Semiconductor device

Claim 1

A semiconductor device comprising a ceramic substrate on a surface of which is disposed a plurality of conduction parts formed of an etched film, said conduction parts having side surfaces which are substantially perpendicular to said surface of said substrate, a plurality of lead pins projecting from said substrate and connected to said conduction parts for forming input and output terminals, and an IC chip mounted on said surface of said substrate and electrically contacting said conduction parts by a plurality of contacting bumps to minimize the required spacing between adjacent conduction parts, said contacting bumps being provided on said conduction parts, said side surfaces of each of said conduction parts defining a width at a region thereof where a respective one of said contacting bumps is located, each of said bumps being no wider than said width, said contacting bumps being provided on said conduction parts, the conduction parts forming a dense pattern on the substrate, the side surfaces of adjacent conduction parts being spaced apart by a distance which is no greater than the width between the side surfaces of one of the adjacent conduction parts, the conduction parts having uppermost surfaces spaced from the substrate by a uniform height and the contacting bumps comprising electroplated conductive material having uppermost surfaces which simultaneously contact pads on the IC chip when the IC chip is mounted on the substrate.