Preformed packaging arrangement for energy dissipating devices

Abstract

Abstract A packaging arrangement for energy dissipating devices includes thermal elements adjacent first and second sides of the device, and a heat-flow modifier adjacent the thermal element for regulating the flow of heat therefrom. A plurality of electrically conductive leads extend from the device to the exterior of the packaging arrangement. Portions of the electrically conductive leads extend between the thermal elements and are in thermal contact with at least one of these elements. The leads are electrically isolated from the thermal elements and a seal is maintained between the leads and the elements. An outer casing surrounds the thermal elements, and the plurality of leads extend through the outer casing to provide for connecting the device to the environment. A seal is also maintained between the outer casing and the leads. The outer casing is formed from premolded thermoplastic base and cap sections. The thermal elements and heat-flow modifiers are preferably integrally formed with the base and cap by an injection molding technique. In one embodiment, an elastomeric seal is formed on a leadframe, the leadframe/seal assembly is molded to a preformed base section of a thermoplastic housing, a thermal element is positioned on the housing adjacent the device and a portion of the leadframe, and a cap section of the housing is molded to the base and/or the leadframe/seal assembly to complete the housing.

Inventors

• 👤 Ade'yemi S. K. Harding

Bibliographic Details