US5063434A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic molded type power semiconductor device
Assignee: Toshiba Corp
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Filing: 1990-09-18
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Granted: 1991-11-05
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Expires: 2010-09-18
Abstract
Abstract According to this invention, a semiconductor chip incorporating a power control element is mounted on a heat dissipation member by a conductive solder, and lead members electrically connected to terminals extending from the semiconductor chip are arranged to have a surface level almost equal to that of the heat dissipation member. A main body structure including the semiconductor chip and the members is sealed by a sealing plastic body. A plastic table integrated with the sealing plastic body projects and is formed at a position corresponding to a lower side of outer leads which extends from the heat dissipation and lead members and is extracted from the sealing plastic body, and the outer leads are bent upward at a position corresponding to a position of the plastic table. The sealing plastic body is mounted on an external mounting member having a heat dissipation function.
Inventors
- 👤 Takao Emoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:04
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/131; H10W40/00; H10W40/10; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/481; H10W90/00; H10W90/811; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
181 words
A plastic molded type power semiconductor device comprising: a heat dissipation member of a metal having heat conductivity: a semiconductor chip, mounted on the heat dissipation member so as to conduct heat to the heat dissipation member, the semiconductor chip including a heat generating semiconductor element, and terminals; lead members, each electrically connected to one of the terminals; a sealing plastic body including a side surface, a lower surface, and a main body disposed around the heat dissipation member, the semiconductor chip, and the lead members, the main body including a plastic sealing material; outer leads, each connected to a respective one of the lead members, each outer lead including a first outer lead portion, and a second outer lead portion extending from the main body; and a plastic table integrated with the sealing plastic body, extending from the side surface of the sealing plastic body main body and contacting the outer leads, wherein the second outer lead portions are vertically removed from the plastic table and bent in a direction away from the lower surface of the sealing plastic body.
Claim 2
Dependent Claim
181 words
A plastic molded type power semiconductor device comprising: a heat dissipation member of a metal having heat conductivity: a semiconductor chip, mounted on the heat dissipation member so as to conduct heat to the heat dissipation member, the semiconductor chip including a heat generating semiconductor element, and terminals; lead members, each electrically connected to one of the terminals; a sealing plastic body including a side surface, a lower surface, and a main body disposed around the heat dissipation member, the semiconductor chip, and the lead members, the main body including a plastic sealing material; outer leads, each connected to a respective one of the lead members, each outer lead including a first outer lead portion, and a second outer lead portion extending from the main body; and a plastic table integrated with the sealing plastic body, extending from the side surface of the sealing plastic body main body and contacting the outer leads, wherein the second outer lead portions are vertically removed from the plastic table and bent in a direction away from the lower surface of the sealing plastic body.
Claim 3
Dependent Claim
84 words
A device according to claim 1, wherein said heat dissipation member is electrically connected to an electrode on the lower surface of said semiconductor chip, and an integral outer lead is integrally connected to said heat dissipation member with a lead member, wherein said plastic table is on a lower surface of said integral outer lead, and said integral outer lead is bent at a position corresponding to said plastic table in a direction to separate said integral outer lead from said support table.
Claim 4
Dependent Claim
22 words
A device according to claim 1, wherein said outer leads are bent at a position inward an end of said plastic table.
Claim 5
Dependent Claim
49 words
A device according to claim 1, wherein each outer lead includes a lower surface, and the device further includes a support table constituted by a convex portion of the plastic material and integrated with said plastic table while said support table contacts the lower surfaces of said outer leads.
Claim 6
Dependent Claim
43 words
A device according to claim 4, wherein said support table is formed and processed together with said sealing plastic body and said plastic table while said support table contacts said outer leads, and then said outer leads are peeled from said support table.
Claim 7
Dependent Claim
42 words
A device according to claim 1, wherein said heat dissipation member is electrically connected to an electrode on the lower surface of said semiconductor chip, and an integral outer lead is integrally connected to said heat dissipation member with a lead member.
Claim 8
Dependent Claim
47 words
A device according to claim 6, wherein said plastic table on a lower surface of said integral outer lead, and said integral outer lead is bent at a position corresponding to said plastic table in a direction to separate said integral outer lead from said support table.
Claim 9
Dependent Claim
24 words
A device according to claim 1 or 7, wherein trenches are formed in said plastic table along two sides of said outer leads respectively.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-11-04 | 1995-05-06 | 1995-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-11-04 | 1999-05-06 | 1999-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-11-04 | 2003-05-06 | 2003-11-05 | $7700.00 | Window Closed / Lapsed |