US6097101A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for semiconductor device having frame-like molded portion and producing method of the same
Assignee: Shinko Electric Industries Co Ltd
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Filing: 1999-01-29
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Granted: 2000-08-01
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Expires: 2019-01-29
Abstract
Abstract The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.
Inventors
- 👤 Takeshi Sato
- 👤 Kenichi Sakaguchi
- 👤 Hiromi Tokunaga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:47
CPC Classifications
H; H10; H10W; H10W72/00; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/073; H10W72/075; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
93 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite thereto; a frame-like pattern composed of a wiring pattern and a chip-mounting portion, formed on the one surface of the resin substrate, and a metal portion which surrounds the wiring pattern and the chip-mounting portion; a plurality of terminals electrically connected to the wiring pattern and formed on the other surface of the resin substrate; a molded portion made of thermosetting resin, molded on the frame-like pattern of the resin substrate.
Claim 2
Dependent Claim
93 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite thereto; a frame-like pattern composed of a wiring pattern and a chip-mounting portion, formed on the one surface of the resin substrate, and a metal portion which surrounds the wiring pattern and the chip-mounting portion; a plurality of terminals electrically connected to the wiring pattern and formed on the other surface of the resin substrate; a molded portion made of thermosetting resin, molded on the frame-like pattern of the resin substrate.
Claim 3
Dependent Claim
28 words
A package for a semiconductor device according to claim 1, wherein the resin substrate and the frame-like pattern have side faces which are surrounded by the molded portion.
Claim 4
Dependent Claim
44 words
A package for a semiconductor device according to claim 1, wherein the resin substrate is substantially rectangular, and the frame-like pattern and the molded portion are in the form of a substantially rectangular box along the outer periphery of the substantially rectangular resin substrate.
Claim 5
Dependent Claim
31 words
A package for a semiconductor device according to claim 1, wherein the terminals are electrically connected to the wiring pattern through a conductor via holes which extended through the resin substrate.
Claim 6
Dependent Claim
20 words
A package for a semiconductor device according to claim 1, wherein bumps for external connection are formed on the terminals.
Claim 7
Independent Claim
94 words
A method for producing a package for a semiconductor device, comprising the steps of forming a wiring pattern, a chip-mounting portion, and a frame-like pattern of a metal surrounding the wiring pattern and the chip-mounting portion, on one surface of a resin substrate; forming a plurality of terminals electrically connected to the wiring pattern, on the other surface of the resin substrate opposite to the one surface; molding a molded portion in the form of a frame, which is made of thermosetting resin on the frame-like pattern by an injection molding or transfer molding.
Claim 8
Independent Claim
94 words
A method for producing a package for a semiconductor device, comprising the steps of forming a wiring pattern, a chip-mounting portion, and a frame-like pattern of a metal surrounding the wiring pattern and the chip-mounting portion, on one surface of a resin substrate; forming a plurality of terminals electrically connected to the wiring pattern, on the other surface of the resin substrate opposite to the one surface; molding a molded portion in the form of a frame, which is made of thermosetting resin on the frame-like pattern by an injection molding or transfer molding.
Claim 9
Dependent Claim
27 words
A method for a producing a package for a semiconductor device according to claim 6, comprising the step of forming bumps for external connection on the terminals.
Claim 10
Dependent Claim
98 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite thereto; a wiring pattern and a chip-mounting portion formed on one surface of the resin substrate; a frame-like pattern of thermosetting resin, formed on the one surface of the resin substrate to surround the wiring pattern and the chip-mounting portion; a plurality of terminals electrically connected to the wiring pattern and formed on the other surface of the resin substrate; and a molded portion of thermosetting resin molded on the frame-like pattern of the resin substrate.
Claim 11
Dependent Claim
98 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite thereto; a wiring pattern and a chip-mounting portion formed on one surface of the resin substrate; a frame-like pattern of thermosetting resin, formed on the one surface of the resin substrate to surround the wiring pattern and the chip-mounting portion; a plurality of terminals electrically connected to the wiring pattern and formed on the other surface of the resin substrate; and a molded portion of thermosetting resin molded on the frame-like pattern of the resin substrate.
Claim 12
Dependent Claim
28 words
A package for a semiconductor device according to claim 8, wherein the resin substrate and the frame-like pattern have side faces which are surrounded by the molded portion.
Claim 13
Dependent Claim
44 words
A package for a semiconductor device according to claim 8, wherein the resin substrate is substantially rectangular, and the frame-like pattern and the molded portion are in the form of a substantially rectangular frame along the outer periphery of the substantially rectangular resin substrate.
Claim 14
Dependent Claim
32 words
A package for a semiconductor device according to claim 1, wherein the terminals are electrically connected to the wiring pattern by means of conductors via holes which extend through the resin substrate.
Claim 15
Dependent Claim
20 words
A package for a semiconductor device according to claim 8, wherein bumps for external connection are formed on the terminals.
Claim 16
Independent Claim
94 words
A method for producing a package for a semiconductor device, comprising the steps of forming a wiring pattern and a chip-mounting portion on one surface of a resin substrate; forming a frame-like pattern of thermosetting resin surrounding the wiring pattern and the chip-mounting portion on the one surface of the resin substrate; forming a plurality of terminals electrically connected to the wiring pattern, on the other surface of the resin substrate opposite to the one surface; molding a frame-like molded portion of thermosetting resin on the frame-like pattern by injection molding or transfer molding.
Claim 17
Independent Claim
94 words
A method for producing a package for a semiconductor device, comprising the steps of forming a wiring pattern and a chip-mounting portion on one surface of a resin substrate; forming a frame-like pattern of thermosetting resin surrounding the wiring pattern and the chip-mounting portion on the one surface of the resin substrate; forming a plurality of terminals electrically connected to the wiring pattern, on the other surface of the resin substrate opposite to the one surface; molding a frame-like molded portion of thermosetting resin on the frame-like pattern by injection molding or transfer molding.
Claim 18
Dependent Claim
26 words
A method for producing a package for a semiconductor device according to claim 13, comprising the step of forming bumps for external connection on the terminals.
Claim 19
Dependent Claim
28 words
A method for producing a package for a semiconductor device according to claim 14, comprising the step of radiating ultraviolet light onto the frame-like pattern of thermosetting resin.
Claim 20
Dependent Claim
89 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite to the one surface; a wiring pattern and a chip-mounting portion formed on the one surface of the resin substrate; a frame-like pattern of thermosetting resin, which surrounds the wiring pattern and the chip-mounting portion; a molded portion of thermosetting resin, molded on the frame-like pattern of the resin substrate, said resin substrate being provided with holes opening at the position thereof corresponding to the wiring pattern.
Claim 21
Dependent Claim
89 words
A package for a semiconductor device with a molded portion, comprising a resin substrate having one surface and the other surface opposite to the one surface; a wiring pattern and a chip-mounting portion formed on the one surface of the resin substrate; a frame-like pattern of thermosetting resin, which surrounds the wiring pattern and the chip-mounting portion; a molded portion of thermosetting resin, molded on the frame-like pattern of the resin substrate, said resin substrate being provided with holes opening at the position thereof corresponding to the wiring pattern.
Claim 22
Dependent Claim
28 words
A package for a semiconductor device according to claim 16, wherein the resin substrate and the frame-like pattern have side faces which are surrounded by the molded portion.
Claim 23
Dependent Claim
44 words
A package for a semiconductor device according to claim 16, wherein the resin substrate is substantially rectangular, and the frame-like pattern and the molded portion are in the form of a substantially rectangular frame, along the outer periphery of the substantially rectangular resin substrate.
Claim 24
Dependent Claim
31 words
A package for a semiconductor device according to claim 16, having bumps for external connection, which partly extrude from the hole so as to be electrically connected to the wiring pattern.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-01 | 2004-01-31 | 2004-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-01 | 2008-01-31 | 2008-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-01 | 2012-01-31 | 2012-08-01 | $7700.00 | Window Closed / Lapsed |