US6236568B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-dissipating structure for integrated circuit package
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 1999-12-22
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Granted: 2001-05-22
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Expires: 2019-12-22
Abstract
Abstract A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip. The heat-dissipating structure allows the integrated circuit chip to be prevented from being damaged by the thermal compressive stress from the encapsulant and the tensile stress from the silver paste for adhering the integrated circuit chip to a substrate on which the integrated circuit chip is mounted, thus allowing the integrated circuit package to be made more reliable with good yield rate.
Inventors
- 👤 Jeng Yuan Lai
- 👤 Chien Ping Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:20
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
127 words
A heat dissipating structure for use in an integrated circuit package having an integrated circuit chip for heat dissipation from the integrated circuit chip, which comprises: a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as an integrated circuit chip enclosed in an integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.
Claim 2
Dependent Claim
127 words
A heat dissipating structure for use in an integrated circuit package having an integrated circuit chip for heat dissipation from the integrated circuit chip, which comprises: a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as an integrated circuit chip enclosed in an integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.
Claim 3
Dependent Claim
27 words
The heat-dissipating structure of claim 1 , wherein the buffer pad is made of a material selected from the group consisting of ceramics, dielectrics and semiconductor material.
Claim 4
Dependent Claim
17 words
The heat-dissipating structure of claim 1 , wherein the buffer pad is a non-functioning integrated circuit chip.
Claim 5
Dependent Claim
17 words
The heat-dissipating structure of claim 1 , wherein the heat-conductive piece is made of a heat-conductive material.
Claim 6
Dependent Claim
16 words
The heat-dissipating structure of claim 1 , wherein the heat-conductive piece is substantially flat in shape.
Claim 7
Dependent Claim
56 words
The heat-dissipating structure of claim 1 , wherein the heat-conductive piece is formed with a flat portion and a leg portion downwardly bent from edges of the flat portion, with the flat portion being attached to the buffer pad and the leg portion being attached to a substrate on which the integrated circuit chip is mounted.
Claim 8
Dependent Claim
22 words
The heat-dissipating structure of claim 1 , further comprising: a second flexible adhesive layer between the heat-conductive piece and the buffer pad.
Claim 9
Dependent Claim
20 words
The heat-dissipating structure of claim 1 , wherein the flexible adhesive layer is made of an electrically-insulative but heat-conductive material.
Claim 10
Dependent Claim
19 words
The heat-dissipating structure of claim 8 , wherein the flexible adhesive layer is made of a heat-conductive polymer resin.
Claim 11
Dependent Claim
24 words
The structure of claim 1 wherein the buffer pad is fully enclosed within the integrated chip package by encapsulant and the heat conductive piece.
Claim 12
Dependent Claim
11 words
The structure of claim 10 wherein the encapsulant is a resin.
Claim 13
Dependent Claim
16 words
The structure of claim 11 wherein heat-conductive piece comprises copper, copper alloy, aluminum, or aluminum alloy.
Claim 14
Dependent Claim
20 words
The structure of claim 1 wherein an encapsulant encloses the integrated circuit, buffer pad and part of the heat-conductive piece.
Claim 15
Dependent Claim
123 words
An integrated circuit package having a heat-dissipating structure, comprising: an integrated circuit chip; a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip, wherein an encapsulant material encloses the buffer pad and a part of the heat-conductive piece.
Claim 16
Dependent Claim
123 words
An integrated circuit package having a heat-dissipating structure, comprising: an integrated circuit chip; a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip, wherein an encapsulant material encloses the buffer pad and a part of the heat-conductive piece.
Claim 17
Dependent Claim
27 words
The integrated chip package of claim 14 wherein the buffer pad is made of a material selected from the group consisting of ceramics, dielectrics and semiconductor material.
Claim 18
Dependent Claim
16 words
The integrated chip package of claim 14 wherein the heat-conductive piece is substantially flat in shape.
Claim 19
Dependent Claim
56 words
The integrated chip package of claim 14 wherein the heat-conductive piece is formed with a flat portion and a leg portion downwardly bent from edges of the flat portion, with the flat portion being attached to the buffer pad and the leg portion being attached to a substrate on which the integrated circuit chip is mounted.
Claim 20
Dependent Claim
22 words
The integrated chip package of claim 14 further comprising a second flexible adhesive layer between the heat-conductive piece and the buffer pad.
Claim 21
Dependent Claim
22 words
The integrated chip package of claim 14 wherein an encapsulant encloses the integrated circuit, buffer pad and part of the heat-conductive piece.
Claim 22
Dependent Claim
128 words
An integrated circuit package having a heat-dissipating structure, comprising: an integrated circuit chip; a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip, wherein the conductive piece first and second sides have a greater length than the buffer pad or integrated circuit chip.
Claim 23
Dependent Claim
128 words
An integrated circuit package having a heat-dissipating structure, comprising: an integrated circuit chip; a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip, wherein the conductive piece first and second sides have a greater length than the buffer pad or integrated circuit chip.
Claim 24
Dependent Claim
27 words
The integrated chip package of claim 20 wherein the buffer pad is made of a material selected from the group consisting of ceramics, dielectrics and semiconductor material.
Claim 25
Dependent Claim
16 words
The integrated chip package of claim 20 wherein the heat-conductive piece is substantially flat in shape.
Claim 26
Dependent Claim
56 words
The integrated chip package of claim 20 wherein the heat-conductive piece is formed with a flat portion and a leg portion downwardly bent from edges of the flat portion, with the flat portion being attached to the buffer pad and the leg portion being attached to a substrate on which the integrated circuit chip is mounted.
Claim 27
Dependent Claim
22 words
The integrated chip package of claim 20 further comprising a second flexible adhesive layer between the heat-conductive piece and the buffer pad.
Claim 28
Dependent Claim
22 words
The integrated chip package of claim 20 wherein an encapsulant encloses the integrated circuit, buffer pad and part of the heat-conductive piece.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-05-21 | 2004-11-20 | 2005-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-05-21 | 2008-11-20 | 2009-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-05-21 | 2012-11-20 | 2013-05-22 | $7700.00 | Window Closed / Lapsed |