Hollow plastic package for semiconductor devices

Claim 1

A package for a semiconductor device including a semiconductor die having two major parallel surfaces and a plurality of metal pads defined on one surface thereof for electrical connections, the other surface thereof being bonded by means of a heat and electricity conducting adhesive to a central pad of a metal frame, the metal frame also having a plurality if coplanar fingers which surround the central pad at a distance therefrom and extend substantially in a radial direction, the fingers being electrically insulated from each other, each of the metal pads being connected to at least one of the fingers by means of a metal wire which is welded at its one end to the metal pad and at the other end to a relative finger of the metal frame, said package comprising: a box-like, substantially hollow shell made of a substantially rigid plastic material, said shell being formed by two corresponding parts, the two parts of said box-like shell having two spaced lateral walls forming a first inner sealing perimeter and a second outer sealing perimeter and a perimetral chamber which is formed therebetween, which surrounds a central cavity of the shell enclosing said die, said welded metal wires and at least the inner ends of said radially extending coplanar fingers, the other ends of said fingers passing outside said shell through a gap formed between opposing peripheral edges of said two spaced lateral walls of the two halves of said shell; an encapsulating plastic body molded around said box-like shell and from which the outer ends of said radially extending fingers of the metal frame project, said perimetral chamber accommodating any encapsulating resin material extruding through gaps in said outer sealing perimeter during the molding of said encapsulating resin body.