US5950074A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an integrated circuit package
Assignee: Amkor Technology Singapore Holding Pte Ltd
•
Filing: 1998-05-26
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Granted: 1999-09-07
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Expires: 2018-05-26
Abstract
Abstract A package for an integrated circuit is described, as is a method of making the package. An exemplary method of making a package for an integrated circuit die includes a first step of providing an insulating substrate having a substantially planar first surface. A conductive path extends through the substrate. Step two of the method places an integrated circuit die, such as an EEPROM or a CCD or SAW integrated circuit die, on the first surface of the substrate. Step three electrically connects the integrated circuit die to the conductive path. Step three applies an imperforate bead of a viscous adhesive material on the first surface of the substrate around the die. The bead extends to a height above the first surface of the substrate greater than the height of the integrated circuit die. Step four provides a lid having a first surface. Step five places a peripheral portion of the first surface of the lid on the bead, such that the first surface of the lid is above the first surface of the substrate and the integrated circuit die. Step six press fits the lid into the bead. Step seven hardens the bead, and thus completes the package. Epoxy is a preferred material for the bead. The lid is a single-piece of flat material, such as plastic, ceramic, or glass, which can have a diagonal edge.
Inventors
- 👤 Thomas P. Glenn
- 👤 Roy D. Hollaway
- 👤 Anthony E. Panczak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:06
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; G; G11; G11C; G11C16/00; G11C16/02; G11C16/06; G11C16/10; G11C16/18; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W76/60; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/0198; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
162 words
A method of making a package for one or more integrated circuits comprising: providing a substrate having a substantially planar first surface, and a conductive path through the substrate; placing an integrated circuit die on the first surface of said substrate, said integrated circuit die extending to a height above the first surface of the substrate; electrically connecting the integrated circuit die to the conductive path; applying a viscous adhesive material on the first surface of the substrate, forming an imperforate bead around the integrated circuit die; said bead extending to a height above the first surface of the substrate greater than the height of the integrated circuit; providing a lid with a planar first surface; placing a peripheral portion of the first surface of said lid on the bead, such that the first surface of the lid is above the first surface of the substrate and the integrated circuit die; press fitting the lid into the bead; and hardening the bead.
Claim 2
Independent Claim
162 words
A method of making a package for one or more integrated circuits comprising: providing a substrate having a substantially planar first surface, and a conductive path through the substrate; placing an integrated circuit die on the first surface of said substrate, said integrated circuit die extending to a height above the first surface of the substrate; electrically connecting the integrated circuit die to the conductive path; applying a viscous adhesive material on the first surface of the substrate, forming an imperforate bead around the integrated circuit die; said bead extending to a height above the first surface of the substrate greater than the height of the integrated circuit; providing a lid with a planar first surface; placing a peripheral portion of the first surface of said lid on the bead, such that the first surface of the lid is above the first surface of the substrate and the integrated circuit die; press fitting the lid into the bead; and hardening the bead.
Claim 3
Dependent Claim
41 words
The method of claim 1, wherein the lid includes an edge adjacent to the peripheral portion of the first surface of the lid, and the press fitting step further comprises press fitting at least part of the edge into the bead.
Claim 4
Dependent Claim
23 words
The method of claim 2, further comprising introducing an inert gas within a cavity bounded by the substrate, the bead, and the lid.
Claim 5
Dependent Claim
69 words
The method of claim 2, wherein the applying step further comprises: applying a first application of a viscous adhesive material on the first surface of the substrate to form an imperforate bead substantially around the integrated circuit, said bead having at least one discontinuity; and applying a second application of a viscous adhesive material, after the placing of said lid, filling the at least one discontinuity in the bead.
Claim 6
Dependent Claim
42 words
The method of claim 2, wherein the edge has a diagonal portion oriented relative to the first surface of the lid, and said press fitting step includes press fitting at least part of the diagonal portion of the edge into the bead.
Claim 7
Dependent Claim
15 words
The method of claim 2, wherein the adhesive material is comprised of an epoxy material.
Claim 8
Dependent Claim
12 words
The method of claim 6, wherein the lid is of one-piece construction.
Claim 9
Dependent Claim
79 words
The method of claim 1, wherein the first surface of the substrate is planar, a plurality of conductive paths extend through the substrate, and the integrated circuit die includes a plurality of conductive pads, said method further comprising electrically connecting each conductive pad to one of the conductive paths; and applying the viscous adhesive material on the first surface of the substrate so that the bead is formed around the plurality of conductive paths and the integrated circuit die.
Claim 10
Dependent Claim
17 words
The method of claim 8, wherein the lid is a one-piece structure and is transparent to light.
Claim 11
Dependent Claim
13 words
The method of claim 8, wherein the lid is a one-piece glass structure.
Claim 12
Dependent Claim
13 words
The method of claim 8, wherein the lid is a one-piece plastic structure.
Claim 13
Dependent Claim
13 words
The method of claim 8, wherein the lid is a one-piece ceramic structure.
Claim 14
Dependent Claim
17 words
The method of claim 1, wherein the lid is a one-piece structure and is transparent to light.
Claim 15
Dependent Claim
13 words
The method of claim 1, wherein the lid is a one-piece glass structure.
Claim 16
Dependent Claim
13 words
The method of claim 1, wherein the lid is a one-piece plastic structure.
Claim 17
Dependent Claim
13 words
The method of claim 1, wherein the lid is a one-piece ceramic structure.
Claim 18
Dependent Claim
17 words
The method of claim 5, wherein the lid is a one-piece structure and is transparent to light.
Claim 19
Independent Claim
121 words
A method of making a package for an integrated circuit die comprising: providing a substrate having a substantially planar first surface and a conductive path through the substrate; placing an integrated circuit die on the first surface of said substrate; electrically connecting the integrated circuit die to the conductive path; applying a bead of a viscous adhesive material on the first surface of the substrate around the integrated circuit die; providing a lid with a planar first surface; placing a peripheral portion of the first surface of said lid on the bead, such that the first surface of the lid is spaced above the first surface of the substrate and the integrated circuit die by the bead; and hardening the bead.
Claim 20
Independent Claim
121 words
A method of making a package for an integrated circuit die comprising: providing a substrate having a substantially planar first surface and a conductive path through the substrate; placing an integrated circuit die on the first surface of said substrate; electrically connecting the integrated circuit die to the conductive path; applying a bead of a viscous adhesive material on the first surface of the substrate around the integrated circuit die; providing a lid with a planar first surface; placing a peripheral portion of the first surface of said lid on the bead, such that the first surface of the lid is spaced above the first surface of the substrate and the integrated circuit die by the bead; and hardening the bead.
Claim 21
Dependent Claim
12 words
The method of claim 18, wherein the lid is of one-piece construction.
Claim 22
Dependent Claim
10 words
The method of claim 19, wherein the bead is imperforate.
Claim 23
Dependent Claim
14 words
The method of claim 20, further comprising press fitting the lid into the bead.
Claim 24
Dependent Claim
15 words
The method of claim 19, wherein the adhesive material is comprised of an epoxy material.
Claim 25
Dependent Claim
12 words
The method of claim 19, wherein the lid is transparent to light.
Claim 26
Dependent Claim
10 words
The method of claim 19, wherein the lid is plastic.
Claim 27
Dependent Claim
10 words
The page of claim 19, wherein the lid is ceramic.
Claim 28
Dependent Claim
25 words
The method of claim 20, wherein the first surface of the lid is spaced above the die by a maximum distance of about 0.04 inches.
Claim 29
Dependent Claim
82 words
The method of claim 18, wherein the first surface of the substrate is planar, a plurality of conductive paths extend through the substrate, and the integrated circuit die includes a plurality of conductive pads, and the method further comprises electrically connecting each conductive pad to one of the conductive paths; and applying the bead on the first surface of the substrate so that the bead is around the plurality of conductive paths and the integrated circuit die and the bead is imperforate.
Claim 30
Dependent Claim
17 words
The method of claim 27, wherein the lid is a one-piece structure and is transparent to light.
Claim 31
Dependent Claim
13 words
The method of claim 28, wherein the adhesive material is an epoxy material.
Claim 32
Dependent Claim
14 words
The method of claim 29, further comprising press fitting the lid into the bead.
Claim 33
Dependent Claim
13 words
The method of claim 27, wherein the lid is a one-piece glass structure.
Claim 34
Dependent Claim
13 words
The method of claim 31, wherein the adhesive material is an epoxy material.
Claim 35
Dependent Claim
13 words
The method of claim 27, wherein the lid is a one-piece plastic structure.
Claim 36
Dependent Claim
13 words
The method of claim 33, wherein the adhesive material is an epoxy material.
Claim 37
Dependent Claim
13 words
The method of claim 27, wherein the lid is a one-piece ceramic structure.
Claim 38
Dependent Claim
13 words
The method of claim 31, wherein the adhesive material is an epoxy material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-06 | 2003-03-08 | 2003-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-06 | 2007-03-08 | 2007-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-06 | 2011-03-08 | 2011-09-07 | $7700.00 | Window Closed / Lapsed |