US6229200B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Saw-singulated leadless plastic chip carrier
Assignee: ASAT Inc
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Filing: 1998-06-10
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Granted: 2001-05-08
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Expires: 2018-06-10
Abstract
Abstract Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
Inventors
- 👤 Neil McLellan
- 👤 Nelson Fan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:57
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10P; H10P72/00; H10P72/70; H10P72/74; H10W70/00; H10W70/01; H10W70/04; H10W70/042; H10W70/40; H10W70/421; H10W70/424; H10W72/00; H10W72/20; H10W74/014; H10W74/10; H10W74/111; H10P72/7438; H10W44/00; H10W44/20; H10W44/226; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/0198; H10W72/071; H10W72/072; H10W72/07251; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W74/127; H10W90/00; H10W90/701; H10W90/721; H10W90/726; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
140 words
A plastic chip carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad is provided an interlocking lip at a portion of said die-attach pad, said interlocking lip engaging said die-attach pad to said encapsulation.
Claim 2
Dependent Claim
140 words
A plastic chip carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad is provided an interlocking lip at a portion of said die-attach pad, said interlocking lip engaging said die-attach pad to said encapsulation.
Claim 3
Dependent Claim
157 words
A plastic chip carrier comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing, flush with a bottom surface of said encapsulation, said bottom surface of said die-attach pad and said bottom surfaces of said leads; and a plurality of tie bars, each tie bar being attached to said die-attach pad and extending from said die-attach pad to form a peripheral heat pad for dissipating heat to the outside of said encapsulation.
Claim 4
Dependent Claim
157 words
A plastic chip carrier comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing, flush with a bottom surface of said encapsulation, said bottom surface of said die-attach pad and said bottom surfaces of said leads; and a plurality of tie bars, each tie bar being attached to said die-attach pad and extending from said die-attach pad to form a peripheral heat pad for dissipating heat to the outside of said encapsulation.
Claim 5
Dependent Claim
27 words
A plastic chip carrier as in claim 3 , wherein one of said heat pads has an appearance distinctive from other heat pads of said chip carrier.
Claim 6
Dependent Claim
147 words
A plastic chip carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing, flush with a bottom surface of said encapsulation, said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad and said leads are formed out of an array of lead frames integrally formed on a portion of a metal strip.
Claim 7
Dependent Claim
147 words
A plastic chip carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing, flush with a bottom surface of said encapsulation, said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad and said leads are formed out of an array of lead frames integrally formed on a portion of a metal strip.
Claim 8
Dependent Claim
121 words
A plastic carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad is plated with palladium.
Claim 9
Dependent Claim
121 words
A plastic carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; and an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads, wherein said die-attach pad is plated with palladium.
Claim 10
Dependent Claim
128 words
A plastic carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads; and solder balls each attached to a bottom side of a corresponding one of said leads.
Claim 11
Dependent Claim
128 words
A plastic carrier, comprising: a semiconductor die having bonding pads formed thereon; a die-attach pad having a bottom surface and a top surface on which said semiconductor die is attached; a plurality of leads, each having a bottom surface and a top surface, said leads disposed in close proximity to said die-attach pad; a plurality of wires each bonded to a selected one of said bonding pads and a corresponding one of said leads; an encapsulation encapsulating said semiconductor die, said top surface of said die attach-pad, said wires, and said top surfaces of said leads, and exposing said bottom surface of said die-attach pad and said bottom surfaces of said leads; and solder balls each attached to a bottom side of a corresponding one of said leads.
Claim 12
Dependent Claim
88 words
A metal strip of lead frames, comprising: a plurality of lead frames arranged as multiple groups of lead frames, each group of lead frames being formed on a substantially square area, each lead frame comprising: a die-attach pad; an annular row of inner leads; an annular row of outer leads connected to said annular row of inner leads by a connecting portion, wherein said die-attach pad is connected to said annular row of inner leads and said annular row of outer leads by a plurality of tie bars.
Claim 13
Dependent Claim
88 words
A metal strip of lead frames, comprising: a plurality of lead frames arranged as multiple groups of lead frames, each group of lead frames being formed on a substantially square area, each lead frame comprising: a die-attach pad; an annular row of inner leads; an annular row of outer leads connected to said annular row of inner leads by a connecting portion, wherein said die-attach pad is connected to said annular row of inner leads and said annular row of outer leads by a plurality of tie bars.
Claim 14
Dependent Claim
34 words
A metal strip as in claim 7 , wherein in said lead frame leads in said annular row of inner leads and said annular row of outer leads are arranged in an alternating fashion.
Claim 15
Dependent Claim
79 words
A lead frame, comprising: a die-attach pad; an annular row of inner leads; an annular row of outer leads connected to said annular row of inner leads by a connecting portion, wherein said die-attach pad is connected to said annular row of inner leads and said annular row of outer leads by a plurality of tie bars, wherein said connecting portion has a thickness which is half the thickness of a lead in said annular row of inner leads.
Claim 16
Dependent Claim
79 words
A lead frame, comprising: a die-attach pad; an annular row of inner leads; an annular row of outer leads connected to said annular row of inner leads by a connecting portion, wherein said die-attach pad is connected to said annular row of inner leads and said annular row of outer leads by a plurality of tie bars, wherein said connecting portion has a thickness which is half the thickness of a lead in said annular row of inner leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-05-07 | 2004-11-06 | 2005-05-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-05-07 | 2008-11-06 | 2009-05-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-05-07 | 2012-11-06 | 2013-05-08 | $7700.00 | Window Closed / Lapsed |