US4715115A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for water-scale semiconductor devices
Assignee: HP Inc
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Filing: 1986-04-03
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Granted: 1987-12-29
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Expires: 2006-04-03
Abstract
Abstract The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.
Inventors
- 👤 Michael O. King
- 👤 Marvin S. Keshner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:06
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
114 words
An apparatus for packaging a wafer comprising: a substrate for supporting the wafer; a viscous or semi-viscous fluid means for providing surface tension between the wafer and the substrate to restrict the wafer's motion in a direction perpendicular to the plane of the substrate; a means mounted to the wafer for loosely clamping the wafer to the substrate for restricting the wafer's motion in a direction parallel to the plane of the substrate; a cover attached to the substrate for shielding the wafer; and an elastic means for restricting the wafer's motion in a direction perpendicular to the plane of the substrate wherein the elastic means is located between the wafer and the cover.
Claim 2
Independent Claim
114 words
An apparatus for packaging a wafer comprising: a substrate for supporting the wafer; a viscous or semi-viscous fluid means for providing surface tension between the wafer and the substrate to restrict the wafer's motion in a direction perpendicular to the plane of the substrate; a means mounted to the wafer for loosely clamping the wafer to the substrate for restricting the wafer's motion in a direction parallel to the plane of the substrate; a cover attached to the substrate for shielding the wafer; and an elastic means for restricting the wafer's motion in a direction perpendicular to the plane of the substrate wherein the elastic means is located between the wafer and the cover.
Claim 3
Dependent Claim
19 words
An apparatus as in claim 1 wherein the means mounted to the wafer makes electrical connections with the wafer.
Claim 4
Dependent Claim
21 words
An apparatus as in claim 1 wherein the means mounted to the wafer is is a clamp attached to the substrate.
Claim 5
Dependent Claim
18 words
An apparatus as in claim 1 wherein the fluid means conducts heat from the wafer to the substrate.
Claim 6
Dependent Claim
16 words
An apparatus as in claim 1 wherein the elastic means applies a force to the wafer.
Claim 7
Dependent Claim
15 words
An apparatus as in claim 1 wherein the elastic means is a low density foam.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-28 | 1991-06-29 | 1991-12-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-28 | 1995-06-29 | 1995-12-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-28 | 1999-06-29 | 1999-12-29 | $7700.00 | Window Closed / Lapsed |