US5931222A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same
Assignee: GlobalFoundries Inc
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Filing: 1997-07-30
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Granted: 1999-08-03
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Expires: 2017-07-30
Abstract
Abstract A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.
Inventors
- 👤 Hilton T. Toy
- 👤 David L. Edwards
- 👤 Da-Yuan Shih
- 👤 Ajay P. Giri
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:33
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H05; H05K; H05K7/00; H05K7/20; F; F28; F28F; F28F3/00; F28F3/02; H10W40/25; H10W40/251; H10W40/258; H10W40/70; H10W76/00; H10W76/60; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736; Y; Y10; Y10S; Y10S165/00; Y10S165/905; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12556; Y10T428/12562; Y10T428/12569
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
152 words
A heat sink assembly, comprising: a multi-chip module having a substrate and at least one integrated circuit chip mounted on a first surface of said substrate; a cap enclosing said at least one integrated circuit chip, said cap comprising a substrate cap structure containing copper and a metallic upper, exterior cap surface layer comprising nickel; means for providing thermal transmission between said at least one integrated circuit chip and said cap; a polymeric adhesive layer comprising a silicone elastomeric material; a thin adherent metal film comprising chromium located between and in direct contact with both said exterior cap surface layer and said polymeric adhesive layer, said thin adherant metal film having a thickness effective to bond said exterior cap surface layer to said polymeric adhesive layer, wherein said thin adherant metal film has a thickness of from 50 Ångstroms to 10,000 Ångstroms; and a heat sink bonded to said polymeric adhesive layer.
Claim 2
Dependent Claim
152 words
A heat sink assembly, comprising: a multi-chip module having a substrate and at least one integrated circuit chip mounted on a first surface of said substrate; a cap enclosing said at least one integrated circuit chip, said cap comprising a substrate cap structure containing copper and a metallic upper, exterior cap surface layer comprising nickel; means for providing thermal transmission between said at least one integrated circuit chip and said cap; a polymeric adhesive layer comprising a silicone elastomeric material; a thin adherent metal film comprising chromium located between and in direct contact with both said exterior cap surface layer and said polymeric adhesive layer, said thin adherant metal film having a thickness effective to bond said exterior cap surface layer to said polymeric adhesive layer, wherein said thin adherant metal film has a thickness of from 50 Ångstroms to 10,000 Ångstroms; and a heat sink bonded to said polymeric adhesive layer.
Claim 3
Dependent Claim
26 words
The heat sink assembly as in claim 1 wherein said thin adherent metal film is selected from the group consisting of chromium and alloys of chromium.
Claim 4
Dependent Claim
26 words
The heat sink assembly as in claim 1 wherein said thin adherent metal film has a thickness of from about 450 Ångstroms to about 550 Ångstroms.
Claim 5
Dependent Claim
26 words
The heat sink assembly as in claim 2 wherein said thin adherent metal film has a thickness of from about 450 Ångstroms to about 550 Ångstroms.
Claim 6
Dependent Claim
43 words
The heat sink assembly as in claim 1 wherein said at least one integrated circuit chip has a circuit side facing down and an opposite side facing up devoid of circuitry, where said circuit side is attached to said substrate via solder bumps.
Claim 7
Dependent Claim
48 words
The heat sink assembly as in claim 1 wherein said means for thermal transmission between said at least one integrated circuit chip and said cap comprises a thermal paste between an inner surface of said cap and a top surface of said at least one integrated circuit chip.
Claim 8
Dependent Claim
49 words
The heat sink assembly as in claim 6 wherein said thermal paste comprises (a) an oil selected from the group consisting of polyalpha olefin oil, hydrocarbon mineral oil, and silicone oil, and (b) a particulate filler selected from the group consisting of aluminum powder, alumina powder, and mixtures thereof.
Claim 9
Dependent Claim
20 words
The heat sink assembly as in claim 1 wherein said silicone elastomeric material comprises a room-temperature vulcanized silicone polymer adhesive.
Claim 10
Dependent Claim
23 words
The heat sink assembly as in claim 1 wherein said at least one integrated circuit chip comprises a plurality of integrated circuit chips.
Claim 11
Dependent Claim
22 words
The heat sink assembly as in claim 1 wherein said heat sink comprises an extruded aluminum plate with a plurality of fins.
Claim 12
Dependent Claim
17 words
The heat sink assembly of claim 1, wherein said substrate cap structure comprises a copper tungsten composite.
Claim 13
Dependent Claim
20 words
The heat sink assembly of claim 1, wherein said exterior cap surface layer comprising nickel is devoid of nickel oxide.
Claim 14
Dependent Claim
26 words
The heat sink assembly of claim 1, wherein said silicone elastomeric material forms a continuous layer between said heat sink and said thin adherant metal film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-02 | 2003-02-01 | 2003-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-02 | 2007-02-01 | 2007-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-02 | 2011-02-01 | 2011-08-03 | $7700.00 | Window Closed / Lapsed |