US6258629B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device package and leadframe and method for making the package
Assignee: Amkor Technology Singapore Holding Pte Ltd
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Filing: 1999-08-09
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Granted: 2001-07-10
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Expires: 2019-08-09
Abstract
Abstract The present invention includes a package for housing an integrated circuit device. The present invention also includes leadframes and methods for making such packages. The package includes an integrated circuit device on a metal die pad. A metal ring is between the die pad and leads and surrounds the die pad. The ring is connected to the die pad by a nonconductive tape. Encapsulant material covers the entire structure. The ring is connected to a lead identified for connection to an external power voltage supply. The ring in turn is connected to a power voltage input pad on the integrated circuit device. The die pad floats, or is connected to a lead that is connected to an external ground voltage. The package is made from a leadframe that has a die pad, a metal ring between the die pad and radiating leads, and a nonconductive tape that connects the ring to the die pad. In one embodiment, the leadframe and package also include a bypass or decoupling capacitor attached between the die pad and the ring.
Inventors
- 👤 Eulogia A. Niones
- 👤 Nhun Thun Kham
- 👤 Ludovico Bancod
- 👤 Yeon Ho Choi
- 👤 Sean T. Crowley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:31
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W70/421; H10W70/435; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
67 words
A method of making a leadframe comprising: providing a metal sheet; patterning the metal sheet to form a first surface, a second surface, and leads, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the leads and the first surface; and connecting the first surface and the second surface with a nonconductive connector.
Claim 2
Independent Claim
67 words
A method of making a leadframe comprising: providing a metal sheet; patterning the metal sheet to form a first surface, a second surface, and leads, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the leads and the first surface; and connecting the first surface and the second surface with a nonconductive connector.
Claim 3
Dependent Claim
38 words
The method of claim 1 , wherein patterning the metal sheet includes forming a temporary metal connector between the first surface and the second surface; and further comprising removing said temporary metal connector after connecting said nonconductive connector.
Claim 4
Dependent Claim
25 words
The method of claim 2 , wherein connecting a nonconductive connector includes applying an adhesive tape to connect the first surface and the second surface.
Claim 5
Dependent Claim
28 words
The method of claim 2 , wherein connecting the first surface and the second surface includes connecting a plurality of nonconductive connectors between the first and second surfaces.
Claim 6
Dependent Claim
38 words
The method of claim 4 , wherein a portion of at least one of the nonconductive connectors overlies the temporary metal connector, and removing said temporary metal connector also comprises removing the overlying portion of the nonconductive connector.
Claim 7
Dependent Claim
33 words
The method of claim 4 , wherein connecting a plurality of the nonconductive connectors includes applying a plurality of segments of an adhesive tape to connect the first surface and the second surface.
Claim 8
Dependent Claim
31 words
The method of claim 2 , wherein connecting a nonconductive connector includes connecting a ring of the nonconductive connector over a circumferential portion of the first surface and the second surface.
Claim 9
Dependent Claim
36 words
The method of claim 7 , wherein a portion of the ring of the nonconductive connector overlies the temporary connector, and removing said temporary metal connector also comprises removing the overlying portion of the nonconductive connector.
Claim 10
Dependent Claim
14 words
The method of claim 8 , wherein the nonconductive connector is an adhesive tape.
Claim 11
Dependent Claim
14 words
The method of claim 7 , wherein the nonconductive connector is an adhesive tape.
Claim 12
Dependent Claim
25 words
The method of claim 1 , wherein connecting a nonconductive connector includes applying an adhesive tape to connect the first surface and the second surface.
Claim 13
Dependent Claim
25 words
The method of claim 11 , wherein a plurality of segments of the adhesive tape are applied between the first surface and the second surface.
Claim 14
Dependent Claim
30 words
The method of claim 11 , wherein the adhesive tape is a ring of the adhesive tape applied over a circumferential portion of the first surface and the second surface.
Claim 15
Dependent Claim
28 words
The method of claim 1 , wherein connecting the first surface and the second surface includes connecting a plurality of nonconductive connectors between the first and second surfaces.
Claim 16
Dependent Claim
19 words
The method of claim 1 , further comprising connecting a capacitor between the first surface and the second surface.
Claim 17
Dependent Claim
25 words
The method of claim 15 , wherein connecting a nonconductive connector includes applying an adhesive tape to connect the first surface and the second surface.
Claim 18
Dependent Claim
25 words
The method of claim 16 , wherein a plurality of segments of the adhesive tape are applied between the first surface and the second surface.
Claim 19
Dependent Claim
27 words
The method of claim 16 , wherein a ring of the adhesive tape is applied over a circumferential portion of the first surface and the second surface.
Claim 20
Dependent Claim
31 words
The method of claim 1 , wherein connecting a nonconductive connector includes connecting a ring of the nonconductive connector over a circumferential portion of the first surface and the second surface.
Claim 21
Dependent Claim
14 words
The method of claim 19 , wherein the nonconductive connector is an adhesive tape.
Claim 22
Independent Claim
117 words
A method of making a package for an integrated circuit device comprising: providing a leadframe, wherein said leadframe includes a metal first surface, a metal second surface, metal leads, and a nonconductive connector, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the first surface and the leads, and the nonconductive connector connects the first surface and the second surface; placing an integrated circuit device on the first surface and electrically connecting the integrated circuit device to the leadframe; applying an encapsulant material so that the integrated circuit device and nonconductive connector are covered with the encapsulant material; and hardening the encapsulant material.
Claim 23
Independent Claim
117 words
A method of making a package for an integrated circuit device comprising: providing a leadframe, wherein said leadframe includes a metal first surface, a metal second surface, metal leads, and a nonconductive connector, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the first surface and the leads, and the nonconductive connector connects the first surface and the second surface; placing an integrated circuit device on the first surface and electrically connecting the integrated circuit device to the leadframe; applying an encapsulant material so that the integrated circuit device and nonconductive connector are covered with the encapsulant material; and hardening the encapsulant material.
Claim 24
Dependent Claim
57 words
The method of claim 21 , wherein electrically connecting the integrated circuit device to the leadframe comprises: placing a conductive first connector between the integrated circuit device and a lead; placing a conductive second connector between the integrated circuit device and the second surface; and placing a conductive third connector between a lead and the second surface.
Claim 25
Dependent Claim
14 words
The method of claim 22 , wherein the nonconductive connector is an adhesive tape.
Claim 26
Dependent Claim
18 words
The method of claim 23 , wherein the first, second, and third conductive connectors are metal bond wires.
Claim 27
Dependent Claim
28 words
The method of claim 23 , wherein the adhesive tape has the form of a ring connecting a circumferential portion of the first surface to the second surface.
Claim 28
Dependent Claim
27 words
The method of claim 23 , wherein the adhesive tape comprises a plurality of segments of the adhesive tape connecting the first surface and the second surface.
Claim 29
Dependent Claim
20 words
The method of claim 22 , further comprising placing a conductive fourth connector between the first surface and a lead.
Claim 30
Dependent Claim
18 words
The method of claim 21 , wherein said leadframe includes a lead directly connected to said second surface.
Claim 31
Dependent Claim
14 words
The method of claim 21 , wherein said nonconductive connector is an adhesive tape.
Claim 32
Dependent Claim
22 words
The method of claim 29 , wherein a capacitor is connected between said first surface and said second surface of the leadframe.
Claim 33
Dependent Claim
57 words
The method of claim 29 , wherein said leadframe includes a lead directly connected to said second surface, and electrically connecting the integrated circuit device to the leadframe comprises: placing a conductive first connector between the integrated circuit device and a lead; and placing a conductive second connector between the integrated circuit device and the second surface.
Claim 34
Dependent Claim
28 words
The method of claim 29 , wherein the adhesive tape has the form of a ring connecting a circumferential portion of the first surface to the second surface.
Claim 35
Dependent Claim
27 words
The method of claim 29 , wherein the adhesive tape comprises a plurality of segments of the adhesive tape connecting the first surface and the second surface.
Claim 36
Dependent Claim
19 words
The method of claim 21 , wherein a capacitor is connected between said first surface and said second surface.
Claim 37
Dependent Claim
29 words
The method of claim 34 , wherein the nonconductive connector comprises a ring of an adhesive tape connecting a circumferential portion of the first surface to the second surface.
Claim 38
Dependent Claim
27 words
The method of claim 34 , wherein the nonconductive connector comprises a plurality of segments of an adhesive tape connecting the first surface and the second surface.
Claim 39
Dependent Claim
57 words
The method of claim 21 , wherein said leadframe includes a lead directly connected to said second surface, and electrically connecting the integrated circuit device to the leadframe comprises: placing a conductive first connector between the integrated circuit device and a lead; and placing a conductive second connector between the integrated circuit device and the second surface.
Claim 40
Dependent Claim
16 words
The method of claim 37 , wherein the first and second conductors are metal bond wires.
Claim 41
Independent Claim
77 words
A method of making a leadframe comprising: providing a metal sheet; patterning the metal sheet to form a first surface, a second surface, and leads, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the leads and the first surface; and step for connecting the first surface and the second surface so that the first surface is electrically isolated from the second surface.
Claim 42
Independent Claim
77 words
A method of making a leadframe comprising: providing a metal sheet; patterning the metal sheet to form a first surface, a second surface, and leads, wherein the second surface surrounds the first surface, the second surface is separate from the first surface, and the second surface is between the leads and the first surface; and step for connecting the first surface and the second surface so that the first surface is electrically isolated from the second surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-09 | 2005-01-08 | 2005-07-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-09 | 2009-01-08 | 2009-07-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-09 | 2013-01-08 | 2013-07-10 | $7700.00 | Window Closed / Lapsed |