Semiconductor device sealed up with resin

Abstract

Abstract PURPOSE:To avoid strain concentration to the jointed part of a lead and prevent it from becoming defective, by protruding the lower part of the lead fitting portion of a resin package along the bending shape of the lead. CONSTITUTION:A projection 8 is made under the lead fitting portion of a resin package 1. A lead is bent along the projection 8. When the lead is thrusted by an upper mold, stress does not concentrate to the jointed part of the lead because of the projection. At that time, the lead is bent along the corner of the projection. It is effective to slightly round the corner of the projection at R. This results in preventing the cracking of the resin package, the breake of a pin, the cracking of the lead, etc.

Inventors

• 👤 Koichi Kiyozuka

Bibliographic Details