US5650662A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Direct bonded heat spreader
Assignee: Aavid Thermalloy LLC
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Filing: 1994-08-19
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Granted: 1997-07-22
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Expires: 2014-08-19
Abstract
Abstract A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.
Inventors
- 👤 Steven F. Edwards
- 👤 Peter Maier
- 👤 Jurgen Shultz-Harder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:15
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
60 words
An electronic device package comprising: (a) a metal heat spreader (b) a multilayer substrate having an exposed ceramic surface and a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader; and (c) a eutectic metal-to-ceramic bond securing said heat spreader to said exposed ceramic surface of said substrate.
Claim 2
Dependent Claim
60 words
An electronic device package comprising: (a) a metal heat spreader (b) a multilayer substrate having an exposed ceramic surface and a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader; and (c) a eutectic metal-to-ceramic bond securing said heat spreader to said exposed ceramic surface of said substrate.
Claim 3
Dependent Claim
34 words
An electronic device package as defined in claim 1 wherein said heat spreader is formed of copper and said layers of plating are formed of a metal having a higher melting point than copper.
Claim 4
Dependent Claim
31 words
An electronic device package as defined in claim 2 wherein said layers of plating are formed of material selected from the group consisting of platinum, palladium, molybdenum, tungsten and alloys thereof.
Claim 5
Dependent Claim
19 words
An electronic device package as defined in claim 1 further comprising a heat sink secured to said heat spreader.
Claim 6
Dependent Claim
30 words
An electronic device package as defined in claim 4 wherein said heat sink is formed to have profiled features which increase its surface area for heat exchange with the environment.
Claim 7
Dependent Claim
30 words
An electronic device package as defined in claim 1 wherein said heat spreader overlaps substantially the entire surface of said multilayer substrate and forms a closed surface of a cavity.
Claim 8
Dependent Claim
27 words
An electronic device package as defined in claim 1 wherein said ceramic layers include particles selected from the group consisting of iron, manganese, molybdenum and combinations thereof.
Claim 9
Dependent Claim
73 words
A package for an electrical component comprising: (a) a multilayer substrate having at least two layers of ceramic and at least one layer of plating separating said layers of ceramic and having a melting point higher than that of copper; and (b) a heat spreader formed of a material selected from the group consisting of copper and copper alloys; and (c) a direct copper bond securing said heat spreader to said multilayer substrate.
Claim 10
Dependent Claim
73 words
A package for an electrical component comprising: (a) a multilayer substrate having at least two layers of ceramic and at least one layer of plating separating said layers of ceramic and having a melting point higher than that of copper; and (b) a heat spreader formed of a material selected from the group consisting of copper and copper alloys; and (c) a direct copper bond securing said heat spreader to said multilayer substrate.
Claim 11
Dependent Claim
88 words
An electronic device package comprising: (a) a metal heat spreader; (b) a multilayer substrate having an exposed ceramic surface and a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader, each of said alternating layers having a central opening cooperating to define a cavity wherein said heat spreader extends across the multilayer substrate to provide a base portion for the package; and (c) a eutectic metal-to-ceramic bond securing said heat spreader to said exposed ceramic surface.
Claim 12
Dependent Claim
88 words
An electronic device package comprising: (a) a metal heat spreader; (b) a multilayer substrate having an exposed ceramic surface and a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader, each of said alternating layers having a central opening cooperating to define a cavity wherein said heat spreader extends across the multilayer substrate to provide a base portion for the package; and (c) a eutectic metal-to-ceramic bond securing said heat spreader to said exposed ceramic surface.
Claim 13
Dependent Claim
17 words
An electronic device package as defined in claim 9 wherein said heat spreader is formed of copper.
Claim 14
Dependent Claim
21 words
An electronic device package as defined in claim 10 wherein a die is bonded to said heat spreader within said cavity.
Claim 15
Dependent Claim
29 words
An electronic device package as defined in claim 11 wherein said die has a ceramic body and a eutectic metal to ceramic bond secures said die said heat spreader.
Claim 16
Dependent Claim
84 words
An electronic device package comprising: (a) a metal heat spreader; (b) a multilayer substrate having a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader, each of said alternating layers having a central opening cooperating to define a cavity wherein said heat spreader extends across one end of said cavity to provide a base portion for the package; and c) a eutectic metal-to-ceramic bond securing said heat spreader to said multilayer substrate.
Claim 17
Dependent Claim
84 words
An electronic device package comprising: (a) a metal heat spreader; (b) a multilayer substrate having a plurality of overlapping alternating layers of ceramic and metal plating having a melting point higher than that of the heat spreader, each of said alternating layers having a central opening cooperating to define a cavity wherein said heat spreader extends across one end of said cavity to provide a base portion for the package; and c) a eutectic metal-to-ceramic bond securing said heat spreader to said multilayer substrate.
Claim 18
Dependent Claim
17 words
An electronic device package as defined in claim 13 wherein said heat spreader is formed of copper.
Claim 19
Dependent Claim
21 words
An electronic device package as defined in claim 14 wherein a die is bonded to said heat spreader within said cavity.
Claim 20
Dependent Claim
28 words
An electronic device package as defined in claim 15 wherein said die has a ceramic body and a eutectic metal-to-ceramic bond secures said die to said heat spreader.
Claim 21
Dependent Claim
76 words
Electronic devices having rapid distribution and dissipation of internally generated heat comprising in combination: (a) a die having a ceramic body with an exposed ceramic surface and plurality of terminals for connection to a substrate; (b) a copper heat spreader bonded to said exposed ceramic surface of said die with a eutectic metal to ceramic bond; and (c) components of the die having melting points higher than that of the copper in the copper heat spreader.
Claim 22
Dependent Claim
76 words
Electronic devices having rapid distribution and dissipation of internally generated heat comprising in combination: (a) a die having a ceramic body with an exposed ceramic surface and plurality of terminals for connection to a substrate; (b) a copper heat spreader bonded to said exposed ceramic surface of said die with a eutectic metal to ceramic bond; and (c) components of the die having melting points higher than that of the copper in the copper heat spreader.
Claim 23
Dependent Claim
39 words
The electronic devices having rapid distribution and dissipation of internally generated heat according to claim 17 wherein the dies are comprised of integrated circuits formed of semiconductor material having a plurality of metal terminal pads for making electrical connections.
References Cited (Backward Citations)
US4902854A
Cited
US5012386A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-21 | 2001-01-20 | 2001-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-21 | 2005-01-20 | 2005-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-21 | 2009-01-20 | 2009-07-22 | $7700.00 | Window Closed / Lapsed |