US6008988A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package with a heat spreader coupled to a pair of electrical devices
Assignee: Intel Corp
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Filing: 1997-02-25
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Granted: 1999-12-28
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Expires: 2017-02-25
Abstract
Abstract A multi-chip module which contains a heat spreader that maintains a relatively uniform temperature profile between the devices of the module. The module includes a first electronic device and a second electronic device that are both mounted to a package. The devices are electrically connected by routing within the package. A heat spreader that is thermally coupled to both devices. The heat spreader transfers the heat generated by the electronic devices so that the devices operate at approximately the same temperature. A heat slug may be attached to the heat spreader to reduce the thermal impedance of the module.
Inventors
- 👤 Mark J. Palmer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:34
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
116 words
A multi-chip module, comprising: a package that has a base portion and a plurality of bond pads; a tape automated bonding tape attached to said base portion; a first electronic device mounted and electrically connected to said tape automated bonding tape; a second electronic device that is mounted and electrically connected to said tape automated bonding tape; a plurality of bond wires that attach said first and second electronic devices to said bond pads; a lid that is attached to said package so that said first and second electronic devices are enclosed by said lid and said base portion of said package; and, a heat spreader that is mounted to said base portion of said package.
Claim 2
Dependent Claim
116 words
A multi-chip module, comprising: a package that has a base portion and a plurality of bond pads; a tape automated bonding tape attached to said base portion; a first electronic device mounted and electrically connected to said tape automated bonding tape; a second electronic device that is mounted and electrically connected to said tape automated bonding tape; a plurality of bond wires that attach said first and second electronic devices to said bond pads; a lid that is attached to said package so that said first and second electronic devices are enclosed by said lid and said base portion of said package; and, a heat spreader that is mounted to said base portion of said package.
Claim 3
Dependent Claim
24 words
The module as recited in claim 1, wherein said first electronic device is a microprocessor and said second electronic device is a cache memory.
Claim 4
Dependent Claim
19 words
A module as recited in claim 1, further comprising a heat slug that is mounted to said heat spreader.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-27 | 2003-06-28 | 2003-12-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-27 | 2007-06-28 | 2007-12-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-27 | 2011-06-28 | 2011-12-28 | $7700.00 | Window Closed / Lapsed |