US5200809A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Exposed die-attach heatsink package
Assignee: SEONG CAPITAL Ltd LLC
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Filing: 1991-09-27
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Granted: 1993-04-06
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Expires: 2011-09-27
Abstract
Abstract A technique for packaging an integrated-circuit die in a conventional molded-plastic package exposes the lead frame to which the integrated-circuit die is attached so that heat-conducting columns can be directly attached to the leadframe through vias formed in the molded plastic package. The vias expose selected areas of the lead-frame to which are attached the thermally conductive columns, which extend to an exterior surface of the molded plastic package so that the lead-frame and the conductive columns provide a path for conduction of heat from the die to the exterior of the package.
Inventors
- 👤 Young I. Kwon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 01:45
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
161 words
Apparatus for cooling an integrated circuit die contained in a molded plastic package, comprising: a lead-frame having a die-attached paddle to which an integrate-circuit die is attached; a molded package, which is formed of plastic material and which is molded around said lead-frame to which said integrated-circuit die is attached, said molded package having one or more passages formed therein for respectively exposing one or more predetermined portions of the lead-frame; one or more thermally conductive column members, each respectively attached at one end to a respective one of said selected exposed portions of said lead-frame, each of said one or more thermally conductive column members extending through a passage formed in said molded package to an exterior surface of said molded package and, together with the lead-frame, providing a path for conduction of heat from the integrated-circuit die to the other end of each of said one or more thermally conductive column members at the exterior of the molded package.
Claim 2
Dependent Claim
161 words
Apparatus for cooling an integrated circuit die contained in a molded plastic package, comprising: a lead-frame having a die-attached paddle to which an integrate-circuit die is attached; a molded package, which is formed of plastic material and which is molded around said lead-frame to which said integrated-circuit die is attached, said molded package having one or more passages formed therein for respectively exposing one or more predetermined portions of the lead-frame; one or more thermally conductive column members, each respectively attached at one end to a respective one of said selected exposed portions of said lead-frame, each of said one or more thermally conductive column members extending through a passage formed in said molded package to an exterior surface of said molded package and, together with the lead-frame, providing a path for conduction of heat from the integrated-circuit die to the other end of each of said one or more thermally conductive column members at the exterior of the molded package.
Claim 3
Dependent Claim
16 words
The apparatus of claim 1 wherein said thermally conductive column members are formed of metal material.
Claim 4
Dependent Claim
20 words
The apparatus of claim 1 wherein the thermally conductive column members are attached to the lead-frame with an adhesive material.
Claim 5
Dependent Claim
20 words
The apparatus of claim 1 wherein the thermally conductive column members are attached to the lead-frame with a solder bond.
Claim 6
Dependent Claim
19 words
The apparatus of claim 1 wherein the thermally conductive column members are attached to the lead-frame with a screw-fastener.
Claim 7
Dependent Claim
24 words
The apparatus of claim 1 wherein the die-attach paddle includes a separate heat-conductive plate member to which the die and the leadframe are attached.
Claim 8
Dependent Claim
34 words
The apparatus of claim 1 further including a heatsink/spreader plate which is attached to the other ends of said one or more thermally conductive column members at the exterior surface of said molded package.
Claim 9
Dependent Claim
22 words
The apparatus of claim 7 wherein the heatsink/spreader plate includes louvers formed in the heatsink/spreader plate to provide for increased convention cooling.
Claim 10
Dependent Claim
14 words
The apparatus of claim 7 wherein the heatsink/spreader plate includes a thermo-electric heat pump.
Claim 11
Dependent Claim
24 words
The apparatus of claim 1 wherein the one or more selected exposed portions of the lead-frame are portions of tie-bars of said lead frame.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-04-05 | 1996-10-05 | 1997-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-04-05 | 2000-10-05 | 2001-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-04-05 | 2004-10-05 | 2005-04-06 | $7700.00 | Window Closed / Lapsed |