US5343076A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with an airtight space formed internally within a hollow package
Assignee: MTEX Matsumura Corp
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Filing: 1993-11-22
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Granted: 1994-08-30
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Expires: 2013-11-22
Abstract
Abstract This invention relates to a package construction of a semiconductor device, and provides a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide an excellent moisture-proofness in terms of the package construction.
Inventors
- 👤 Shigeru Katayama
- 👤 Kaoru Tominaga
- 👤 Junichi Yoshitake
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:59
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W42/00; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W76/15; H10W76/157; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
166 words
A semiconductor device comprising: a hollow package including an airtight space formed in a central portion of said hollow package; a semiconductor chip; and a vapor-impermeable moistureproof plate including an island portion connected to a lead frame by a support lead, said island portion provided in an area greater than or equal to a bottom surface of said semiconductor chip at a position lower than a surface of the lead frame and at a position lower than a bottom surface of said semiconductor chip; wherein said island portion is provided close to the bottom portion of said hollow package and at least 100 μm from a bonding surface for securing said semiconductor chip to the support lead; wherein said semiconductor chip is bonded on an inner surface of a bottom portion of said hollow package, and said vapor-impermeable moistureproof plate is placed between an outer surface and an inner surface of the bottom portion of said hollow package with a residual thickness toward the inner surface.
Claim 2
Dependent Claim
166 words
A semiconductor device comprising: a hollow package including an airtight space formed in a central portion of said hollow package; a semiconductor chip; and a vapor-impermeable moistureproof plate including an island portion connected to a lead frame by a support lead, said island portion provided in an area greater than or equal to a bottom surface of said semiconductor chip at a position lower than a surface of the lead frame and at a position lower than a bottom surface of said semiconductor chip; wherein said island portion is provided close to the bottom portion of said hollow package and at least 100 μm from a bonding surface for securing said semiconductor chip to the support lead; wherein said semiconductor chip is bonded on an inner surface of a bottom portion of said hollow package, and said vapor-impermeable moistureproof plate is placed between an outer surface and an inner surface of the bottom portion of said hollow package with a residual thickness toward the inner surface.
Claim 3
Dependent Claim
36 words
The semiconductor device of claim 1, further comprising a plate-like member, having a high heat transfer rate and an area equal to or greater than an area of said island portion, joined to said island portion.
Claim 4
Dependent Claim
34 words
The semiconductor device of claim 1, wherein said vapor-impermeable moistureproof plate is formed of material selected form a group comprising aluminum, copper, iron, oxides thereof or alloys, whose heat transfer rate is 0.01 cal/cm.sec.
Claim 5
Dependent Claim
35 words
The semiconductor device of claim 3, wherein a lead member is provided between said bonding surface and said vapor-impermeable moistureproof plate and connects said vapor-impermeable moistureproof plate to said bonding surface of said hollow package.
Claim 6
Dependent Claim
17 words
A solid image pickup device comprising said semiconductor device claimed in any of claims 2-4 or 1.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-08-29 | 1998-02-28 | 1998-08-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-08-29 | 2002-02-28 | 2002-08-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-08-29 | 2006-02-28 | 2006-08-30 | $7700.00 | Window Closed / Lapsed |