US3589000A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for attaching integrated circuit chips to thick film circuitry
Assignee: EIDP Inc
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Filing: 1969-01-13
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Granted: 1971-06-29
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Expires: 1989-01-13
Abstract
Abstract THE NOVEL PROCESS INVOLVES A UNIQUE STEP OF MECHANICALLY FORMING METALLIC COATINGS TO A PRECISE GEOMETRY TO PROVIDE COPLANAR LANDS AND/OR PEDESTAL TERMINATIONS UTILIZES THICK FILM TECHNOLOGY WHICH FEATURES SIGNIFICANT TIME-SAVING AND COST ADVANTAGES.
Inventors
- 👤 Richard J Galli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:38
CPC Classifications
H; H10; H10W; H10W99/00; H10D; H10D84/00; H10D84/01; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H10W70/60; H10W90/00; H10W90/701; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/241; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-06-28 | 1974-12-28 | 1975-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-28 | 1978-12-28 | 1979-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-28 | 1982-12-28 | 1983-06-29 | $7700.00 | Window Closed / Lapsed |