 | 2000-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-10 | 2004-03-11 | 2004-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-10 | 2008-03-11 | 2008-09-10 | $7700.00 | Window Closed / Lapsed |