US5679978A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having resin gate hole through substrate for resin encapsulation
Assignee: Kyushu Fujitsu Electronics Ltd
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Filing: 1994-10-24
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Granted: 1997-10-21
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Expires: 2014-10-24
Abstract
Abstract A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.
Inventors
- 👤 Toshimi Kawahara
- 👤 Shinya Nakaseko
- 👤 Mitsunada Osawa
- 👤 Shinichirou Taniguchi
- 👤 Mayumi Osumi
- 👤 Hiroyuki Ishiguro
- 👤 Yoshitugu Katoh
- 👤 Junichi Kasai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W76/00; H10W76/10; H10W76/12; H10P; H10P72/00; H10P72/70; H10P72/74; H10W42/00; H10W42/20; H10W42/261; H10W42/276; H10W70/00; H10W70/099; H10W74/016; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/01; H10W72/012; H10W72/01204; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W74/131; H10W74/142; H10W90/731; H10W90/734; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
96 words
A semiconductor device comprising: a substrate having top and bottom surfaces; a semiconductor element mounted on the top surface of said substrate; a resin package made of a resin and encapsulating said semiconductor element, said substrate including at least one resin gate hole enabling said resin to be introduced from the bottom surface of said substrate via the resin gate hole when encapsulating said semiconductor element by said resin; and a frame body surrounding a periphery of said resin package, a thickness of said frame body and a thickness of said resin being approximately the same.
Claim 2
Dependent Claim
96 words
A semiconductor device comprising: a substrate having top and bottom surfaces; a semiconductor element mounted on the top surface of said substrate; a resin package made of a resin and encapsulating said semiconductor element, said substrate including at least one resin gate hole enabling said resin to be introduced from the bottom surface of said substrate via the resin gate hole when encapsulating said semiconductor element by said resin; and a frame body surrounding a periphery of said resin package, a thickness of said frame body and a thickness of said resin being approximately the same.
Claim 3
Dependent Claim
29 words
The semiconductor device as claimed in claim 1, wherein said resin package fills a recess to which said resin gate hole opens on the bottom surface of said substrate.
Claim 4
Dependent Claim
16 words
The semiconductor device as claimed in claim 1, wherein said resin includes no mold release agent.
Claim 5
Dependent Claim
51 words
The semiconductor device as claimed in claim 1, which further comprises: a wiring layer provided on said substrate; connecting means for electrically connecting said semiconductor element and said wiring layer; and external connecting terminals provided on said wiring layer and used for electrically connecting the semiconductor device to an external element.
Claim 6
Dependent Claim
23 words
The semiconductor device as claimed in claim 4, wherein said connecting means includes wires electrically connecting said semiconductor element and said wiring layer.
Claim 7
Dependent Claim
23 words
The semiconductor device as claimed in claim 4, wherein said connecting means includes bumps electrically connecting said semiconductor element and said wiring layer.
Claim 8
Dependent Claim
17 words
The semiconductor device as claimed in claim 4, wherein said external connecting terminals include a lead member.
Claim 9
Dependent Claim
15 words
The semiconductor device as claimed in claim 4, wherein said external connecting terminals include bumps.
Claim 10
Dependent Claim
19 words
The semiconductor device as claimed in claim 4, wherein said external connecting terminals on said wiring layer include vias.
Claim 11
Dependent Claim
19 words
The semiconductor device as claimed in claim 4, wherein said wiring layer is made up of a multi-level circuit.
Claim 12
Dependent Claim
36 words
The semiconductor device as claimed in claim 10, wherein said multi-level circuit includes a stacked structure having wiping layers and insulator layers which are alternately stacked, and mechanical compressions making electrical connections among the wiring layers.
Claim 13
Dependent Claim
18 words
The semiconductor device as claimed in claim 1, wherein said substrate includes a plurality of resin gate holes.
Claim 14
Dependent Claim
107 words
The semiconductor device comprising; a substrate having top and bottom surfaces; a semiconductor element mounted on the top surface of said substrate; a resin package made of a resin and encapsulating said semiconductor element, said substrate including at least one resin gate hole enabling said resin to be introduced from the bottom surface of said substrate via the resin gate hole when encapsulating said semiconductor element by said resin; and a lid member arranged above said resin package and including a plurality of through holes, said through holes providing a passage for moisture included within the resin of said resin package to escape outside said resin package.
Claim 15
Dependent Claim
107 words
The semiconductor device comprising; a substrate having top and bottom surfaces; a semiconductor element mounted on the top surface of said substrate; a resin package made of a resin and encapsulating said semiconductor element, said substrate including at least one resin gate hole enabling said resin to be introduced from the bottom surface of said substrate via the resin gate hole when encapsulating said semiconductor element by said resin; and a lid member arranged above said resin package and including a plurality of through holes, said through holes providing a passage for moisture included within the resin of said resin package to escape outside said resin package.
Claim 16
Dependent Claim
86 words
The semiconductor device as claimed in claim 13, wherein said lid member is made of a material having a high thermal conductivity, said material being selected from a group consisting of (i) copper, aluminum, tungsten, molybdenum, clad materials of such metals, alloys of such metals and mixtures of such metals respectively having a thermal conductivity of 20 W/mk or greater, (ii) silicon nitride, aluminum nitride, alumina and composite materials of such ceramics, (iii) diamond, and (iv) composite materials of a plurality of metals, ceramics and diamond.
Claim 17
Dependent Claim
137 words
A semiconductor device comprising: a circuit; a semiconductor element having a top surface and mounted on said circuit; a frame body provided on said circuit and surrounding said semiconductor element in a state where a gap is formed between said semiconductor element and said frame body; and a resin package made of a resin filled on an inner side of said frame body and encapsulating said semiconductor element, a thickness of said resin and a thickness of said frame body being substantially the same, said frame body including a resin gate hole which opens at a surface other than a surface confronting the top surface of said semiconductor element and enabling said resin to be introduced on the inner side of said frame body via the resin gate hole when encapsulating said semiconductor element by said resin.
Claim 18
Dependent Claim
137 words
A semiconductor device comprising: a circuit; a semiconductor element having a top surface and mounted on said circuit; a frame body provided on said circuit and surrounding said semiconductor element in a state where a gap is formed between said semiconductor element and said frame body; and a resin package made of a resin filled on an inner side of said frame body and encapsulating said semiconductor element, a thickness of said resin and a thickness of said frame body being substantially the same, said frame body including a resin gate hole which opens at a surface other than a surface confronting the top surface of said semiconductor element and enabling said resin to be introduced on the inner side of said frame body via the resin gate hole when encapsulating said semiconductor element by said resin.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2000-10-20 | 2001-04-21 | 2001-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-20 | 2005-04-21 | 2005-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-20 | 2009-04-21 | 2009-10-21 | $7700.00 | Window Closed / Lapsed |