US5089879A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin seal type semiconductor device
Assignee: Toshiba Corp
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Filing: 1991-03-11
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Granted: 1992-02-18
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Expires: 2011-03-11
Abstract
Abstract A resin seal type semiconductor device comprises a lead frame having a support and a plurality of leads, a semiconductor chip mounted on the die support and having a plurality of pads connected to the leads. Furthermore, the device has a wire lead arranged above the semiconductor chip. For example, power source is supplied from the lead supplying power source to one of the pads receiving power source, by connecting the lead and the one pad. Furthermore, power source is supplied from the lead to another pad located far from the one pad by connecting the lead and the another pad through the wire lead.
Inventors
- 👤 Kazuichi Komenaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:04
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/411; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
83 words
A resin seal type semiconductor device comprising: a lead frame having a die support on the central portion of the lead frame and a plurality of leads arranged on the outer side of the die support; a semiconductor chip mounted on the die support and having a plurality of pads connected to the leads; a wire lead arranged above the semiconductor chip and connecting the leads and the pads; and mold resin sealing the lead frame, the semiconductor chip, and the wire lead.
Claim 2
Dependent Claim
83 words
A resin seal type semiconductor device comprising: a lead frame having a die support on the central portion of the lead frame and a plurality of leads arranged on the outer side of the die support; a semiconductor chip mounted on the die support and having a plurality of pads connected to the leads; a wire lead arranged above the semiconductor chip and connecting the leads and the pads; and mold resin sealing the lead frame, the semiconductor chip, and the wire lead.
Claim 3
Dependent Claim
37 words
The device as claimed in claim 1, wherein the lead frame consists of a bed frame having the die support, and a wire frame laid on the bed frame and having the leads and the wire lead.
Claim 4
Dependent Claim
30 words
The device as claimed in claim 1, wherein the wire lead connects one lead supplying power source and more than two pads located opposite each other and receiving power source.
Claim 5
Dependent Claim
28 words
The device as claimed in claim 1, wherein the wire lead connects one lead supplying signals and more than two pads located opposite each other and receiving signals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-17 | 1995-08-19 | 1996-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-17 | 1999-08-19 | 2000-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-17 | 2003-08-19 | 2004-02-18 | $7700.00 | Window Closed / Lapsed |